• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.4
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• pp.237-240
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• 2016

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

• Investigative Magnetic Resonance Imaging
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• v.22 no.4
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• pp.218-228
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• 2018

Purpose: The objective of this study is to determine the effect of physical changes on MR temperature imaging at 7.0T and to examine proton-resonance-frequency related changes of MR phase images and T1 related changes of MR magnitude images, which are obtained for MR thermometry at various magnetic field strengths. Materials and Methods: An MR-compatible capacitive-coupled radio-frequency hyperthermia system was implemented for heating a phantom and swine muscle tissue, which can be used for both 7.0T and 3.0T MRI. To determine the effect of flip angle correction on T1-based MR thermometry, proton resonance frequency, apparent T1, actual flip angle, and T1 images were obtained. For this purpose, three types of imaging sequences are used, namely, T1-weighted fast field echo with variable flip angle method, dual repetition time method, and variable flip angle method with radio-frequency field nonuniformity correction. Results: Signal-to-noise ratio of the proton resonance frequency shift-based temperature images obtained at 7.0T was five-fold higher than that at 3.0T. The T1 value increases with increasing temperature at both 3.0T and 7.0T. However, temperature measurement using apparent T1-based MR thermometry results in bias and error because B1 varies with temperature. After correcting for the effect of B1 changes, our experimental results confirmed that the calculated T1 increases with increasing temperature both at 3.0T and 7.0T. Conclusion: This study suggests that the temperature-induced flip angle variations need to be considered for accurate temperature measurements in T1-based MR thermometry.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.237-242
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• 2014

Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

• Journal of Welding and Joining
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• v.19 no.5
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• pp.520-525
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• 2001

The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2006.11a
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• pp.59-63
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• 2006

A direct photograph measurement technique was used to determine the spatial distribution of the spray droplet diameter in subsonic crossflow and it also obtain that SMD distribution by using PLLIF technique. The injector internal flow was classified as three modes such as a normal, cavitation, and hydraulic flip. The objectives of this research are getting a droplet distribution and drop size measurement of normal flow and compare with the other flow effects. Although the study showed visually that drop size were spatially dependent of Air-stream velocity, fuel injection velocity, and normalized distance from the injector exit length.(x/d, y/d) There are also difference characteristics between cavitation, hydraulic flip and the normal flow.

• Journal of ILASS-Korea
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• v.12 no.2
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• pp.115-122
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• 2007

The spray characteristics and drop size measurements have been experimentally studied in liquid jets injected into subsonic crossflow. With water as fuel injection velocity, injection angle and atomize. internal flows were varied to provide of jet operation conditions. The injector internal flow was classified as three modes such as a non-cavitation flow, cavitation, and hydraulic flip flows. Pulsed Shadowgraph Photography measurement was used to determine the spatial distribution of the spray droplet diameter in a subsonic crossflow of air. And this study also obtains the SMD (Sauter Mean Diameters) distribution by using Planar Liquid Laser Induced Fluorescence technique. The objectives of this research are get a droplet distributions and drop size measurements of each condition and compare with the other flow effects. As the result, This research has been showned that droplet size were spatially dependent on air-stream velocity, fuel injection velocity, injection angle effects, and normalized distance from the injector exit length(x/d, y/d). There are also different droplet size characteristics between cavitation, hydraulic flip and the non-cavitation flows.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.1
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• pp.58-64
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• 2013

In this paper, two new flip-flop circuits with PCRAM latches that are FF-1 and FF-2, respectively, are proposed not to waste leakage during sleep time. Unlike the FF-1 circuit that has a normal PCRAM latch, the FF-2 circuit has a selective write latch that can reduce the switching activity in writing operation to save switching power at sleep-in moment. Moreover, a sequential sleep-in control is proposed to reduce the rush current peak that is observed at the sleep-in moment. From the simulation of storing '000000' to the PCRAM latch, we could verify that the proposed FF-1 and FF-2 consume smaller power than the conventional 45-nm FF if the sleep time is longer than $465{\mu}s$ and $95{\mu}s$, respectively, at $125^{\circ}C$. For the rush current peak, the sequential sleep-in control could reduce the current peak as much as 77%.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.52 no.2
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• pp.93-101
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• 2003

Scan design is a structured design-for-testability technique in which flip-flops are re-designed so that the flip-flops are chained in shift registers. The scan design cannot be used in a design with scan design rule violations without modifying the design. The most important scan design rule is concerning clock and reset signals to pins of the flip-flops or scan cells. Clock and Reset pins of every scan cell must be controllable from top-level ports. We propose a new technique to re-design gated clocks and resets which violate the scan design rule concerning the clock and reset pins. This technique substitutes synchronous sequential circuits for gated clock and reset designs, which removes the clock and reset rule violations and improves fault coverage of the design. The fault coverage is improved from $90.48\%$ to $100.00\%$, from $92.31\%$ to $100.00\%$, from $95.45\%$ to $100.00\%$, from $97.50\%$ to $100.00\%$ in a design with gated clocks and resets.

• Korean Journal of Metals and Materials
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• v.46 no.5
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• pp.310-314
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• 2008

Electromigration test of flip chip solder bump is performed at $140^{\circ}C$ C and $4.6{\times}10^4A/cm^2$ conditions in order to compare electromigration with thermomigration behaviors by using electroplated Sn-3.5Ag solder bump with Cu under-bump-metallurgy. As a result of measuring resistance with stressing time, failure mechanism of solder bump was evaluated to have four steps by the fail time. Discrete steps of resistance change during electromigration test are directly compared with microstructural evolution of cross-sectioned solder bump at each step. Thermal gradient in solder bump is very high and the contribution of thermomigration to atomic flux is comparable with pure electromigration effect.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.03a
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• pp.486-491
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• 2008

The spray characteristics and drop size measurements have been experimentally studied in liquid jets injected into subsonic crossflow. With water as fuel injection velocity, injection angle and atomizer internal flows were varied to provide of jet operation conditions. The injector internal flow was classified as three modes such as a non-cavitation flow, cavitation, and hydraulic flip flows. Pulsed Shadowgraph Photography measurement was used to determine the spatial distribution of the spray droplet diameter in a subsonic crossflow of air. And this study also obtains the SMD(Sauter Mean Diameters) distribution by using PLLIF(Planar Liquid Laser Induced Fluorescence) technique. The objectives of this research are getting a droplet distribution and drop size measurement of each condition and compare with the other flows effect. As the result, This research have been showed the droplet size were spatially dependent on air-stream velocity, fuel injection velocity, injection angle effects and normalized distance from the injector exit length.(x/d, y/d)There are also different droplet size characteristics between cavitation, hydraulic flip and the non-cavitation flows.