• Title/Summary/Keyword: Flat band voltage

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Dependence of the Thickness of Spacer Layers on the Current Voltage Characteristics of DB Resonant Tunneling Diodes Analyzed with a Self-Consistent Method (스페이서층 두께변화에 따른 공명터널링 다이오드에서 전류-전압 특성의 자기무모순법에 의한 해석)

  • 김성진;이상훈;성영권
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.3
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    • pp.46-52
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    • 1994
  • We investigated theoretically the current-voltage characteristics of resonant tunneling diodes with a single quantum well structure. using a self-consistent method. This method is a numerical analysis which is able to include the effects of the undoped spacer layer and the band bending by charge accumulation and depletion on the contact layers which have not been considered in the flat-band model reported by Esaki. so that it is better suited to explain experimental results. The structure used is an $AL_{0.5}Ga_{0.5}AS/GaAs/Al_{0.5}Ga_{0.5}AS$ single quantum well. In this work. we estimate the theoretical current-voltage characteristics of the same structure, and then, the dependence of the current-voltage curves on the thickness of undoped spacer layers sandwiched between the barrier and highly n-doped GaAs contact layer.

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Hot-Carrier Induced GIDL Characteristics of PMOSFETs under DC and Dynamic Stress (직류 및 교류스트레스 조건에서 발생된 Hot-Carrier가 PMOSFET의 누설전류에 미치는 영향)

  • 류동렬;이상돈;박종태;김봉렬
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.30A no.12
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    • pp.77-87
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    • 1993
  • PMOSFETs were studied on the effect of Hot-Carrier induced drain leakage current (Gate-Induced-Drain-Leakage). The result turned out that change in Vgl(drain voltage where 1pA/$\mu$m of drain leadage current flows) was largest in the Channel-Hot-Hole(CHH) injection condition and next was in dynamic stress and was smallest in electron trapping (Igmax) condition under various stress conditions. It was analyzed that if electron trapping occurrs in the overlap region of gate and drain(G/D), it reduces GIDL current due to increment of flat-band voltage(Vfb) and if CHH is injected, interface states(Nit) were generated and it increases GIDL current due to band-to-defect-tunneling(BTDT). Especially, under dynamic stress it was confirmed that increase in GIDL current will be high when electron injection was small and CHH injection was large. Therefore as applying to real circuit, low drain voltage GIDL(BTDT) was enhaced as large as CHH Region under various operating voltage, and it will affect the reliablity of the circuit.

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Study on Electric Charactreistics of Multi-dielectric Thin Films Using Amorphous Silicon (비정질 실리콘을 이용한 다층 유전 박막의 전기적 특성에 관한 연구)

  • 정희환;정관수
    • Journal of the Korean Vacuum Society
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    • v.3 no.1
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    • pp.71-76
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    • 1994
  • The electrical characteristics of the capacitor dielectric films of amorphous silicon-nit-ride-oxide(ANO) structures are compared with the capacitor dielectric films of oxide-nitride-oxide (ONO) structrues The electrical characteristics of ONO and ANO films were evaluated by high frequency(1 MHz) C-V high frequency C-V after constant voltage stree I-V TDDB and refresh time measurements. ANO films shows good electrical characteristics such as higher total charge to breakdown storage capacitance and longer refresh time than ONO films. Also it makes little difference that leakage current and flat band voltage shyift(ΔVfb)of ANO ana ONO films.

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Effect of the Nitridation Process on the Characteristics of $SiO_2$ Films Thermally Nitrided by the Hot-Wall Process and the Cold-Wall Process (Hot-Wall 및 Cold-Wall 공정이$SiO_2$ 열적질화막의 특성에 미치는 영향)

  • 이용수;조범무;이용현;서병기
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.25 no.12
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    • pp.1649-1655
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    • 1988
  • Thermally growon SiO2 films were thermally nitrided in a hot-wall furnace and in a RF-heated cold-wall reactor and their characteristics were investigated by the AES and the C-V dmeasurements. The Auger depth profile show that 200\ulcornerSiO2 film nitrided at 1200\ulcorner, for 2hrs by the hot-wall process has a nitrogen-rich layer near the SiOxNy-Si interface. However the nitrogen-ri h layer is not observed in the case of cold-wall process. The maximum flat-band voltage for the SiO2 films nitrided by the hot-wall process is higher than by the cold-wall process, and the peak value of flat-band voltage for the hot-wall process appears the longer nitridation time than that for the cold-wall process. The SiOxNy-Si interface shift toward the Si substrate for the case of the hot-wall process is larger than that for the cold-wall process.

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A Study on $E_1$Transition in Si-Doped $Al_{0.32}Ga_{0.68}As$by Electroreflectance Measurement (Electroreflectance 측정에 의한 Si이 첨가된 $Al_{0.32}Ga_{0.68}As$에서의 $E_1$ 전이에 대한 연구)

  • 김동렬;손정식;김근형;이철욱;배인호
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.9
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    • pp.687-692
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    • 1998
  • Silicon doped $Al_{0.32}Ga_{0.68}As$ were growth by molecular beam epitaxy. Electroreflectance(ER) spectra of the $E_1$ transition of Schottky barrier Au/n-$Al_{0.32}Ga_{0.68}As$ have been measured at various modulation voltage($V_{ac}$) and dc bias voltage($V_{bias}$). from the $E_1$peak, band gap energy of the $Al_{0.32}Ga_{0.68}As$ is 1.883 eV which corresponds to an Al composition of 32%. As modulation voltage($V_{bias}$) is changed, a line shape at the $E_1$transition does not change, but its amplitude varies linearly. The amplitude of $E_1$signal decrease with increasing the forward dc bias voltage($V_{bias}$), but the line shape does not change. It suggests that the low field theory rather than Franz-Keldysh oscillation is Required to interpret spectra. Also, spectra at the $E_1$transition were broadened with increasing the reverse dc bias voltage($V_{bias}$) which suggests the presence of Field-induced broadening.

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Electrical characteristics of 4H-SiC MIS Capacitors With Ni/CNT/SiO2 Structure (Ni/CNT/SiO2 구조의 4H-SiC MIS 캐패시터의 전기적 특성)

  • Lee, Taeseop;Koo, Sang-Mo
    • Journal of IKEEE
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    • v.18 no.4
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    • pp.620-624
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    • 2014
  • In this study, the electrical characteristics of Ni/CNT/$SiO_2$ structures were investigated in order to analyze the mechanism of carbon nanotubes in 4H-SiC MIS device structures. We fabricated 4H-SiC MIS capacitors with or without carbon nanotubes. Carbon nanotubes were dispersed by isopropyl alcohol. The capacitance-voltage (C-V) is characterized at 300 to 500K. The experimental flat-band voltage ($V_{FB}$) shift was positive. Near-interface trapped charge density and oxide trapped charge density values of Ni/CNT/$SiO_2$ structure were less than values of reference samples. With increasing temperature, the flat-band voltage was negative. It has been found that its oxide quality is related to charge carriers or defect states in the interface of 4H-SiC MIS capacitors. Gate characteristics of 4H-SiC MIS capacitors can be controlled by carbon nanotubes between Ni and $SiO_2$.

Preparation and C-V characteristics of $Y_2O_3-StabilzedZrO_2$ Thin Films by PE MO CVD (플라즈마 화학 증착법에 의한 $Y_2O_3-StabilzedZrO_2$박막의 제조와 Capacitance-Voltage특성)

  • Choe, Hu-Rak;Yun, Sun-Gil
    • Korean Journal of Materials Research
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    • v.4 no.5
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    • pp.510-515
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    • 1994
  • Yttria-stabilized zirconia(YSZ) films were prepared onto p-type (100) silicon wafer by a plasma-enhanced metallorganic chemical vapor deposition(PE MO CVD) processing involving the application of vapor mixture of tri(2.2.6.6-tetramethyl-3, 5-heptanate) yttrium$[Y(DPM)_3]$, zirconiumtriflouracethyla cetonate$(Zr(tfacac)_4$ and oxygen gas. The x-ray diffraction(XRD) and fourier transform infrared spectra(FT1R) results showed that the deposited YSZ films had a single cubic phase. $Y_2O_3$ content of YSZ film was analyzed by PIXE(partic1e induced x-ray emission). The experimental results by PIXE revealed that 12.lmol%, 20.4mol% and 31.6mol% $Y_2O_3$ could be obtained as the $Y(DPM)_3$ bubbling temperature varied at $160^{\circ}C, 165^{\circ}C$ and $170^{\circ}C$ respectively. The increase of $Y(DPM)_3$ bubbling temperature caused shifting flat band voltage to have a negative value.

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Capacitance-Voltage (C-V) Characteristics of Cu/n-type InP Schottky Diodes

  • Kim, Hogyoung
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.5
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    • pp.293-296
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    • 2016
  • Using capacitance-voltage (C-V) and conductance-voltage (G/ω-V) measurements, the electrical properties of Cu/n-InP Schottky diodes were investigated. The values of C and G/ω were found to decrease with increasing frequency. The presence of interface states might cause excess capacitance, leading to frequency dispersion. The negative capacitance was observed under a forward bias voltage, which may be due to contact injection, interface states or minority-carrier injection. The barrier heights from C-V measurements were found to depend on the frequency. In particular, the barrier height at 200 kHz was found to be 0.65 eV, which was similar to the flat band barrier height of 0.66 eV.

The Design of 50 MHz~3 GHz Wide-band Amplifier IC using SiGe HBT (SiGe HBT를 이용한 50 MHz~3 GHz 대역폭의 광대역 증폭기 IC 설계)

  • 이호성;김병성;박수균
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.13 no.1
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    • pp.68-73
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    • 2002
  • This paper presents the implementation of wide-band RFIC amplifier operating from near 50 MHz to 3 GHz using Tachyonics SiGe HBT foundry. Voltage shunt feedback is used for the flat gain and the broad band impedance matching. Initial design parameters are calculated through the low frequency small signal analysis. Since the HBT model was not available at the design time, discrete tuning board was made for fine adjustment in the low frequency range. Fabricated amplifier shows 12 dB gain with 1 dB fluctuation and P1 dB reaches 15 dBm at 850 MHz.

The Design of 50MHz-3GHz Wide-band Amplifier IC Using SiGe HBT (SiGe HBT를 이용한 50MHz-3GHz 대역폭의 광대역 증폭기 IC 설계)

  • 이호성;박수균;김병성
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2001.11a
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    • pp.257-261
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    • 2001
  • This paper presents the implementation of wide-band RFIC amplifier operating from near 50MHz to 3GHz using Tachyonics SiGe HBT foundry. Voltage shunt feedback is used for the flat gain and the broad band impedance matching. Initial design parameters are calculated using the low frequency small signal analysis. Since the HBT model was not available at the design time, discrete tuning board was made for fine tuning in the low frequency range. Fabricated amplifier shows 12dB gain with 1dB fluctuation and PldB reaches 15dBm at 850MHz.

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