• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2007.04a
• /
• pp.129-146
• /
• 2007

[ ${\square}$ ] A mathematical model has been developed and used to analyze the limits of He fine leak test. ${\square}$ Uncertainties inherent in using the MIL-STD-883 guidelines for hermeticity evaluation of small packages have been demonstrated. ${\square}$ A new methodology to quantitatively characterize hermeticity has been developed.

• Journal of Sensor Science and Technology
• /
• v.13 no.4
• /
• pp.287-291
• /
• 2004

A capacitive type humidity sensor has been fabricated using a polyimide film without hydrophobic elements and its characteristics has been evaluated for hermeticity measurement of micro packages. For a highly sensitive humidity sensor, a polyimide film without hydrophobic elements has been synthesized and used instead of using a commercial one in which 7 group elements such as fluorine or chlorine are included. Sensitivity, stability and hysteresis has been performed to characterize the fabricated sensors. The sensitivity defined as normalized percent capacitance change was 0.3751%RH and hysteresis was 0.77% in the range of 10%RH to 90%RH. Maximum deviation from the average capacitance measured for 120 minutes at 50%RH was 0.25%. The proposed humidity sensor can be used for hermeticity measurement of micro packages.

• Journal of Sensor Science and Technology
• /
• v.24 no.5
• /
• pp.287-290
• /
• 2015

Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.50 no.1
• /
• pp.37-40
• /
• 2001

New package process for PDP was proposed based on the glass-to-glass vacuum-electrostatic bonding process and tubeless packaging concept derived from the previous study. Hermeticity and operating performance of PDP test panel through the seal-off process application and the possibility for practical use might be high if the process simplicity and productivity-related effort was sequentially carried out.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.6
• /
• pp.541-545
• /
• 2007

The critical current degradation behaviors of multifilamentary Bi-2223 superconducting tapes under pressurized liquid nitrogen were investigated using a r-shaped sample holder which gives a series of bending strains to tape. Three kinds of externally-reinforced Bi-2223 tapes with different hermeticity were used as samples. The tape with the thicker reinforcement layer had a better bending strain tolerance of $I_c$, but when the bending strain was calculated at the outermost filament, the $I_c$ degradation behavior became identical. For all samples, $I_{c0}$ decreased with the increase of applied pressure, but the $I_c$ degradation behavior with bending strain at each pressure level was similar. Furthermore, after depressurization from 1 MPa to atmospheric pressure, $I_c$ was completely recovered to its initial values. When the samples were warmed up to room temperature after pressurization tests, the ballooning damage occurred at lower bending strain regions. The region where ballooning was observed was identical to the one where the significant $I_c$ degradation occurred.

• Journal of the Semiconductor & Display Technology
• /
• v.3 no.3
• /
• pp.5-9
• /
• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.11a
• /
• pp.239-242
• /
• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2006.11a
• /
• pp.21-24
• /
• 2006

Based on the improvement in reinforcing SiC fibers and the utilization of very fine nano-SiC powders, the well known liquid phase sintering (LPS) process was drastically improved to become a new process called the Nano Infiltration and Transient Eutectic Phase (NITE) Process. Laboratory scale NITE-SiC/SiC composites demonstrated excellent mechanical properties, thermal conductivity, hermeticity and microstructure stability which made them attractive for not only energy application but many other industrial applications. For the real deployments of these materials, mass production system and evaluation methods, together with the design code and safety assurance systems are essential. The current efforts to establish these bases were introduced.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.4 no.2
• /
• pp.128-132
• /
• 2004

This paper presents the design, fabrication sequence and measurement results of a highly sensitive capacitive-type humidity sensor using a polyimide film without hydrophobic elements. The structure of the humidity sensor is MIM (metalinsulator-metal). For a high sensitivity, a modified aromatic polyimides as a moisture absorbing layer has been synthesized instead of using general polyimides containing hydrophobic elements. The polyimide film was obtained by synthesizing and thermally polymerizing polyamic acid composed of m-pyromellitic dianhydride, phenelenediamine and dimethylacetamide. Characteristics of fabricated sensors which include sensitivity, hysteresis and stability have been measured. The measurement result shows the percent normalized capacitance change of 0.37/%RH over a range from 10 to 90%RH, hysteresis of 0.77% over the same %RH range and maximum drift of 0.25% at 50%RH. The result shows that the developed humidity sensor can be applied to evaluate a hermeticity of various sensors and actuator systems as well as micro packages.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2004.05a
• /
• pp.112-117
• /
• 2004

본 연구에서는 쏠더를 이용한 새로운 웨이퍼 레벨 실장 기술을 제안하였고 순수 주석도금이 쏠더로서 이용되었다. 제안된 실장 기술의 가장 큰 차별성은 레고 조립처럼 어셈블리 한 후에 쏠더 리프로우를 통해 측면 접합한다는 것이다. 이런 측면 접합 기술은 기본적으로 표면 상태에 매우 둔감하다는 장점과 비아를 통한 전기적 연결 시 끝 단의 노칭(notching)에 의한 전기적 연결 끊김 문제를 해결할 수 있다. 접합강도는 전단 응력을 측정하여 평가하였고, 실장의 기밀성(Hermeticity)는 가압 헬륨 측정법을 통해서 평가되었다. 실험결과로부터 본 실장 기술은 고 수율 웨이퍼 레벨 실장 기술의 대안이며 실행 가능함을 확인할 수 있었다.