• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.21 no.3
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• pp.29-34
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• 2021

For the purpose of Application to the small radar sensor, the MMIC Chips, which are the core component of the W-band, was designed in Korea according to the characteristics of the transceiver and manufactured by 60nm GaN and 0.1㎛ GaAs pHEMT process. The output power of PA is 28 dBm at center frequency of W-band and Noise figure is 6.7 dB of switch and LNA MMIC. Output power and Noise figure of MMIC chips developed in domestic was applied to the transmitter and receiver module through W-band waveguide low loss transition structure design and impedance matching to verify the performance after the fabrication are 26.1~27.7 dBm and 7.85~10.57 dB including thermal testing, and which are close to the analysis result. As a result, these are judged that the PA and Switch and LNA MMICs can be applied to the small radar sensor.

• Journal of IKEEE
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• v.23 no.1
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• pp.181-187
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• 2019

In this paper, we demonstrated a power amplifier monolithic microwave integrated circuit (MMIC) for X-band radar applications. It utilizes commercial $0.25{\mu}m$ GaN-based high electron mobility transistor (HEMT) technology and delivers more than 20 W of output power. The developed GaN-based power amplifier MMIC has small signal gain of over 22 dB and saturated output power of over 43.3 dBm (21.38 W) in a pulse operation mode with pulse width of $200{\mu}s$ and duty cycle of 4% over the entire band of 9 to 10 GHz. The chip dimensions are $3.5mm{\times}2.3mm$, generating the output power density of $2.71W/mm^2$. Its power added efficiency (PAE) is 42.6-50.7% in the frequency bandwidth from 9 to 10 GHz. The developed GaN-based power amplifier MMIC is expected to be applied in a variety of X-band radar applications.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.23 no.1
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• pp.123-129
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• 2023

In this paper, the frequency synthesis(FS) MMIC and the receive MMICs were developed for a Ka-band compact radar. Also a compact Ka-band frequency synthesizer and a receiver were developed based on those MMICs. The FS MMIC and the wireless-receiver(WR) MMIC to receive the baseband frequency were manufactured by a 65 nm CMOS process and the front-end(FE) MMIC to receive the Ka-band frequency was manufactured by a 150 nm GaN process. Linear frequency modulation waveform and pulse waveform for the transmit signal were measured by output signal of frequency synthesizer. The measured performance of developed receiver including the FE MMICs and the WR MMIC were ≧ 80 dB gain, ≦ 6 dB noise figure and ≧ 10 dBm at OP1dB. The measurement results of the developed frequency synthesizer and the receiver including the manufactured MMICs showed that they could be applied to Ka-band compact radar.

• Journal of IKEEE
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• v.23 no.2
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• pp.425-430
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• 2019

This work describes the design and characterization of a X-band power amplifier (PA) monolithic microwave integrated circuit (MMIC) using a $0.25{\mu}m$ gate length gallium nitride (GaN) high electron mobility transistor (HEMT) technology. The developed X-band power amplifier MMIC has small signal gain of over 22.7 dB and saturated output power of 43.02 dBm (20.04 W) over the entire band of 9 to 10 GHz. Maximum saturated output power is a 43.84 dBm (24.21 W) at 9.5 GHz. Its power added efficiency (PAE) is 41.0~51.24% and the chip dimensions are $3.7mm{\times}2.3mm$, generating the output power density of $2.84W/mm^2$. The developed GaN power amplifier MMIC is expected to be applied in a variety of X-band radar applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.12
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• pp.8643-8648
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• 2015

In this paper presents the design and demonstrate 8 W 3-stage HPA(High Power Amplifier) MMIC(Monolithic Microwave Integrated Circuits) for Ka-band down link satellite communications payload system at 19.5 GHz ~ 22 GHz frequency band. The HPA MMIC consist of 3-stage GaN HEMT(Hight Electron Mobility Transistors). The gate periphery of $1^{st}$ stage, $2^{nd}$ stage and output stage is determined $8{\times}50{\times}2$ um, $8{\times}50{\times}4$ um and $8{\times}50{\times}8$ um, respectively. The fabricated HPA MMIC shows size $3,400{\times}3,200um^2$, small signal gain over 29.6 dB, input matching -8.2 dB, output matching -9.7 dB, output power 39.1 dBm and PAE 25.3 % by using 0.15 um GaN technology at 20 V supply voltage in 19.5~22 GHz frequency band. Therefore, this HPA MMIC is believed to be adaptable Ka-band satellite communication payloads down link system.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.3
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• pp.312-318
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• 2016

This paper presents a 2-6 GHz GaN HEMT power amplifier monolithic microwave integrated circuit (MMIC) with bridged-T all-pass filters and output-reactance-compensation shorted stubs using the $0.25{\mu}m$ GaN HEMT foundry process that is developed by WIN Semiconductors, Inc. The bridged-T filter is modified to mitigate the bandwidth degradation of impedance matching due to the inherent channel resistance of the transistor, and the shorted stub with a bypass capacitor minimizes the output reactance of the transistor to ease wideband load impedance matching for maximum output power. The fabricated power amplifier MMIC shows a flat linear gain of 20 dB or more, an average output power of 40.1 dBm and a power-added efficiency of 19-26 % in 2 to 6 GHz, which is very useful in applications such as communication jammers and electronic warfare systems.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.4
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• pp.59-64
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• 2016

In this paper, a 10W GaN MMIC was designed and fabricated using the Ku-band SSPA module. For Design and fabrication of the SSPA module using Rogers(RO4003C) substrate was used for Branch-line structure. SSPA modules on budget Divider/Combiner was designed and fabricated less than the maximum insertion loss - 0.7dB. In addition, because it must be applied to the structural nature of GaN MMIC Gate Bias-Drain Bias circuit was implemented to apply the Gate-Drain sequential circuit, implemented the RF Power Detect, Temperature Detect, HPA On/Off function. Design and fabrication Ku-band SSPA Module got the measurement results that satisfy a maximum output of 15.6W, Gain 45.7dB, 19.0% efficiency.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.5
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• pp.943-948
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• 2018

In this paper, SSPA Module for X-band radar was designed and fabricated by using GaN MMIC. For the purpose of configuring the high power SSPA module, the drive steamers are composed of 2-layers of GaN MMIC with considering Gain Loss. In addition, the power divider and power combiner used a 4way approach by designing a 4-stage power amplifier. The power divider has a loss of -3.0dB or more, and the I/O has a loss of -0.2dB in the power combiner and the phase difference between the ports are good at $2^{\circ}$ on average. The fabricated SSPA module got the measurement results that satisfy a Gain 48dB, P(sat)=88.3W(49.46 dBm), PAE=30.3% or more efficiency in condition of frequency range 9~10GHz. The fabricated X-Band SSPA module can be applied in RF performance improvement for SSPA module whit improvement of power divider/combiner.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.934-937
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• 1999

MMIC 제작을 위한 단일 반도체 공정으로써 PECVD를 이용한 Si₃N₄의 증착, RIE를 이용한 CaAs via-hole건식식각, 그리고 airbridge 공정조건을 위한 실험 및 분석 작업을 수행하였다. Si₃N₄의 증착 실험에서는 굴절률이 2인 조건을, GaAs via-hole 식각 실험에서는 최적화된 thru-via의 모양과 식각률을 갖는 조건을, airbridge 실험에서는 polyimide coating 및 건식 식각 조건과 금 도금 및 습식 식각의 최적 조건들을 찾아내었다.

• Journal of electromagnetic engineering and science
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• v.17 no.4
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• pp.178-180
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• 2017

This study presents a 2-20 GHz monolithic distributed power amplifier (DPA) using a $0.25{\mu}m$ AlGaN/GaN on SiC high electron mobility transistor (HEMT) technology. The gate width of the HEMT was selected after considering the input capacitance of the unit cell that guarantees decade bandwidth. To achieve high output power using small transistors, a 12-stage DPA was designed with a non-uniform drain line impedance to provide optimal output power matching. The maximum operating frequency of the proposed DPA is above 20 GHz, which is higher than those of other DPAs manufactured with the same gate-length process. The measured output power and power-added efficiency of the DPA monolithic microwave integrated circuit (MMIC) are 35.3-38.6 dBm and 11.4%-31%, respectively, for 2-20 GHz.