• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1717-1722
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• 2003

In this paper we developed flip-chip bonder using XY stage, liner-rotary actuator and vision system. We depicted the major parts of the developed flip-chip bonder. Then we discussed several problems and their solutions such as vision and motion control, pick-up module position accuracy, separation of chip from the blue taped hoop, etc. We used a post guide to improve the horizontal positional accuracy against the long arm. Also, we used an ejector module and synchronization technique for easy chip separation from the blue tape.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.461-462
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• 2011

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.120-125
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• 2008

A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.10 s.253
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• pp.957-965
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• 2006

A high-performance hot chuck is designed as a heating device for an ultra-precision flip-chip bonder with infrared alignment system. Analysis of design requirements for thermal performance leads to a radiative heating mechanism employing two halogen lamps as heating source. The heating tool is made of silicon carbide characterized by high thermal diffusivity and small thermal expansion coefficient. Experimental tests are performed to assess heat-up performance and temperature uniformity of the heating tool. It is revealed that the initial design of hot chuck results in a good heat-up speed but there exist a couple of troubles associated with control and integrity of the device. As a means to resolve the raised issues, a revised version of heating tool is proposed, which consists of a working plate made of silicon carbide and a supporting structure made of stainless steel. The advantages of this two-body heating tool are discussed and the improved features are verified experimentally.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.645-646
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• Journal of computational fluids engineering
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• v.8 no.4
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• pp.41-49
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• 2003

This study presents a numerical model to analyze dynamic thermal behavior of a hot chuck designed for flip-chip bonders. The hot chuck of concern is a heater which has been specifically developed for accomplishing high-speed and ultra-precision soldering. The characteristic features are radiative heat source and the heating tool made of a material of high thermal diffusivity. A physical modeling has been conducted for the network of heat transport. A simplified finite volume model is deviced to simulate time-dependent thermal behavior of the heating tool on which soldering is achieved. The reliability of the proposed numerical model is verified experimentally. A series of numerical tests illustrate the usefulness of the numerical model in design analysis.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1645-1650
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• 2003

A numerical and experimental study is made of thermal behavior of a hot chuck which is specially designed for flip-chip bonders. The hot chuck consists of radiant heat sources and a heated plate of very high conductivity, which is for achievement of high-speed heat-up. A simplified numerical model is developed to simulate unsteady thermal behavior of the heated plate. Parallel experimental work is also conducted for a prototype of the hot chuck. Based on the experimental data, the numerical model is tuned to improve the reliability and accuracy. Design analysis using the numerical model is conducted. The results of numerical computations illustrate that the radiant heater system adopted in this study satisfies the key design requirements for a high-performance hot chuck.

• Journal of Sensor Science and Technology
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• v.10 no.5
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• pp.337-342
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• 2001

Infrared sensors with one or two dimensional arrays are usually bonded via indium bumps to Si CMOS read out circuits. Therefore, both sensing of infrared beams and processing of signals are performed at the focal plane. This gives us a benefit of reducing noise as well as size of infrared detectors. We have developed a way of boding indium bumps with keeping sensor and ROIC parallel to each other. The flip chip bonder developed has a very simple structure and is easy to operate. So we expect that reliability will be improved very much.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.4
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.