Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Prediction of Impact Life Time in Solder Balls of the Board Level Flip Chips by Drop Simulations

낙하해석을 통한 보드 레벨 플립칩에서의 솔더볼 충격수명에 관한 연구

  • Jang, Chong Min (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) ;
  • Kim, Seong Keol (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
  • Received : 2014.05.26
  • Accepted : 2014.06.13
  • Published : 2014.06.15
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Abstract

Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

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References

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