• Journal of Institute of Control, Robotics and Systems
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• v.22 no.10
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• pp.817-825
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• 2016

In this paper, we introduce a flexible gripper that we have engineered to precisely pinch in parallel and compliantly grasp objects. As found in most conventional industrial grippers, the parallel pinching property is essential for precise manipulation. On the other hand, the grippers with a flexible structure are more adept at grasping objects with arbitrary shapes and softness. To achieve these disparate properties, we introduce a flexible gripper mechanism composed of multiple flexible beam structures. Utilizing these beam structures, the proposed gripper is able to grasp arbitrarily shaped objects. Additionally, a unique combination of flexible beams enables the gripper to pinch objects using the parallel fingertips for enhanced precision. A detailed description of the proposed mechanism is provided, and an analysis of the strength and stiffness of the fingertip and finger body is presented. The Results section compares the theoretical and experimental analyses and verifies the properties and performance of the proposed gripper.

• Journal of Sensor Science and Technology
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• v.15 no.4
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• pp.277-283
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• 2006

We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.357-360
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• 2005

A novel wide viewing angle flexible liquid crystal display will be demonstrated. The crossed matrix-type micro-cell structure was adopted in this design. The LC domains were divided into four different tilted directions by the combination effect of pixel fringe field and crossed matrix type micro-cell. It can create four domains without rubbing process and form the cell gap without spacer. For flexible color fabrication, a novel inkjet printing technology is adopted. This cost effective wide viewing angle color flexible LCD technology can be a good solution for high performance flexible LCD.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.1-9
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• 2013

Recently flexible electronic devices have attracted a great deal of attention because of new application possibilities including flexible display, flexible memory, flexible solar cell and flexible sensor. In particular, development of flexible memory is essential to complete the flexible integrated systems such as flexible smart phone and wearable computer. Research of flexible memory has primarily focused on organic-based materials. However, organic flexible memory has still several disadvantages, including lower electrical performance and long-term reliability. Therefore, emerging research in flexible electronics seeks to develop flexible and stretchable technologies that offer the high performance of conventional wafer-based devices as well as superior flexibility. Development of flexible memory with inorganic silicon materials is based on the design principle that any material, in sufficiently thin form, is flexible and bendable since the bending strain is directly proportional to thickness. This article reviews progress in recent technologies for flexible memory and flexible electronics with inorganic silicon materials, including transfer printing technology, wavy or serpentine interconnection structure for reducing strain, and wafer thinning technology.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1112-1114
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• 2009

In this paper, we have studied manufacturing process for liquid crystal displays (LCDs) using plastic substrates. Because the thermal and dimensional stabilities of plastic substrates are decisive issues, both the process and materials were improved to fit the manufacturing requirements of flexible twisted-nematic (TN) and color super-twisted nematic (CSTN) LCDs. Finally, to broaden the flexible display applications, we take advantage of the unique properties of flexible display to design several innovative products.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.131-134
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• 2009

We have developed a flexible OTFT backplane in which all the dielectrics are formed by solutionprocess in order to achieve low-cost and highthroughput manufacturing. The backplane successfully drives a flexible AM-OLED display with peak brightness of > 200 nit and the contrast ratio of > 1000:1 with great mechanical flexibility.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.19-28
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• 2016

This paper presents an overview of selected advanced measurement technologies for the mechanical properties of polymers used for flexible and stretchable electronic packaging. Over the years, a variety of flexible and stretchable electronics have been developed due to their potential applications for next generation IT industry. To achieve more flexible and wearable devices for practical applications, the usage of polymeric components has been increased significantly. Therefore, accurate measurement of mechanical properties of the polymers is necessary in order to design mechanically reliable devices. However, the measurement has been challenging due to the soft nature and thin applications of polymers. Here, we describe novel measurement technologies of mechanical properties of polymers for flexible and stretchable electronics.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.278.2-278.2
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• 2014

We have investigated the highly flexible and transparent Si-doped $In_2O_3$(ISO)/Ag/ISO multilayer grown on polyethylene terephthalate (PET) substrates using a roll-to-roll sputtering system. The electrical and optical properties of ISO/Ag/ISO multilayer electrodes depended on the insertion of a nano-size Ag layer. Due to the high conductivity of a nano-size Ag layer, the optimized ISO/Ag/ISO multilayer electrodes showed the lowest resistivity of $3.679{\times}10^{-5}Ohm-cm$, even though the ISO/Ag/ISO multilayer electrodes was sputtered at room temperature. Furthermore, the ISO/Ag/ISO multilayer electrodes exhibited a high transmittance of 86.33%, because of the anti-reflection effect, comparable to Sn-doped $In_2O_3$ (ITO) electrodes. In addition, the ISO/Ag/ISO multilayer electrodes had a very smooth surface morphology without surface defects and showed good flexibility. The flexible OSCs fabricated on ISO(30nm)/Ag(8nm)/ISO(30nm) multilayer electrode showed a power conversion efficiency of 3.272%. This result indicates that the ISO/Ag/ISO multilayer is a promising transparent conducting electrode for flexible OSCs.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.1-6
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• 2013

Recently, various types of flexible devices such as flexible displays, batteries, e-skins and solar cell panels have been reported. Most of the researches focus on the development of high performance flexible device. However, to realize these flexible devices, the long-term reliability should be guaranteed during the repeated deformations of flexible devices because the direct mechanical stress would be applied on the electronic devices unlike the rigid Si-based devices. Among various materials consisting electronics devices, metal electrode is one of the weakest parts against mechanical deformation because the mechanical and electrical properties of metal films degrade gradually due to fatigue damage during repeated deformations. This article reviews the researches of fatigue behavior of thin metal film, and introduces the methods to enhance the reliability of metal electrode for flexible device.