• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.39-46
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• 2019

A stiffness-gradient soft PDMS/hard PDMS/FPCB stretchable package of the island-bridge structure was processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff flexible printed circuit board (FPCB) as the island substrate, and its effective elastic modulus and stretchable deformation characteristics were analyzed. With the elastic moduli of the soft PDMS, hard PDMS, and FPCB to be 0.28 MPa, 1.74 MPa, and 1.85 GPa, respectively, the effective elastic modulus of the soft PDMS/hard PDMS/FPCB package was analyzed as 0.58 MPa. When the soft PDMS of the soft PDMS/hard PDMS/FPCB package was stretched to a tensile strain of 0.3, the strains occurring at hard PDMS and FPCB were found to be 0.1 and 0.003, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.55-62
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• 2019

Stiffness-gradient stretchable electronic packages of the soft PDMS/hard PDMS/FPCB structure were processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff flexible printed circuit board (FPCB) as the island substrate. The elastic characteristics of the stretchable packages were estimated and their long-term reliabilities on stretching cycles and bending cycles were characterized. With 0.28 MPa, 1.74 MPa, and 1.85 GPa as the elastic moduli of the soft PDMS, hard PDMS, and FPCB, respectively, the effective elastic modulus of the soft PDMS/hard PDMS/FPCB package was estimated as 0.6 MPa. The resistance of the stretchable packages varied for 2.8~4.3% with stretching cycles ranging at 0~0.3 strain up to 15,000 cycles and for 0.9~1.5% with 15,000 bending cycles at a bending radius of 25 mm.

• Journal of Sensor Science and Technology
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• v.25 no.1
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• pp.57-64
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• 2016

To understand a two-phase flow, a liquid film thickness is one of the important factors. A lot of researches have been performed to measure liquid film thickness with various approaches. Recently, an electrical conductance method which uses the conductivity of the liquid film has been widely applied on measuring the liquid film thickness. Though the electrical method has an advantage in high spatial resolution, as the conductivity of liquid can be affected by its temperature variation, the conventional electrical conductance methods have a limitation in being applied on varying temperature conditions where a heat transfer is involved. The purpose of this study is to develop a three-ring liquid film sensor that overcomes the limitation of the conventional method. The three-ring conductance method can measure the film thickness regardless of temperature variation by compensating the change of liquid conductivity. Considering its application on a wide range of conditions such as high temperature or curved surfaces, the sensor was fabricated on flexible printed circuit board (FPCB) in this study. This paper presents the concept of the measurement method, design procedure, prototype sensor fabrication and calibration results.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.111-118
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• 2018

In order to develop a local stiffness-variant stretchable substrate with the soft PDMS/hard PDMS/FPCB configuration consisting of two stiffness-different polydimethylsiloxane (PDMS) parts and flexible printed circuit board, a FPCB was bonded to PDMS using the acrylic-silicone double-sided tape and the interfacial adhesion of the PDMS/FPCB was evaluated. The pull strength of the FPCB, which was bonded to the fully cured PDMS using the silicone adhesive of the double-sided tape, was 259 kPa and the delamination during the pull test occurred at the interface between the PDMS and the silicone adhesive. On the contrary, the bonding process, for which the FPCB was bonded using the silicone adhesive to the PDMS partially cured for 15~20 minutes at $60^{\circ}C$ and then the PDMS was fully cured for 12 hours at $60^{\circ}C$, exhibited the remarkably enhanced pull strength of 1,007~1,094 kPa. With the above mentioned bonding process, the delamination during the pull test was observed at the interface between the FPCB and the acrylic adhesive of the acrylic-silicone double sided tape.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.155-161
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• 2018

A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.2
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• pp.378-385
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• 2016

The internal circuit of the bus-bar for an electrical switch board is a prime cause of electric shock and short circuit accidents due to the exposure of live parts. Electrical fires can also be caused by animals and foreign substances in the switchboard that connect the components with a difficult structure resulting in overheating due to an increase in contact resistance. Preventing these types of accidents is a prime concern in the manufacturing process, such as cutting and bending. In this study, the cutting bus bar of a switch board contained improved modules as a flame retardant that isolates a separate blocks to prevent such problems. This was implemented as a scalable and flexible means of reducing electrical switchboard hazards to offer a safe switch board bus-bar structure of a new connecter type

• IE interfaces
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• v.8 no.3
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• pp.259-267
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• 1995

A printed circuit board auto-insertion line consists of several processes of identical machines and produces several different types of PCBs. Each board must be processed by at most one machine in each process. So, we call it a flexible flow line. The load balancing is the one of the most important issues in the FFL which has many sequential processes. Therefore we have represented the job route selection model to balance the load of inter-process in the PCB auto-insertion line, and validated it by simulation.

• Journal of Korean Institute of Industrial Engineers
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• v.20 no.4
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• pp.5-21
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• 1994

We have described the optimal process route selection model for the PCB(printed circuit board) auto-insertion line. This PCB assembly line is known as a FFL(flexible flow line) which produces a range of products keeping the flow shop properties. Under FFL environments, we have emphasized the balancing of work-loads in order to maximize total productivity of PCB auto-insertion line. So we have developed a heuristic algorithm based on a work-order selection rule and min-max concept for the job route selection model.

• IE interfaces
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• v.11 no.3
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• pp.1-13
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• 1998

This paper addresses a scheduling scheme for Flexible Flow Shop(FFS) in the case that a factory is a sub-plant of an electronic device manufacturing plant. Under this environment, job orders for the sub-plants in the production route are generated together with job processing time bucket when the customer places orders for final product. The processing time bucket for each job is a duration from possible release date to permissible due date. A sub-plant modeled FFS should schedule these jobs orders within time bucket. Viewing a Printed Circuit Board(PCB) assembly line as a FFS, the developed scheme schedules an incoming order along with the orders already placed on the scheduled. The scheme consists of the four steps, 1)assigning operation release date and due date to each work cells in the FFS, 2)job grouping, 3)dispatching and 4)machine allocation. Since the FFS scheduling problem is NP-complete, the logics used are heuristic. Using a real case, we tested the scheme and compared it with the John's algorithm and other dispatching rules.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.4177-4185
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• 2012

LEDs are becoming the most suitable candidate replacing traditional fluorescent lamps because of its eco-friendly characteristics. LEDs are also actively used to design green building system and to make outdoor billboard as a back-light system due to its high energy efficiency. In this paper, we have developed AC direct driver for $12{\times}12$ FLB(flexible LED board) and LED flat light without SMPS. It has LID-PC-R101B driver IC that can support the high power factor and be composed of LED switching circuit in group. Also, an elaborate system designs can guarantee a high luminous efficiency, a high reliability and a low power consumption. The proposed FLB has the ultra slim shape of $450{\times}450$ mm, width of 4 mm and weight of 280 g. In the end, we have developed a prototype of FLB for billboard and flat light for room lighting with AC direct driver iposrder to verify the performance of the proposed system.