• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.7-14
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• 2015

Recently, advances in nano-material researches have opened the door for various transparent conductive materials, which include carbon nanotube, graphene, Ag and Cu nanowire, and printable metal grids. Among them, Ag nanowires are particularly interesting to synthesize because bulk Ag exhibits the highest electrical conductivity among all metals. Here we reviewed recently-published research works introducing various devices from organic light emitting diode to tactile sensing devices, all of which are employing AgNW for a conducting material. They proposed methods to enhance the stretchability and reversibility of the transparent electrodes, and apply them to make various flexible and stretchable electronics. It is expected that Ag nanowires are applicable to a wide range of high-performance, low-cost, stretchable electronic devices.

• The monthly packaging world
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• s.275
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• pp.67-71
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• 2016

• The monthly packaging world
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• s.258
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• pp.45-53
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• 2014

• The monthly packaging world
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• s.178
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• pp.96-101
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• 2008

• The monthly packaging world
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• s.143
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• pp.98-114
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• 2005

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.1
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• pp.15-22
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• 2002

We received 2 types flexible packaging films from two companies that laminated PET $16{\mu}m/dry$ lamination/aluminium foil $7{\mu}m/dry$ lamination/CPP $80{\mu}m$ films. For the reason of hot sealing's trouble through filling process, We separated each layer and compared thicks, film types and tested IR, DSC and sensory test. At the result, one sample's thick is different but film types is same between samples. Optimum hot-sealing conditions between two samples is $195^{\circ}C\;and\;210^{\circ}C$. The difference is $15^{\circ}C$. According to test of direct filling packaging process by four face fluid filling machine, two sample's sealing strength of hot-sealing is $4.76kg/cm2/15mm$(sample of optimum hot-sealing condition is $195^{\circ}C$) and $3.84kg/cm2/15mm(210^{\circ}C)$.

• The monthly packaging world
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• s.242
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• pp.91-99
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• 2013

(주)시눅프리미디어는 캐나다에 있는 Flexible Packaging Leading Company로서 북미 대표 한인기업인 Flair(대표 서영철, Flexible Packaging Corporation)가 한국 내 인쇄 품질관리를 위하여 2010년에 설립한 회사이다. (주)시눅프리미디어는 한국 그라비어 인쇄업계의 품질 관리 수준 향상과 세계추세를 선도하는 품질관리를 목표로 2011년 부터 CMS(Color Managemant System에 의한 정량적 색상관리를 실무에 적용하여 시행 중이다. 국내 그라비어 인쇄 업계도 국제적으로 경쟁력 있는 제품을 만들기 위해서는 정량적 품질관리가 반드시 요구될 수 밖에 없다. 따라서 2년여 기간 동안 (주)시눅프리미디어의 협력사(플레이트 제조사, 인쇄사)가 실무 중에 경험한 사례를 소개함으로써 국내 그라비어 인쇄업계에 도움이 되기를 희망한다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.147-164
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• 2001

1. "MLS", state of the art MCM-D wiring substrate. 2. High pin-count LSl assembly. 3. Higher speed needs higher packaging density. 4. Wiring substrate, the key of LSl packaging device. 5. "Inter-Layer Transferability", a new index for the performance of wiring substrates. 6. "MLTF package", a core-less flexible package for high pin-count LSl.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.21-29
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• 2021

Recently, semiconductor chips and electronic components are increasingly being used in IT devices such as wearable watches, autonomous vehicles, and smart phones. As a result, there is a growing concern about device malfunctions that may occur due to electromagnetic interference being entangled with each other. In particular, electromagnetic wave emissions from wearable or flexible smart devices have detrimental effects on human health. Therefore, flexible and transparent electromagnetic interference (EMI) shielding materials and films with high optical transmittance and outstanding shielding effectiveness have been gaining more attention. The EMI shielding films for flexible and transparent electronic devices must exhibit high shielding effectiveness, high optical transmittance, high flexibility, ultrathin and excellent durability. Meanwhile, in order to prepare this EMI shielding films, many materials have been developed, and results regarding excellent EMI shielding performance of a new materials such as carbon nano tube (CNT), graphene, Ag nano wire and MXene have recently been reported. Thus, in this paper, we review the latest research results to EMI shielding films for flexible and transparent device using the new materials.