Thermal Design and Experimental Test of a High-Performance Hot Chuck for a Ultra Precision Flip-Chip Bonder
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Lee Sang-Hyun
((주)탑엔지니어링 기술연구소)
Park Sang-Hee (금오공과대학교 기계공학부) Ryu Do-Hyun ((주)탑엔지니어링 기술연구소) Han Chang-Soo (한국기계연구원 지능형정밀기계부) Kwak Ho-Sang (금오공과대학교 기계공학부) |
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