Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지

Improvement of Interface Adhesionin Ball Grid Array Packages by Plasma Treatment

플라즈마 처리에 의한 BGA 패키지의 계면 접착력 향상

  • Published : 2000.08.01
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Abstract

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

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References

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