• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1189-1194
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• 2004

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. For the various types of microchannel heat sink having different size of fin width and channel width, experimental study is conducted. Through the experiment, the tip clearance effect is investigated by increasing tip clearance from zero. As a result, it is shown that cooling performance of heat sink with tip clearance is better than that of heat sink without tip clearance. For the microchannel heat sink with tip clearance, the optimum conditions for cooling performance is also studied.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.12-17
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• 2016

In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.3524-3528
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• 2007

In this study, the Peltier effect was applied to eliminate moistures in the air enclosed by a cabinet. We have developed the new electronic dehumidifier which has a new function of automatically evaporating the condensed water inner cabinet into the outside air. To obtain this function, the processes of dehumidification is that it condensed the moistures on the cold side heat sink and drained it into the hot side heat sink by the both gravitational and capillary forces and the droplets on the hot side heat sink surface was evaporated into the air outside the cabinet by the heat conducted through the hot side heat sink surface and the forced heat convection through the fan for cooling hot side heat sink. Compared to existing electronic dehumidifiers, this manufactured one showed a good performance that the electric power consumption for the same dehumidifying quantity was reduced by 50% compared with that of existing ones.

• Progress in Superconductivity and Cryogenics
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• v.19 no.4
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• pp.18-21
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• 2017

We report a method for improving heat exchange between cryo-cooled large-power-dissipation devices and liquid cryogen. Micro-machined monolithic heat sinks were fabricated on a high integration density superconducting Josephson device, and studied for their effect on cooling the device. The monolithic heat sink showed a significant enhancement of cooling capability, which markedly improved the device operation under large dc- and microwave power dissipation. The detailed mechanism of the enhancement still needs further modeling and experiments in order to optimize the design of the heat sink.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.5
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• pp.2002-2008
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• 2012

In recent years, while the importance of thermal management has been emphasized due to smaller electronic products, various materials have been used as heat sink. In this study, porous ceramic heat sink was developed with SiC, successfully separated from the slurry of SiC occurring in solar energy materials industry and the thermal performance of porous SiC heat sink has been compared with those of aluminum heat sink and pure SiC heat sink through experiment. From the experimental results, it was verified that porous recycled SiC heat sink has better thermal performance than aluminum heat sink since its micropores increase the heat transfer area. In addition, the effect of the micropores on thermal performance has been quantified by increasing convective heat transfer coefficient with numerical analysis.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.138-143
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• 2018

In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1265-1268
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• 2009

In this paper, the effect of a flow barrier and bypass on the cooling performance for a straight fin heat sink is presented. Both side directions and upward direction of bypass are controlled using various ducts which have different width and heights. In addition, a flow barrier is used to control flow toward heat sink. Through experiments, the distance from leading edge of a heat sink to a flow barrier is varied for various bypasses under fixed volume flow rate condition. This study shows possibility to improve cooling performance when bypass and a flow barrier exist.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.421-422
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• 2010

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.117-123
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• 2018

Automotive headlamps have been continuously developed as one of the most important devices for securing the driver's view, and the LED lamps are getting popular in recent years. However, in case of the LED lamps, because the heat generated by the LED lamps are too high, it shorten the product life and lower the LED efficiency. Therefore, this study was investigated the cooling characteristics of the LED lamp heat sink for automobile by forced convection for LED heat generation control. In order to analyze the cooling characteristics of the heat sink, the temperature distribution results were investigated through the experiment and computational analysis under the increase of the air flow velocity, and the convective heat transfer coefficient was obtained. Also, convective heat transfer coefficient was calculated by the theoretical formula under the same condition and compared with experimental and computational results. From the result of this study, as the air flow velocity around the heat sink fins increased, the convective heat transfer coefficient significantly increased, confirming the improvement in the cooling effect.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.27-33
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• 2013

To ensure proper functioning of electrical and mechanical systems, cooling devices are of great importance. A heat sink is the most common cooling device used in many industries such as the semiconductor, electronic instrument, LED lighting, and automotive industries. To design an optimal heat sink, the required surface area for heat radiation should be calculated based on an accurate expectation of the heat flow rate in the target environment. In this study, the convective heat flow characteristics were numerically investigated for a vertically installed typical heat sink and a horizontally installed one in free convection using ANSYS CFX. Comparative experiments were carried out to reveal the quantitative effect of the installation direction on the cooling performance. Moreover, the result was analyzed using the dimensionless correlation with the Nusselt number and Rayleigh number and compared with well-known theories. Finally, it was observed that the cooling performance of the vertically installed heat sink is approximately 10~15% better than that of the one in natural convection.