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http://dx.doi.org/10.7735/ksmte.2014.23.4.355

Thermo-ompression Process for High Power LEDs  

Han, Jun-Mo (Dept. of Mechanical Engineering, Hanyang Univ.)
Seo, In-Jae (Dept. of Mechanical Engineering, Hanyang Univ.)
Ahn, Yoomin (Dept. of Mechanical Engineering, Hanyang Univ.)
Ko, Youn-Sung (Dept. of Mechanical Engineering Team, PROTEC CO., LTD.)
Kim, Tae-Heon (Dept. of Mechanical Engineering Team, PROTEC CO., LTD.)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.23, no.4, 2014 , pp. 355-360 More about this Journal
Abstract
Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.
Keywords
LED Package; Eutectic Bonding; Flip-chip Bonding; High power LED;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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