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A Numerical Study on the Effect of Fin-array of Heat-sink on the Cooling Performance of CPU  

Kim, Seong Chan (Dept. of Mechanical & Automotive Engineering, Seoul National University of Science and Technology)
Kim, Keon Kuk (Dept. of Mechanical & Automotive Engineering, Seoul National University of Science and Technology)
Jeon, Byoung Jin (Integrative Cardiovascular Imaging Research Center, Yonsei Cardiovascular Center, College of Medicine, Yonsei University)
Choi, Hyoung Gwon (Dept. of Mechanical & Automotive Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of the Semiconductor & Display Technology / v.15, no.3, 2016 , pp. 12-17 More about this Journal
Abstract
In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.
Keywords
Heat Sink; Heat transfer; Pin heatsink array; The cooling effect;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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