• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.10
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• pp.881-886
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• 2003

This paper describes the design and implementation of a passive transponder chip for RFID applications. Passive transponders do not have their own power supply, and therefore all power required for the operation of a passive transponder must be drawn from the field of the reader. The designed transponder consists of a full wave rectifier to generate a dc supply voltage, a 128-bit mask ROM to store the information, and Manchester coding and load modulation circuits to be used for transmitting the information from the transponder to the reader. The transponder with a size 410 x 900 ${\mu}$m$^2$ has been fabricated using 0.65 ${\mu}$m 2-poly, 2-metal CMOS process. The measurement results show the data transmission rate of 3.9 kbps at RF frequency 125 kHz.

• Journal of Electrical Engineering and information Science
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• v.2 no.3
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• pp.1-6
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• 1997

This paper describes the design of a network interface controller (NIC) chip which is to be used to support a novel adaptive virtual cut-through routing method for parallel compute systems with direct (i.e., point-to-point) interconnection networks. The NIC chip is designed to provide the interface between a processing node constructed from commercially available microprocessors and another custom-designed router chip, which in turn performs the actual routing of packets to their respective destinations. The NIC, designed using a semi-full-custom VLSi design technique outperform traditional wormhole routing with a minimal amount of hardware overhead. The NIC design has been fully simulated and laid out using a 0.8$\mu\textrm{m}$ CMOS process.

• Bulletin of the Korean Chemical Society
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• v.31 no.10
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• pp.2893-2896
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• 2010

In this study, the optimal preparation conditions in the polymerization process of poly(ethylene terephthalate) (PET) were studied in detail. As a result, the dispersibility of $TiO_2$ was significantly improved by the addition of dispersant and steric hinderance additives into $TiO_2$/ethylene glycol (EG) slurry during the esterification step. The addition sequence of $TiO_2$/EG slurry and stirring also affected the dispersibility of $TiO_2$. The SEM results showed that some $TiO_2$ particles were agglomerated in the PET matrix. The full dull (FD) PET chip and fiber were prepared according to the optimal preparation conditions. The FD PET fiber exhibited a better dispersibility than that of the FD PET chip.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.4
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• pp.696-706
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• 2007

Multiprocessor system on chip (MPSoC) platform has set a new innovative trend for the System on Chip (SoC) design. With the rapidly approaching billion transistors era, some of the main problem in deep sub-micron technologies characterized by gate lengths in the range of 60-90 nm will arise from non scalable wire delays, errors in signal integrity and un-synchronized communication. These problems may be addressed by the use of Network on Chip (NOC) architecture for future SoC. Most future SoCs will use network architecture and a packet based communication protocol for on chip communication. This paper presents an adaptive wormhole routing with proactive turn prohibition to guarantee deadlock free on chip communication for NOC architecture. It shows a simple muting architecture with five full-duplex, flit-wide communication channels. We provide simulation results for message latency and compare results with those of dimension ordered techniques operating at the same link rates.

• Proceedings of the Acoustical Society of Korea Conference
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• autumn
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• pp.9-12
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• 2001

본 논문에서는 유럽 통신 표준화기구인 ETSI 의 SMGll에서 채택된 GSM Full Rate(FR) 보코더 알고리wma[1]을 Teak DSP Core를 이용하여 실시간 구현하였다. GSM FR 보코더는 유럽에서 사용하는 통신 시스템인 GSM 의 full-rate Traffic Channel(TCH)의 표준 코덱[2]으로서 GSM HR, GSM EFR GSM AMR과 더불어 모뎀칩 내에 장착되는 필수적인 음성 서비스이다. 구현된 GSM FR는 13.05kbps의 비트율을 가지고 있으며, 인코더와 디코더 기능 외에 voice activity detection(VAD)[3]블록과 DTX[4]블록 등의 부가 기능도 구현되어 있다. 구현에 사용된 Teak[5]는 DSP Group 의 16bit고정 소수점 DSP core로서 최대 140MIPS 의 성능을 낼 수 있고 400bits ALU 와 두개의 MAC 이 장착되어 있어 음성 및 채널 부호화기의 실시간 처리에 최적화 되어있다. 구현된 GSM FR 은 인코더와 디코더 부분이 각각 약 235 MIPS 및 1.19MIPS 의 복잡도를 나타내며, 사용된 메모리는 프로그램 ROM 3.9K words, 데이터 ROM(table) 396 words 및 RAM 932words이다.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.4 s.310
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• pp.53-59
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• 2006

This paper describes the new design technique of full wave rectifier (FWR) for precise measurement instrument and the chip implementation of this FWR circuit with measurement results. Conventional circuits have some problems of complex design and limited output range( $VDD/2{\sim}VLIIV1IT+$). Proposed FWR circuit was simply designed with two 2x1 MUXs, one high speed comparator, and one differential difference amplifier(DDA). One rail-to-rail differential difference amplifier(DDA) performs the DC level shifting to VSS and 2X amplification simultaneously, and enables the full range ($Vss{\sim}VDD$) operation. The proposed FWR circuits shows more than 50% reduction of chip area and power consumption compared to conventional one. Proposed circuit was implemented with 0.35um 1-poly 2-metal CMOS process. Core size is $150um{\times}450um$ and power dissipation is 840uW with 3.3V single supply.

• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.4
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• pp.282-291
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• 2010

This paper presents a full-CMOS transmitter and receiver for VDSL2 systems. The transmitter part consists of the low-pass filter, programmable gain amplifier (PGA) and 14-bit DAC. The receiver part consists of the low-pass filter, variable gain amplifier (VGA), and 13-bit ADC. The low pass filter and PGA are designed to support the variable data rate. The RC bank sharing architecture for the low pass filter has reduced the chip size significantly. And, the 80 Msps, high resolution DAC and ADC are integrated to guarantee the SNR. Also, the transmitter and receiver are designed to have a wide dynamic range and gain control range because the signal from the VDSL2 line is variable depending on the distance. The chip is implemented in 0.25 ${\mu}m$ CMOS technology and the die area is 5 mm $\times$ 5 mm. The spurious free dynamic range (SFDR) and SNR of the transmitter and receiver are 67.5 dB and 41 dB, respectively. The power consumption of the transmitter and receiver are 160 mW and 250 mW from the supply voltage of 2.5 V, respectively.

• Journal of Broadcast Engineering
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• v.20 no.6
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• pp.963-966
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• 2015

This paper introduces a programmable multi-format video decoder(MFD) to support HEVC(High Efficiency Video Coding) standard and for other video coding standards. The goal of the proposed MFD is the high-end FHD(Full High Definition) video decoder needed for a DTV(Digital Tele-Vision) SoC(System on Chip). The proposed platform consists of a hybrid architecture that is comprised of reconfigurable processors and flexible hardware accelerators to support the massive computational load and various kinds of video coding standards. The experimental results show that the proposed architecture is operating at a 300MHz clock that is capable of decoding HEVC bit-stream of FHD 30 frames per second.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.304-307
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• 2002

High speed machining was accomplished. through the technological advances which covers the whole field of mechanical industry. But tapping have many troubles because of its complicate cutting mechanism, for example. tool damage, chip elimination and synchronization between spindle rotation and feed motion. But High speed tapping is so important that it marches in step with the flow of the times and make improvement in the productivity. In this paper we analyze mechanism of high speed synchronized tapping with the signal of tapping torque and spindle speed obtained through the newly developed high speed tapping machine(NTT-30B). We made an experiment with this machine on condition of various speed from 1000rpm to 10000rpm. As one complete thread is performed through the whole chamfer cutting, cutting torque increases highly in chamfer cutting, but smoothly in full thread cutting functioning of the threads guide. And the size of cutting torque according to spindle speed(rpm) was not enough of a difference to be conspicuous.

• Journal of the Institute of Convergence Signal Processing
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• v.8 no.3
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• pp.205-210
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• 2007

This paper presents a CMOS TIQ flash A/D converter which operates very fast compared to other types of A/D converters due to its parallel architecture. The output resolution of designed A/D converter is 6-bit. In order to reduce the power consumption and chip area of conventional flash A/D converter, TIQ based flash A/D converter is proposed, which uses the advantage of the structure of CMOS transistors. The length and width of transistors of TIQ were determined with HSPICE simulation. To speed up the ultra-high speed flash A/D converter, the Fat Tree Encoder technique is used. The TIQ A/D converter was designed with full custom method. The chip's maximum power consumption was 38.45mW at 1.8V, and the operating speed of simulation was 2.7 GSPS.