• Journal of Korea Multimedia Society
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• v.11 no.4
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• pp.504-515
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• 2008

Fast transmission speeds and various wired network services have been combined with the convenience and mobility of wireless services. The combination of wired/wireless technologies is spreading rapidly since it enables the creation of new services and provides new features to both users and service providers. In such wired/wireless integrated services, network integration is very important because such systems are integrated by a linkage between heterogeneous networks and they involve an integration of transmission technologies across networks. In this situation, existing security and communication technologies are unsuitable since the network are integrated with heterogeneous networks. The network may also have several security flaws. In existing homogeneous networks, user authentication and key management between heterogeneous networks are required for these new technologies. The establishment of security technologies for heterogeneous devices is a very important task between homogeneous networks. In this paper, we propose a secure and efficient key management system for a heterogeneous network environment. Our system provides secure communications between heterogeneous network devices.

• Transactions on Electrical and Electronic Materials
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• v.11 no.6
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• pp.243-248
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• 2010

The emergence of different and disparate materials together with the convergence of both the 'old' and 'emerging' technologies is paving the way for integration of heterogeneous technologies that are likely to extend the limitations of silicon technology beyond the roadmap envisaged for complementary metal-oxide semiconductor. Formulation of new information processing concepts based on novel aspects of nano-scale based materials is the catalyst for new nanoarchitectures driven by a different perspective in realization of novel logic devices. The memory technology has been the pace setter for silicon scaling and thus far has pave the way for new architectures. This paper provides an overview of the inevitability of heterogeneous integration of technologies that are in their infancy through initiatives of material physicists, computational chemists, and bioengineers and explores the options in the spectrum of novel non-volatile memory technologies considered as forerunner of new logic devices.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• Proceedings of the KSR Conference
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• 2009.05a
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• pp.1993-1998
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• 2009

Recently, with expansion and advent of the wire&wireless networks has been set up by various heterogeneous networks in urban transit networks. It's focussing on an interworking technology. As same as way, In a subway & railway monitoring system networks has been set up by various heterogeneous technologies such as IEEE802.11 WLAN, IEEE802.15 WPAN, DVBT, UWB, BinaryCDMA, ZigBee. These heterogeneous technologies is deeply investigating for the purpose of interworking and easy control as a research area. In this paper, we propose using VoiceXML based of XML for ensure interworking within heterogeneous subway & railway networks. Therefore It will be provide service for staff who has moving and anywhere, anytime in outside. Eventually, we expect that confirm efficiency of effective system through this study.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.3
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• pp.133-139
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• 2007

Future MEMS systems will be composed of larger varieties of devices with very different functionality such as electronics, mechanics, optics and bio-chemistry. Integration technology of heterogeneous devices must be developed. This article first deals with the current development trend of new fabrication technologies; those include self-assembling of parts over a large area, wafer-scale encapsulation by wafer-bonding, nano imprinting, and roll-to-roll printing. In the latter half of the article, the concept towards the heterogeneous integration of devices and functionality into micro/nano systems is described. The key idea is to combine the conventional top-down technologies and the novel bottom-up technologies for building nano systems. A simple example is the carbon nano tube interconnection that is grown in the via-hole of a VLSI chip. In the laboratory level, the position-specific self-assembly of nano parts on a DNA template was demonstrated through hybridization of probe DNA segments attached to the parts. Also, bio molecular motors were incorporated in a micro fluidic system and utilized as a nano actuator for transporting objects in the channel.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.3
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• pp.241-252
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• 2024

With the recent development of emerging technologies, information acquisition and delivery between users has been actively conducted, and inorganic thin film transfer technology that effectively transfers various materials and devices is being studied to develop flexible electronic devices accordingly. This is aimed at innovative structural changes and functional improvement of electronic devices in the era of the Internet of Things (IoT). In particular, advanced technologies such as microLEDs are used to realize high-resolution flexible displays, and the possibility of heterogeneous integrated technologies can be presented by precisely transferring materials to substrates through various transfer process. This paper introduced physical, chemical, and self-assembly transfer methods based on inorganic thin film materials to implement heterogeneous integrated flexible semiconductor systems and introduces the results of application studies of semiconductor devices obtained through different transfer technologies. These studies are expected to bring about innovative changes in the field of smart devices, medical technology, and user interfaces in the future.

• The KIPS Transactions:PartC
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• v.15C no.6
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• pp.481-492
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• 2008

With the advancement of the Internet and networks, the combination of wired/wireless technologies is spreading rapidly since it enables the creation of new services and provides new features to both users and service providers. In such wired/wireless integrated services, network integration is very important because such systems are integrated by a linkage between heterogeneous networks and they involve an integration of transmission technologies across networks. In this situation, existing security and communication technologies are unsuitable since the network are integrated with heterogeneous networks. The network may also have several security vulnerability. Also, form of service that users offer will be service for roaming user. In these service, we must provide fast authentication and security at roaming. Therefore in this paper we proposed roaming and AAA mechanism in heterogeneous network environment. Our system provides secure communication and efficiency.

• Journal of the Korean Society of Industry Convergence
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• v.22 no.2
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• pp.201-208
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• 2019

Since the introduction of the open innovation at the beginning of the 2000s, various studies have been carried out on the convergence of technologies, such as the development of new technologies and the development of the business domain. while exploring the technologies necessary for the convergence of appropriate technologies in this research, we propose a discovery process of challengeable research areas by means of the integration of heterogeneous fields which are based on the strategic formulation of ICT and chemical safety industry. In this paper, we consequently propose the 103 detailed convergent technologies based on ICT, especially including artificial intelligent technology and smart big-data platform architecture, were derived from the research areas of the chemical safety field, We expect that research related to the safety field will be frustrated in the future.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.6 no.9
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• pp.2118-2135
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• 2012

With the rapid development of heterogeneous emerging wireless technologies and numerous types of mobile devices, the need to support robust mobile video streaming based on the seamless handover in Future Internet is growing. To support the seamless handover, several IP-based mobility management protocols such as Mobile IPv6 (MIPv6), fast handover for the MIPv6 (FMIPv6), Hierarchical MIPv6 (HMIPv6) and Proxy Mobile IPv6 (PMIPv6) were developed. However, MIPv6 depreciates the Quality-of-Service (QoS) and FMIPv6 is not robust for the video services in heterogeneous emerging wireless networks when the Mobile Node (MN) may move to another visited network in contrast with its anticipation. In Future Internet, the possibility of mobile video service failure is more increased because mobile users consisting of multiple wireless network interfaces (WNICs) can frequently change the access networks according to their mobility in heterogeneous wireless access networks such as 3Generation (3G), Wireless Fidelity (Wi-Fi), Worldwide Interoperability for Microwave Access (WiMax) and Bluetooth co-existed. And in this environment, seamless mobility is coupled according to user preferences, enabling mobile users to be "Always Best Connected" (ABC) so that Quality of Experience is optimised and maintained. Even though HMIPv6 and PMIPv6 are proposed for the location management, handover latency enhancement, they still have limit of local mobility region. In this paper, we propose a robust mobile video streaming in Heterogeneous Emerging Wireless Systems. In the proposed scheme, the MN selects the best-according to an appropriate metric-wireless technology for a robust video streaming service among all wireless technologies by reducing the handover latency and initiation time when handover may fail. Through performance evaluation, we show that our scheme provides more robust mechanism than other schemes.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.