1 |
J. Xiao, A. Carlson, Z. J. Liu, Y. Huang, H. Jiang, and J. A. Rogers, "Stretchable and Compressible Thin Films of Stiff Materials on Compliant Wavy Substrates", App. Phys. Lett., 93, 013109 (2008).
DOI
|
2 |
T. Sekitani, Y. Noguchi, K. Hata, T. Fukushima, T. Aida, and T. Someya, "A Rubberlike Stretchable Active Matrix Using Elastic Conductors", Science, 321, 1468 (2008).
DOI
|
3 |
D. H. Kim, J. H. Ahn, W. M. Choi, H. S. Kim, T. H. Kim, J. Song, Y. Y. Huang, Z. Liu, C. Lu, and J. A. Rogers, "Stretchable and Foldable Silicon Integrated Circuits", Science, 320, 507 (2008).
DOI
|
4 |
J. H. Ahn, and J. H. Je, "Stretchable Electronics: Materials, Architectures and Integrations", J. Phys. D: Appl. Phys., 45, 102001 (2012).
|
5 |
D. H. Kim, and J. A. Rogers, "Stretchable Electronics: Materials Strategies and Devices", Adv. Mater., 20, 4887 (2008).
DOI
|
6 |
J. Y. Choi, D. H. Park, and T. S. Oh, "Chip Interconnection Process for Smart Fabrics Using Flip-Chip Bonding of SnBi Solder", J. Microelectron. Packag. Soc., 19(3), 71 (2012).
DOI
|
7 |
S. W. Jung, J. S. Choi, J. B. Koo, C. W. Park, B. S. Na, J. Y. Oh, S. S. Lee, and H. Y. Chu, "Stretchable Organic Thin-Film Transistors Fabricated on Elastomer Substrates Using Polyimide Stiff-Island Structures", ECS Solid State Lett., 4(1), P1 (2015).
DOI
|
8 |
Y. Y. Hsu, C. Papakyrikos, M. Raj, M. Dalal, P. Wei, X. Wang, G. Huppert, B. Morey, and R. Ghaffari, "Archipelago Platform for Skin-Mounted Wearable and Stretchable Electronics", Proc. 64th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, 145, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2014).
|
9 |
R. Li, M. Li, Y. Su, Z. Song, and X. Ni, "An Analytical Mechanics Model for the island-bridge Structure of Stretchable Electronics", Soft Matter, 9, 8476 (2013).
DOI
|
10 |
Y. Y, Hsu, M. Gonzalez, F. Bossuyt, J. Vanfleteren, and I. D. Wolf, "Polyimide-Enhanced Stretchable Interconnects", IEEE Trans. Electron Devices, 58(8), 2680 (2011).
DOI
|
11 |
S. W. Jung, J. S. Choi, J. B. Koo, C. W. Park, B. S. Na, J. Y. Oh, S. S. Lee, and H. Y. Chu, "Stretchable Organic Thin-Film Transistors Fabricated on Elastomer Substrates Using Polyimide Stiff-Island Structures", ECS Solid State Lett., 4(1), P1 (2015).
DOI
|
12 |
D. Park, and T. S. Oh, "Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I. Flip-Chip Bonding on Rigid Substrates", Mater. Trans., 58(8), 1212 (2017).
DOI
|
13 |
C. R. Barrett, A. S. Tetelman, and W. D. Nix, "The Principles of Engineering Materials", pp.316-325, Prentice Hall, Inc., Englewood Cliffs (1973).
|
14 |
D. Park, K. S. Han, and T. S. Oh, Comparison of "Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates", Mater. Trans., 58(8), 1217 (2017).
DOI
|
15 |
N. Lu, J. Yoon, and Z. Suo, "Delamination of Stiff Islands Patterned on Stretchable Substrates", Inter. J. Mater. Res., 98, 717 (2007).
DOI
|
16 |
D. W. Park, and T. S. Oh, "Stretchable Deformation-Resistance Characteristics of the Stiffness-Gradient Stretchable Electronic Packages Based on PDMS", to be published in J. Microelectron. Packag. Soc. (2019).
|
17 |
S. Popovics, "Quantitative Deformation Model for Two-Phase Composites Including Concrete", Mater. Struct., 20, 171 (1987).
DOI
|
18 |
S. Popovics, and M. R. A. Erdey, "Estimation of the Modulus of Elasticity of Concrete-like Composite Materials", Mater. Struct., 3, 253 (1970).
|
19 |
M. Chan, D. Esteve, J.-Y. Fourniols, C. Escriba, and E. Campo, "Smart Wearable Systems: Current Status and Future Challenges", Artif. Intell. Med., 56(3), 137 (2012).
DOI
|
20 |
S. Patel, H. Park, P. Bonato, L. Chan, and M. Rodgers, "A Review of Wearable Sensors and Systems with Application in Rehabilitation", J. Neuroeng. Rehabil. 9, 21 (2012).
DOI
|
21 |
D. Park, and T. S. Oh, "Interfacial Adhesion Enhancement Process of Local Stiffness-Variant Stretchable Substrates for Stretchable Electronic Packages", J. Microelectron. Packag. Soc., 25(4), 111 (2018).
DOI
|
22 |
D. Park, and T. S. Oh, "Flip Chip Process on the Local Stiffness-Variant Stretchable Substrate for Stretchable Electronic Packages", J. Microelectron. Packag. Soc., 25(4), 155 (2018).
DOI
|
23 |
H. A. Oh, D. Park, S. J. Shin, and T. S. Oh, "Deformation Behavior of Locally Stiffness-Variant Stretchable Substrates Consisting of the Island Structure", J. Microelectron. Packag. Soc., 22(4), 117 (2015).
DOI
|
24 |
H. A. Oh, D. Park, K. S. Hahn, and T. S. Oh, "Elastic Modulus of Locally Stiffness-Variant Polydimethylsiloxane Substrates for Stretchable Electronic Packaging Applications", 22(4), 91 (2015).
DOI
|
25 |
J. H. Ahn, H. Lee, and S. H. Choa, "Technology of Flexible Semiconductor/Memory Device", J. Microelectron. Packag. Soc., 20(2), 1 (2013).
DOI
|
26 |
J. Y. Choi, D. W. Park, and T. S. Oh, "Variation of Elastic Stiffness of Polydimethylsiloxane (PDMS) Stretchable Substrates for Wearable Packaging Applications", J. Microelectron. Packag. Soc., 21(4), 125 (2014).
DOI
|
27 |
J. Y. Choi, and T. S. Oh, "Flip Chip Process on CNT-Ag Composite Pads for Stretchable Electronic Packaging", J. Microelectron. Packag. Soc., 20(4), 17 (2013).
DOI
|