Effects of Underfills on the Dynamic Bending Reliability of Ball Grid Array Board Assembly |
Jang, Jae-Won
(Advanced Welding & Joining Technology Center, KITECH)
Bang, Jung-Hwan (Advanced Welding & Joining Technology Center, KITECH) Yoo, Se-Hoon (Advanced Welding & Joining Technology Center, KITECH) Kim, Mok-Soon (School of Materials Science & Engineering, Inha University) Kim, Jun-Ki (Advanced Welding & Joining Technology Center, KITECH) |
1 | Private Communication, p. 4-5, Hi-Tech Korea Co. Ltd., Korea (2011) (in Korean). |
2 | W. Liu, N. -C. Lee, A. Porras, M. Ding, A. Gallagher, A. Huang, S. Chen and J. C. Lee, in Proceedings of IEEE 59th Electronic Components and Technology Conference (San Diego, CA, May 2009) p. 994. DOI : 10.1109/ECTC.2009.5074134. DOI |
3 | M. D. Fitton and J. G. Broughton, Int. J. Adhesion and Adhesives, 25(4), 329 (2005). DOI ScienceOn |
4 | K. E. Min, J. S. Lee, S. Yoo, M. S. Kim and J. K. Kim, Kor. J. Mater. Res., 20(12), 681 (2010) (in Korean). DOI ScienceOn |
5 | J. Rieger, Polymer Test., 20(2), 199 (2001). DOI ScienceOn |
6 | B. J. P. Jansen, K. Y. Tamminga, H. E. H. Meijer and P. J. Lematra, Polymer, 40, 5601 (1999). DOI ScienceOn |
7 | K. Gilleo, Area Array Packaging Process Professional, 1st ed., p. 172-173, McGraw-Hill, USA (2003). |
8 | F. Liu, G. Meng, M. Zhao and J. F. Zhao, Microelectron. Reliab., 49(1), 79 (2009) DOI ScienceOn |
9 | K. Gilleo, Area Array Packaging Process Professional, AUSTRLN ed., p. 20, McGraw-Hill, USA (2003). |
10 | D. T. Hsu, H. K. Kim, F. G. Shi, H. Y. Tong, S. Chungpaiboonpatana, C. Davidson and J. M. Adams, Microelectronics J., 31(4), 271 (2000). DOI ScienceOn |