A Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer |
Shin, An-Seob
(Busan R&D Center, Samsung Electro-Mechanics Co., LTD.)
Ok, Dae-Yool (Busan R&D Center, Samsung Electro-Mechanics Co., LTD.) Jeong, Gi-Ho (Busan R&D Center, Samsung Electro-Mechanics Co., LTD.) Kim, Min-Ju (Busan R&D Center, Samsung Electro-Mechanics Co., LTD.) Park, Chang-Sik (Busan R&D Center, Samsung Electro-Mechanics Co., LTD.) Kong, Jin-Ho (Busan R&D Center, Samsung Electro-Mechanics Co., LTD.) Heo, Cheol-Ho (Busan R&D Center, Samsung Electro-Mechanics Co., LTD.) |
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