• 한국음향학회지
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• 제39권6호
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• pp.600-605
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• 2020

본 논문에서는 청각 장애인을 위한 소리 감지 홈 모니터링을 위해 다채널 다중 스케일 신경망을 사용한 사운드 이벤트 검출 방식을 제안한다. 제안하는 시스템에서는 홈 내의 여러 무선 마이크 센서들로부터 높은 신호 품질을 갖는 두 개의 채널을 선택하고, 그 신호들로부터 도착신호 지연시간, 피치 범위, 그리고 다중 스케일 합성 곱 신경망을 로그멜 스펙트로그램에 적용하여 추출한 특징들을 양방향 게이트 순환 신경망 기반의 분류기에 적용함으로써 사운드 이벤트 검출의 성능을 더욱 향상시킨다. 검출된 사운드 이벤트 결과는 선택된 채널의 센서 위치와 함께 텍스트로 변환되어 청각 장애인에게 제공된다. 실험결과는 제안한 시스템의 사운드 이벤트 검출 방식이 기존 방식보다 우수하며 청각 장애인에게 효과적으로 사운드 정보를 전달할 수 있음을 보인다.

• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.37-46
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• 2015

본 논문에서는 PCB용 카본 CCL의 열전달 특성을 실험과 수치해석을 통해 연구하였는데 카본 CCL의 특성 연구를 위해 기존 FR-4 코어와 Heavy copper 코어를 적용한 PCB를 비교하였다. 열전달특성 분석을 위해 코어는 한 개와 두 개가 적용된 HDI PCB 샘플이 제작되었고, 카본코어는 Pan grade와 pitch grade의 2종이 적용되었으며, 코어 두께에 의한 열전달 특성도 평가되었다. 연구결과에 의하면 카본 코어의 열전달 특성은 heavy copper 코어보다는 낮으나 FR-4 코어보다는 우수하였다. 또한, 카본 코어와 heavy copper 코어는 두께가 증가할수록 열전달 특성이 높아졌으나 FR-4 코어는 두께가 증가할수록 열전달 특성이 낮아졌다. heavy copper 코어 적용시 드릴마모도 증가, 무게 증가, 전기절연성 확보를 위한 절연재의 추가로 원가상승을 고려할 때 카본 코어가 PCB의 열전달 특성 향상을 위한 대안이 될 것으로 판단된다.

• 한국표면공학회지
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• 제50권3호
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• pp.170-176
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• 2017

EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and gold layers formed by EPIG process were uniform with thickness of 125 nm and 34.5 nm, respectively. EPAG (Electroless Pd/autocatalytic Au) also produced even layers of palladium and gold with the thickness of 115 nm and 100 nm. TEM results exhibited that the gold layer in EPIG surface had crystalline structure while the palladium layer was amorphous one. After annealing at 250 nm, XPS analysis indicated that the palladium layer with thickness more than 22~33 nm could act as a diffusion barrier of copper interconnects. As a result of comparing the chip shear strength obtained from ENIG and EPIG surfaces, it was confirmed that the bonding strength was similar each other as 12.337 kg and 12.330 kg, respectively.

• 대한기계학회논문집B
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• 제27권8호
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• pp.1174-1181
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• 2003

The flow around a circular cylinder was controlled by attaching O-rings to reduce drag force acting on the cylinder. Four experimental models were tested in this study; one smooth cylinder of diameter D (D=60mm) and three cylinders fitted with O-rings of diameters d=0.0167 D, 0.05D and 0.067 D with pitches of PPD=2D, 1D, 0.5D and 0.25D. The drag force, mean velocity and turbulence Intensity profiles in the near wake behind the cylinders were measured for Reynolds numbers based on the cylinder diameter in the range of Re$_{D}$=7.8$\times$10$^3$~1.2$\times$10$^{5}$ . At Re$_{D}$=1.2$\times$10$^{5}$ , the cylinder fitted with O-rings of d=0.0167D in a pitch interval of 0.25D shows the maximum drag reduction of about 5.4%, compared that with the smooth cylinder. The drag reduction effect of O-rings of d=0.067D is not so high. For O-ring circulars, as the Reynolds number increases, the peak location of turbulence intensity shifts downstream and the peak magnitude is decreased. Flow field around the cylinders was visualized using a smoke-wire technique to see the flow structure qualitatively. The size of vortices and vortex formation region formed behind the O-ring cylinders are smaller, compared with the smooth cylinder.der.

• 대한기계학회논문집B
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• 제30권2호
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• pp.126-135
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• 2006

The pressure drop characteristics in a rotating two-pass duct with rib turbulators are investigated in the present study. The square duct has a hydraulic diameter $(D_h)$ of 26.7 mm, and $1.5mm{\times}1.5mm$ square $90^{\circ}-rib$ turbulators are attached on the leading and trailing walls. The pitch-to-rib height ratio (p/e) is 10. The distance between the tip of the divider and the outer wall of the duct is $1.0D_h$ and the width of divider wall is 6.0mm or $0.225D_h$. The Reynolds number (Re) based on the hydraulic diameter is kept constant at 10,000 to exclude the Reynolds effect, and the rotation number (Ro) is varied from 0.0 to 0.20. The pressure drop distribution, the friction factor and thermal performance are presented for the leading, trailing and the outer surfaces. It is found that the curvature of the $180^{\circ}$-turn produces Dean vortices that cause high pressure drop in the turn. The channel rotation results in pressure drop discrepancy between leading and trailing surfaces so that non-dimensional pressure drops are higher on the trailing surface in the first-pass and on the leading and side surfaces in the second-pass. In the turning region, Dean vortices shown in the stationary case transform into one large asymmetric vortex cell, and subsequent pressure drop characteristics also change. As the rotation number increases, the pressure drop discrepancy enlarges.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권2호
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• pp.125-131
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• 2001

When the program voltage is applied to a word line, a part of the boosted channel charge in inhibited bit lines is lost due to the coupling between the string select line (SSL) and the adjacent word line. This phenomenon causes the program disturbance in the cells connected to the inhibited bit lines. This program disturbance becomes more serious, as the word line pitch is decreased. To reduce the word line coupling, the rising edge of the word-line voltage waveform was changed from a pulse step into a ramp waveform with a controlled slope. The word-line ramping circuit was composed of a timer, a decoder, a 8 b D/A converter, a comparator, and a high voltage switch pump (HVSP). The ramping voltage was generated by using a stepping waveform. The rising time and the stepping number of the word-line voltage for programming were set to $\mutextrm{m}-$ and 8, respectively,. The ramping circuit was used in a 512Mb NAND flash memory fabricated with a $0.15-\mutextrm{m}$ CMOS technology, reducing the SSL coupling voltage from 1.4V into a value below 0.4V.

• 한국항공우주학회지
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• 제41권3호
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• pp.217-225
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• 2013

통상적인 쿼드로터 항공기는 네 개 로터의 회전 속도에 의한 추력 벡터의 크기를 조절하여 자세를 제어한다. 본 연구에서는 기존에 개발된 쿼드로터 항공기의 단점을 개선하기 위해서 사이클릭 피치 제어가 가능한 쿼드로터 항공기를 설계하였다. 콜렉티브와 사이클릭 제어를 사용하는 쿼드로터 항공기는 각 로터의 회전속도를 모두 동일하게 유지함으로써 진동에 의한 구조적인 문제를 해소할 수 있으며, 12개의 자유도를 가지므로 다양한 자세에서의 비행이 가능하기 때문에 자동 비행과 실용적 임무가 가능한 고성능 항공기로서 적합하다. 본 연구에서 개발하는 쿼드로터 항공기의 모델링은 FLIGHTLAB을 이용하여 비선형 모델을 구성하였으며, 각 비행 조건에서의 선형 모델을 이용하여 LQR 제어기 설계 및 비선형 시뮬레이션을 통해 제어기의 성능을 검증하였다. 본 논문은 사이클릭 피치 제어가 가능한 쿼드로터의 모델링 및 시뮬레이션 결과를 보여준다.

• 한국정밀공학회지
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• 제18권7호
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• pp.98-105
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• 2001

The machining accuracy is affected by geometric, volumetric errors of the machine tools. To improve the product quality, we need to enhance the machining accuracy of the machine tools. To this point of view, measurement and inspection of finished part as error analysis of machine tools ahas been studied for last several decades. This paper suggests the enhancement method of machining accuracy for precision machining of high quality metal reflection mirror or optics lens, etc. In this paper, we study 1) the compensation of linear pitch error with NC controller compensation function using laser interferometer measurement, 2) the method for enhancing the accuracy of NC milling machining by modeling and compensation of volumetric error, 3) the spherical surface manufacturing by modeling and compensation of volumetric error of the machine tool, 4) the system development of OMM without detaching work piece from a bed of machine tool after working, 5) the generation of the finished part profile by OMM. Furthermore, the output of OMM is compared with that of CMM, and verified the feasibility of the measurement system.

• 한국정보통신학회논문지
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• 제16권4호
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• pp.759-764
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• 2012

고밀도집적을 위하여 전기도금과 무전해도금법을 적용하여 구리기둥주석범프(CPTB)를 제작하고, 그 특성을 분석하였다. CPTB는 ${\sim}100{\mu}m$의 피치를 갖도록 KM-1250 건식감광필름(DFR)을 사용하여 먼저 구리기둥범프(CPB)를 도금 전착시킨 다음, 구리의 산화억제를 위하여 그 위에 주석을 무전해 도금하였다. 열-압력에 따른 산화효과와 접합특성을 위하여 전기저항계수와 기계적 층밀림 전단강도를 측정하였다. 전기저항계수는 산화두께의 증가에 따라서 증가하였고, 전단강도는 $330^{\circ}C$에서 500 N의 열-압력일 때 최고치를 나타냈다. 시뮬레이션 결과에 따르면, CPTB는 시간이 경과됨에 따라 통전면적의 크기 감소의 결과를 나타냈으며, 그것은 구리의 산화에 의해 크게 영향을 받는 것으로 확인되었다.

• 한국전기전자재료학회논문지
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• 제23권6호
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• pp.481-486
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• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.