한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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- Pages.129-146
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- 2007
Hermeticity and Reliability Issues in Microsystems Packaging
- 함석진 (삼성종합기술원) ;
- ;
- Ham, Suk-Jin (Packaging Project Team Micro Devices and Systems Lab. Samsung Advanced Institute of Technology) ;
- Kim, Woon-Bae (Packaging Project Team Micro Devices and Systems Lab. Samsung Advanced Institute of Technology) ;
- Moon, Chang-Youl (Packaging Project Team Micro Devices and Systems Lab. Samsung Advanced Institute of Technology)
- 발행 : 2007.04.04
초록
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