• Education of Primary School Mathematics
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• v.22 no.1
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• pp.13-27
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• 2019

The use of grid paper in elementary mathematics textbooks is used in numbers and calculations, figures and measurement areas. Among them, it is used most in the figure area. In spite of this utilization, it is necessary to supplement it because it is difficult to revise or supplement the trial and error that often occurs in the course of the course, as the process of using the textbook paper in the actual class. The use of grid paper in elementary mathematics textbooks is used in numbers and calculations, figures and measurement areas. Among them, it is used most in the figure area. In spite of this utilization, it is necessary to supplement it because it is difficult to revise or supplement the trial and error that often occurs in the course of the course, as the process of using the textbook paper in the actual class. In this study, we tried to find out the usability of grid paper boards which can be used more effectively than the grid paper among the teaching aids presented in the 'Development of teaching aids standards for math class' of Korea Foundation for the Advancement of Science & Creativity(2017). A questionnaire survey was conducted on the use of grid paper and grid paper board for teachers who actually use grid paper in elementary mathematics. As a result, we found out the achievement criteria of grid paper board utilization and investigated the study subject which is effective to use grid paper board. In particular, we have identified specific learning topics that are effective in each area and presented specific activities.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.650-654
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• 2011

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.9
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• pp.2221-2226
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• 2009

This paper presents the design of the LED sign board system installed on the exterior of a building and powered by a photovoltaic system. A grid connected photovoltaic system has been designed with the capacity estimate of the load, battery and power. After the luminance and uniformity of LED load has been checked, the sign board and the solar cell modules have been installed. The performance and problems occurred during the field test for the photovoltaic LED sign board system have been analyzed.

• IEMEK Journal of Embedded Systems and Applications
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• v.9 no.2
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• pp.101-107
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• 2014

Mobile robots use an environment map of its workspace to complete the surveillance task. However grid-based maps that are commonly used map format for mobile robot navigation use a large size of memory for accurate representation of environment. In this reason, grid-based maps are not suitable for path planning of mobile robots using embedded board. In this paper, we present the path planning algorithm that produce a secure path rapidly. The proposed approach utilizes a hybrid map that uses less memory than grid map and has same efficiency of a topological map. Experimental results show that the fast path planning uses only 1.5% of the time that a grid map based path planning requires. And the results show a secure path for mobile robot.

• The Transactions of the Korea Information Processing Society
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• v.2 no.4
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• pp.592-602
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• 1995

Non-grid and grid method are used for modeling the routing region of the automatic routing system. In this study, we develop the automatic routing system by mixing the methods of non-grid and grid to improve the speed of routing. Grid method has a demerit which decreases the automatic routing speed because it is required a lot of memory by the limitation of the size of board and grid, although the electrical and physical elements are insufficient on the PCB, But non-grid is spent gurite less memory than grid method by using a shape-based patterns. Therefore, we used the methods of non-grid and grid altogether in this paper, In the former method, it is attributed to the improvement of speed, the latter one is applied only the connection of the failed routing in the former one, and it performs the complete automatic routing. This system was developed with C＋＋language under the Windows NT environment of IBM 486DX2-66 Computer.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.64-69
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• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.524-527
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• 2000

In this paper, we have studied minimization of the burr which occurred after $\mu$-BGA(ball grid array) singulation process, singulation of the multilayer with a pulsed Nd:YAG(266, 532 nm) laser is used to cut the metal layer which doesn't well absorb laser beam. Especially, the photoresist and $N_2$blowing is effective to minimize of the surface demage and burr. In this experiment, the $N_2$ blowing reduces a laser energy loss by debris and suppress a surface oxidation. The SEM(scanning electron microscopes) and non-contact 3D inspector are used to measure cutting line-width and surface demage. The $\mu$-BGA singulation threshold energy is 75.0 J/cm$^2$at 30 ${\mu}{\textrm}{m}$/s scan speed.

• Journal of Power Electronics
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• v.13 no.6
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• pp.1016-1023
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• 2013

Predictive current control offers the potential for achieving more precise current control with a minimum of distortion and harmonic noise. However, the predictive method is difficult to implement and has a greater computational burden. This paper introduces a theoretical analysis and experimental verification for an improved predictive current control technique applied to single phase grid connected voltage source inverters (VSI). The proposed technique has simple calculations. An ATmega1280 microcontroller board is used to implement the proposed technique for a simpler and cheaper control system. To enhance the current performance and to obtain a minimum of current THD, an improved tri-level PWM switching strategy is proposed. The proposed switching strategy uses six operation modes instead of four as in the traditional strategy. Simulation results are presented to demonstrate the system performance with the improved switching strategy and its effect on current performance. The presented experimental results verify that the proposed technique can be implemented using fixed point 8-bit microcontroller to obtain excellent results.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.320-330
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• 2012

In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2007.05a
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• pp.440-445
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• 2007

This paper deals with assessment of risk component for electrical safety and investigation on the spot of computer room in elementary middle high school. The investigation was carried out side by side for floor, outlet, panel board, earth leakage circuit breaker at computer room In order to assess electrical safety at computer room, grounding simulator and power quality monitor have been used. Potential rise has been measured and analyzed for ground rod and grounding grid by using the simulator. Phase and neutral-line current have been monitored in real time. As a consequence, it is desirable for us to install conductive tile at floor of computer room Grounding grid had better than ground rod for electrical safety. Neutral-line current was produced by unbalanced phase current.