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http://dx.doi.org/10.6117/kmeps.2019.26.4.039

Analysis on Effective Elastic Modulus and Deformation Behavior of a Stiffness-Gradient Stretchable Electronic Package with the Island-Bridge Structure  

Oh, Tae Sung (Department of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.4, 2019 , pp. 39-46 More about this Journal
Abstract
A stiffness-gradient soft PDMS/hard PDMS/FPCB stretchable package of the island-bridge structure was processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff flexible printed circuit board (FPCB) as the island substrate, and its effective elastic modulus and stretchable deformation characteristics were analyzed. With the elastic moduli of the soft PDMS, hard PDMS, and FPCB to be 0.28 MPa, 1.74 MPa, and 1.85 GPa, respectively, the effective elastic modulus of the soft PDMS/hard PDMS/FPCB package was analyzed as 0.58 MPa. When the soft PDMS of the soft PDMS/hard PDMS/FPCB package was stretched to a tensile strain of 0.3, the strains occurring at hard PDMS and FPCB were found to be 0.1 and 0.003, respectively.
Keywords
stretchable package; stretchable substrate; PDMS; FPCB; elastic modulus; stretchable deformation;
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Times Cited By KSCI : 9  (Citation Analysis)
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