Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Numerical Study on the Effect of Fin-array of Heat-sink on the Cooling Performance of CPU

CPU 히트싱크에서 핀의 배열이 냉각성능에 미치는 영향에 대한 수치해석

  • Kim, Seong Chan (Dept. of Mechanical & Automotive Engineering, Seoul National University of Science and Technology) ;
  • Kim, Keon Kuk (Dept. of Mechanical & Automotive Engineering, Seoul National University of Science and Technology) ;
  • Jeon, Byoung Jin (Integrative Cardiovascular Imaging Research Center, Yonsei Cardiovascular Center, College of Medicine, Yonsei University) ;
  • Choi, Hyoung Gwon (Dept. of Mechanical & Automotive Engineering, Seoul National University of Science and Technology)
  • 김성찬 (서울과학기술대학교 기계자동차공학과) ;
  • 김건국 (서울과학기술대학교 기계자동차공학과) ;
  • 전병진 (연세대학교 의과대학 심장융합영상연구센터) ;
  • 최형권 (서울과학기술대학교 기계자동차공학과)
  • Received : 2016.08.16
  • Accepted : 2016.09.21
  • Published : 2016.09.30
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Abstract

In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.

Keywords

References

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