• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Korean Journal of Materials Research
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• v.12 no.2
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• pp.103-111
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• 2002

The thermally insulated underground pipelines have been used for district heating system. The sensor wire embedded in the insulation was used for monitoring the insulating resistance between the sensor wire and the pipe. The resistance measurement system detects corrosion of steel pipe under insulation. The corrosion and stress corrosion cracking(SCC) characteristics of sensor wire in synthetic ground water were investigated using the electrochemical methods and constant load SCC tests. The polarization tests were used to study the electrochemical behavior of sensor wire. The sensor wire was passivated at temperatures ranging from 25 to $95^{\circ}C$. However, the applied sensing current larger than passive current resulted in breakdown of passive film. The constant load SCC tests were performed to investigate the effects of applied current and load on the fracture behavior. Stress-corrosion cracks initiated at pits that were produced by sensing current. The growth of the pit involves a tunnelling mechanism, which leads to ductile fracture.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.4 s.235
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• pp.632-638
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• 2005

The surface lapping process on sapphire wafer was carried out for the epitaxial process of thin film growth of GaN semiconducting material. The planarization of the wafers was investigated by the introduction of the dummy wafers. The diamond lapping process causes the surface deformation of dislocation and micro-cracks. The material deformation due to the mechanical stress was analyzed by the X-ray diffraction and the Vickers indentation. The fracture toughness was increased with the increased annealing temperature indicating the recrystallization at the surface of the sapphire wafer The sudden increase at the temperature of $1200^{\circ}C$ was correlated with the surface phase transition of sapphire from a $-A1_{2}O_{3}\;to\;{\beta}-A1_{2}O_{3}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.288-291
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• 2001

It is very important to select suspension solution for forming electrophoretic deposited YBCO thick mm, because it is heavily affected to its superconducting properties. In this paper, high-temperature superconductor films of $YBa_{2}Cu_{3}O_{7-x}$ were fabricated by electrophoretic deposition (EPD) from alcohol-based suspension such as iso-propanol, iso-butanol, and their mixture. For the formation of YBCO dense and adherent coating on a silver wire by EPD, 1 % PEG(1000) 2 ml, as a additive for making their surface crack-free, was used for electrophoresis. As a results, the cracks were considerably decreased and the superconducting critical current density $(J_e)$ without/with PEG was $1200A/cm^2$ and $2020A/cm^2$, which films deposited in mix iso-propanol and iso-butanol suspension.

• Journal of the Korean institute of surface engineering
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• v.27 no.2
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• pp.74-82
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• 1994

The structure and properties such as adhesion and corrosion resistance of Cr and $Cr_2O_3$ films, deposited on steel plates by the vacuum evaporation method, were investigated. According to the ESCA and AES analy-sis, it could be concluded that chromium oxide with uniform composition could be formed on the steel sub-strate. The deposited Cr and $Cr_2O_3$ films had high adhesion strength, and they did not peeled off by the tape test. The adhesion property, however, was deteriorated as the film thciknes increased. After bending of the deposited specimen many cracks were observed by SEM, and they were assumed to have propagated along co-lumnar boundaries by the bending test. The corrosion resistance of the films was not generally good, which in-dicates that the films had a porous structure with a large number of defects such as pin holes and voids.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.32 no.2
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• pp.157-163
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• 1996

To ceramic film, $SiO_2$ and $Al_2O_3$, coated on pure Fe and stainless steel(SUS41O) by RF magnetron sputtering, the adherence between mm and substarte was studied. The adherence index (${\chi}$) was determined by the measure of micro hardness test. Also, the corrosion resistance on oxide coatings was studied using electrochemical measurement. The main results obtained are as the following: 1) In the micro-hardness test, with $1{\mu}m$ thickness mm, it has only one the value of ${\chi}$. Above $2{\mu}$thickness fIlm, however, get another value of ${\chi}$as the cracks in fIlm. 2) The oxide fIlm adhere well on the mild materials such as pure steel than high intensity materials like stainless. 3) Alumina($Al_2O_3$) coated materials have better corrosion resistance than silica($SiO_2$)coated materials

• Nuclear Engineering and Technology
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• v.30 no.5
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• pp.396-402
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• 1998

Experiments on the steamside corrosion and hydrogen pick-up of Zircaloy-4 under high pressure up to 10.3MPa are carried out to estimate the pressure effects on the kinetics. Temperature and reaction time are determined to be 37$0^{\circ}C$ and 72hours for the pre-transition test and $700^{\circ}C$ and 210minutes for the post-transition test, respectively. Results show that under 10.3MPa pressure the oxidation reaction is 50% and 100% enhanced in the pre-and the post-transition regime, respectively. Total amount of hydrogen uptake in the reaction is proportionally increased as corrosion weight gain is elevated. However, pick-up fraction is not affected by the high pressure. The fraction is almost twice greater than that in the waterside corrosion. Edges in the specimens play a certain role in the enhancement, especially in the post-transition regime. To identify physical property changes of oxide film such as micro-cracks or micro-pores, careful and thorough examination must be needed with some special techniques.

• Journal of the Speleological Society of Korea
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• no.76
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• pp.15-17
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• 2006

[ $YBa_2Cu_3O_{7-{\delta}}$ ] superconductor films have been prepared on silver substrates by electrophoretic deposition. As silver does not react with $YBa_2Cu_3O_{7-{\delta}}$ compound and has little influence on its superconductivity, it is usually doped in $YBa_2Cu_3O_7$ to improve the strength of the material and eliminate micro cracks. It has been proved that Ag additive can lower the melting temperature of $YBa_2Cu_3O_{7-{\delta}}$ and act as linking bridge among $YBa_2Cu_3O_{7-{\delta}}$ particles, thus in this paper Ag doped $YBa_2Cu_3O_{7-{\delta}}$ thick films are prepared by electrophoretic co deposition. As there are only some referenced experience formula and models for co electrophoretic deposition and does not exist unified explanation, the behavior of Ag particles during co electrophoretic deposition is also studied.

• Journal of the Korean institute of surface engineering
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• v.37 no.3
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• pp.175-178
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• 2004

The size and number of nano-size defects of thin trivalent chrome layers were determined by small angle neutron scattering (SANS) without breaking the thin chrome layers. Most of defect size of the trivalent chromium prepared in this test conditions is in the range of about 40nm. The number of nano-size defects less than about 40nm of the trivalent chromium layer increases with plating voltage at constant current density From this study, SANS is proved as one of useful techniques to evaluate nano-size defects of thin film layer.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.232-236
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• 2004

The fracture characteristics of unidirectional composite single-lap bonded joints were investigated experimentally and numerically. The effects of bonding method, surface roughness, bondline thickness and the existence of fillet on the failure characteristics and strength of bonded single-lap joints were evaluated experimentally. The failure process, failure mode and the behavior of load-displacement curve was apparently different according to bonding method. The failure load of the specimen co-cured without adhesive was definitely superior to other types of specimens but the specimens co-cured with adhesive film had a less strength than secondary bonded specimens. In the secondary bonded specimens, the lower value of surface roughness and existence of fillet improved the strength of specimens. The strain energy release rates calculated by geometric nonlinear finite element analyses and Virtual Crack Closure Technique for the secondary bonded specimens considering the three types of initial cracks - comer crack, edge crack and delamination crack - were consistent with the test results.