• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1189-1194
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• 2004

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. For the various types of microchannel heat sink having different size of fin width and channel width, experimental study is conducted. Through the experiment, the tip clearance effect is investigated by increasing tip clearance from zero. As a result, it is shown that cooling performance of heat sink with tip clearance is better than that of heat sink without tip clearance. For the microchannel heat sink with tip clearance, the optimum conditions for cooling performance is also studied.

• 반도체디스플레이기술학회지
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• 제15권3호
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• pp.12-17
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• 2016

In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.3524-3528
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• 2007

In this study, the Peltier effect was applied to eliminate moistures in the air enclosed by a cabinet. We have developed the new electronic dehumidifier which has a new function of automatically evaporating the condensed water inner cabinet into the outside air. To obtain this function, the processes of dehumidification is that it condensed the moistures on the cold side heat sink and drained it into the hot side heat sink by the both gravitational and capillary forces and the droplets on the hot side heat sink surface was evaporated into the air outside the cabinet by the heat conducted through the hot side heat sink surface and the forced heat convection through the fan for cooling hot side heat sink. Compared to existing electronic dehumidifiers, this manufactured one showed a good performance that the electric power consumption for the same dehumidifying quantity was reduced by 50% compared with that of existing ones.

• 한국초전도ㆍ저온공학회논문지
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• 제19권4호
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• pp.18-21
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• 2017

We report a method for improving heat exchange between cryo-cooled large-power-dissipation devices and liquid cryogen. Micro-machined monolithic heat sinks were fabricated on a high integration density superconducting Josephson device, and studied for their effect on cooling the device. The monolithic heat sink showed a significant enhancement of cooling capability, which markedly improved the device operation under large dc- and microwave power dissipation. The detailed mechanism of the enhancement still needs further modeling and experiments in order to optimize the design of the heat sink.

• 한국산학기술학회논문지
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• 제13권5호
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• pp.2002-2008
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• 2012

최근 들어 전자제품 소형화로 인한 방열의 중요성이 대두되고 있는 가운데 다양한 소재의 히트싱크가 사용되고 있다. 본 연구에서는 태양광에너지 소재산업에서 발생하는 슬러리로부터 SiC를 성공적으로 분리하여 다공성 세라믹 히트싱크를 개발하였고 알루미늄 히트싱크, 순수 SiC 히트싱크와 방열성능 비교실험을 통해 다공성 재생 SiC 세라믹 히트싱크의 방열성능을 검증하였다. 실험 결과, 다공성 재생 SiC는 알루미늄 히트싱크 대비 방열성능이 우수함을 확인하였는데 이는 미세기공으로 인한 전열면적 증가에 기인한다. 또한, 수치해석을 사용하여 미세기공이 방열성능에 미치는 영향을 대류열전달계수 증가로 정량화하였다.

• 한국기계가공학회지
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• 제17권1호
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• pp.138-143
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• 2018

In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1265-1268
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• 2009

In this paper, the effect of a flow barrier and bypass on the cooling performance for a straight fin heat sink is presented. Both side directions and upward direction of bypass are controlled using various ducts which have different width and heights. In addition, a flow barrier is used to control flow toward heat sink. Through experiments, the distance from leading edge of a heat sink to a flow barrier is varied for various bypasses under fixed volume flow rate condition. This study shows possibility to improve cooling performance when bypass and a flow barrier exist.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.421-422
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• 2010

• 한국기계가공학회지
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• 제17권6호
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• pp.117-123
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• 2018

Automotive headlamps have been continuously developed as one of the most important devices for securing the driver's view, and the LED lamps are getting popular in recent years. However, in case of the LED lamps, because the heat generated by the LED lamps are too high, it shorten the product life and lower the LED efficiency. Therefore, this study was investigated the cooling characteristics of the LED lamp heat sink for automobile by forced convection for LED heat generation control. In order to analyze the cooling characteristics of the heat sink, the temperature distribution results were investigated through the experiment and computational analysis under the increase of the air flow velocity, and the convective heat transfer coefficient was obtained. Also, convective heat transfer coefficient was calculated by the theoretical formula under the same condition and compared with experimental and computational results. From the result of this study, as the air flow velocity around the heat sink fins increased, the convective heat transfer coefficient significantly increased, confirming the improvement in the cooling effect.

• 대한기계학회논문집B
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• 제37권1호
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• pp.27-33
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• 2013

제품의 성능 및 신뢰성 향상을 위하여 효과적이고, 적정한 방열장치의 중요성이 지속적으로 부각되고 있다. 현재 가장 널리 쓰이는 방열장치는 알루미늄 압출식 평행핀 형상의 히트싱크(heat sink)로 이의 설계를 위해서는 방열량과 최대 허용온도 등에 대한 목표가 결정되어야 하며, 사용 환경 및 설치 방법에 따른 열전달 계수의 예측이 이루어져야 한다. 본 연구에서는 히트싱크의 베이스가 수직, 수평상태를 유지함에 따라 나타나는 핀 주변의 자연대류 유동 특성을 전산모사 해석을 통해 고찰하였다. 또한, 일반적인 자연대류형 히트싱크를 대상으로 수평 및 수직상태에서의 열적 성능 실험을 수행하였으며, 기존의 연구결과와 비교함으로써 설치방향이 히트싱크 방열성능에 미치는 영향에 대하여 분석하였다. 실험결과 수평상태의 경우는 수직인 경우에 비하여 약 10~15% 열전달 계수의 감소가 발생하였다.