Power Integrity and Shielding Effectiveness Modeling of Grid Structured Interconnects on PCBs |
Kwak, Sang-Keun
(Department of Semiconductor Systems Engineering, College of Information and Communication Engineering, Sungkyunkwan University)
Jo, Young-Sic (Department of Semiconductor Systems Engineering, College of Information and Communication Engineering, Sungkyunkwan University) Jo, Jeong-Min (Department of Semiconductor Systems Engineering, College of Information and Communication Engineering, Sungkyunkwan University) Kim, So-Young (Department of Semiconductor Systems Engineering, College of Information and Communication Engineering, Sungkyunkwan University) |
1 | M. L. Crawford, J. L. Workman, and C. L. Thomas, "Expanding the bandwidth of TEM cells for EMC measurements," IEEE Trans. Electromag. Compat., vol. 20, pp. 368-375, 1978. DOI ScienceOn |
2 | G. Selli et al., "Power integrity investigation of BGA footprints by means of the segmentation method," in Proc. 2005 Int. Symp. Electromagn. Compat., pp. 655-659. |
3 | L. Zhang, B. Archambeault, S. Conner, J. L. Knighten, J. Fan, N. W. Smith, R. Alexander, R. E. DuBroff, and J. L. Drewniak, "A circuit approach to model narrow slot structures in a power bus," in Proc. IEEE Int. Symp. Electromagn. Compal., vol.2, pp. 401-406, 2004. |
4 | Jaemin Kim, Woojin Lee, Yujeong Shim, Jongjoo Shim, Kiyeong Kim, Jun So Pak and Joungho Kim, "Chip package hierarchical power distribution network modeling and analysis based on a segmentation method," IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 647-658, Aug. 2010. DOI ScienceOn |
5 | T. Dhane and D. D. Zutter, "Selection of lumped element models for coupled lossy transmission lines," IEEE Trans. Computer-Aided Design, vol.11, pp. 959-967, 1992. |
6 | Aditya Bansal, Bipul C. Paul and Kaushik Roy, "An analytical fringe capacitance model for interconnects using conformal mapping," IEEE Trans. Computer-Aided Design, vol. 25, no. 12, Dec. 2006. |
7 | H. W. Johnson and M. Graham, High-Speed Digital Design - A Hand Book of Black Magic, Englewood cliffs, NJ.: Prentice Hall, 1993, pp.257-258. |
8 | Paul, C. R., Inductance: Loop and Partial, Hoboken, NJ : John Wiley & Sons, 2010, pp. 316-319. |
9 | David M. Pozar, Microwave Engineering 3rd edition, Hoboken, N.J.: Willey, 2005, pp. 183-189. |
10 | M. Swaminanathan et al., Power integrity Modeling and Design for Semiconductors and Systems, Boston, MA: Prentice Hall, 2007. |
11 | H. Ott, Noise Reduction Techniques in Electronic Systems 2nd Edition, John Wiley and Sons, pp. 188-190. |
12 | A. Kaynak, A. Polat, and U. Yilmazer, "Planewave shielding effectiveness studies on conducting polypyrrole," Mater. Res. Bull., 1996, vol. 31 (10), pp. 1195-1206. DOI ScienceOn |
13 | K. Lee and A. Barber, "Modeling and analysis of multichip module power supply planes," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 18, pp. 628-639, 1995. DOI ScienceOn |
14 | Seong-Geun Park, JiSeong Kim, Jong-Gwan Yook, Han-Kyu Park, "Multilayer Power Delivery Network Design for High-speed Microprocessor system," The 53rd Elect. Comp. and Technol. Conf., New Orleans, Louisiana, USA, May 2003. |
15 | L. Smith, T. Roy, and R. Anderson, "Power plane Spice models for frequency and time domains," in Proc. 9th Topical Meeting Elect. Perform. Electron. Packag., pp. 51-54, Oct. 2000. |
16 | T. K. Wang, S .T. Chen, C. W. Tsai, S. M. Wu, J. J. Drewniak, and T. L. Wu, "Modeling noise coupling between package and PCB power/ground planes with an efficient 2D-FDTD/lumped element method," IEEE Trans. Adv. Packag., vol. 30, no. 4, pp. 864-871, Nov. 2007. DOI ScienceOn |
17 | Joong-Ho Kim and Madhavan Swaminathan, "Modeling of irregular shaped power distribution planes using transmission matrix method," IEEE Trans. Adv. Packag., vol. 24, no. 3, pp. 334-346, August 2001. DOI ScienceOn |
18 | C. Wang et al., "An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances," IEEE Trans. Adv. Packag., vol. 29, no. 2, pp. 320-334, May 2006. DOI ScienceOn |
19 | G. T. Lei, R. W. Techentin, and B. K. Gilbert, "High-frequency characterization of power/groundplane structures," IEEE Trans. Microwave Theory Tech., vol. 47, pp. 562 - 569, 1999. DOI ScienceOn |
20 | Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "Convergence acceleration and accuracy improvement in power bus impedance calculation with a fast algorithm using cavity modes," IEEE Trans. Electromagn. Compat., vol. 47, no. 1, pp. 2-9, 2005. DOI ScienceOn |
21 | G. P. Zou , E. P. Li , X. C. Wei , G. X. Lou and X. Cui "A new hybrid field-circuit approach to model the power-ground planes with narrow slot," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 340-345, 2010. DOI ScienceOn |
22 | J. Park , H. Kim , Y. Jeong , J. Kim , J. Pak , D. Kam and J. Kim., "Modeling and measurement of simultaneous switching noise coupling through signal via transition," IEEE Trans. Adv. Packag., vol. 29, p. 548 , 2006. DOI ScienceOn |
23 | I. Novak, "Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination," in Proc. 7th Topical Meeting Elect. Perform. Electron. Packag., pp. 181-184, Oct. 1998. |