• Title/Summary/Keyword: Filling rate

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The Characteristic of Fresh Properties of Antiwashout Underwater Concrete with Variation of Fly Ash (플라이애쉬를 혼입한 굳지않은 수중불분리성 콘크리트의 특성에 관한 연구)

  • 정병훈;최병우;장희석;김명식
    • Proceedings of the Korea Concrete Institute Conference
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    • 2000.04a
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    • pp.41-46
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    • 2000
  • In recently, though the development of antiwashout admixture, if's possible to construct in underwater with the concrete which is improved segregation resistance of material, filling and self-leveling. It is generally to use this method with Europe and Japan as the central figure, and also the construction case is reported in korea. There's some advantages to add the fly ash in plain concrete. The objective of this study is to find the characteristics of fresh underwater antiwashout concrete which is followed by the blend rate of fly ash.

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Fabrication of Through-hole Interconnect in Si Wafer for 3D Package (3D 패키지용 관통 전극 형성에 관한 연구)

  • Kim, Dae-Gon;Kim, Jong-Woong;Ha, Sang-Su;Jung, Jae-Pil;Shin, Young-Eui;Moon, Jeong-Hoon;Jung, Seung-Boo
    • Journal of Welding and Joining
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    • v.24 no.2
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    • pp.64-70
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    • 2006
  • The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

Preparation and Characterization of Sulfonated Poly (Arylene Ether Sulfone) Random Copolymer-Polyolefin Pore-filling Separators with Metal Ion Trap Capability for Li-ion Secondary Battery (리튬이온 이차전지용 금속이온 선택성 술폰화 폴리아릴렌에테르술폰 공중합체-폴리올레핀 함침격리막 제조 및 특성)

  • Jeong, Yeon Tae;Ahn, Juhee;Lee, Chang Hyun
    • Membrane Journal
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    • v.26 no.4
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    • pp.310-317
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    • 2016
  • Lithium ion secondary battery (LISB) is an energy conversion system operated via charging-discharging cycle based on Lithium ion migration. LISB has a lot of advantages such as high energy density, low self-discharge rate, and a relatively high lifetime. Recently, increasing demands of electric vehicles have been encouraging the development of LISB with high capacity. Unfortunately, it causes some critical safety issues. It includes dendrite formation on negative electrode, resulting in electric shortage problems and battery explosion. Also, the elevated temperatures occurred during the LISB operation induces thermal shrinkage of polyolefin (e.g., polyethylene and polypropylene) separators. Consequently, the low thermal stability leads to decay of LISB performances and the reduction of lifetime. In this study, sulfonated poly (arylene ether sulfone) (SPAES) random copolymers were used as key materials to prepare polyolefin pore-filling separator. The resulting separators were evaluated in the term of metal ion chelation capability associated with dendrite formation, $Li^+$ ion conductivity and thermal durability.

Modeling of Capillary Filling Length in Silwet L-77 Added Poly(Dimethylsiloxane) (PDMS) Microchannels (Silwet L-77 이 포함된 Polydimethylsiloxane(PDMS) 마이크로 채널의 유동 길이 모델링)

  • Lee, Bom-Yee;Lee, Bong-Kee
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.8
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    • pp.823-829
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    • 2014
  • In the present study, simple models were proposed to predict the capillary-driven flow length in a surfactant-added poly(dimethylsiloxane) (PDMS) rectangular microchannel. Owing to the hydrophobic nature of PDMS, it is difficult to transport water in a conventional PDMS microchannel by means of the capillary force alone. To overcome this problem, microchannels with a hydrophilic surface were fabricated using surfactant-added PDMS. By measuring the contact angle change on the surfactant-added PDMS surface, the behavior was investigated to establish a simple model. In order to predict the filling length induced by the capillary force, the Washburn equation was modified in the present study. From the investigation, it was found that the initial rate-of-change of the contact angle affected the filling length. Simple models were developed for three representative cases, and these can be useful tools in designing microfluidic manufacturing techniques including MIcroMolding In Capillaries (MIMIC).

Atomic layer deposition of In-Sb-Te Thin Films for PRAM Application

  • Lee, Eui-Bok;Ju, Byeong-Kwon;Kim, Yong-Tae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.132-132
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    • 2011
  • For the programming volume of PRAM, Ge2Sb2Te5(GST) thin films have been dominantly used and prepared by physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD). Among these methods, ALD is particularly considered as the most promising technique for the integration of PRAM because the ALD offers a superior conformality to PVD and CVD methods and a digital thickness control precisely to the atomic level since the film is deposited one atomic layer at a time. Meanwhile, although the IST has been already known as an optical data storage material, recently, it is known that the IST benefits multistate switching behavior, meaning that the IST-PRAM can be used for mutli-level coding, which is quite different and unique performance compared with the GST-PRAM. Therefore, it is necessary to investigate a possibility of the IST materials for the application of PRAM. So far there are many attempts to deposit the IST with MOCVD and PVD. However, it has not been reported that the IST can be deposited with the ALD method since the ALD reaction mechanism of metal organic precursors and the deposition parameters related with the ALD window are rarely known. Therefore, the main aim of this work is to demonstrate the ALD process for IST films with various precursors and the conformal filling of a nano size programming volume structure with the ALD?IST film for the integration. InSbTe (IST) thin films were deposited by ALD method with different precursors and deposition parameters and demonstrated conformal filling of the nano size programmable volume of cell structure for the integration of phase change random access memory (PRAM). The deposition rate and incubation time are 1.98 A/cycle and 25 cycle, respectively. The complete filling of nano size volume will be useful to fabricate the bottom contact type PRAM.

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Low Cost Via-Hole Filling Process Using Powder and Solder (파우더와 솔더를 이용한 저비용 비아홀 채움 공정)

  • Hong, Pyo-Hwan;Kong, Dae-Young;Nam, Jae-Woo;Lee, Jong-Hyun;Cho, Chan-Seob;Kim, Bonghwan
    • Journal of Sensor Science and Technology
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    • v.22 no.2
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    • pp.130-135
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    • 2013
  • This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

Analysis on the Filling Mode of Propellant Supply System for the Korea Space Launch Vehicle (한국형발사체 추진제공급시스템 충전모드 해석)

  • Lee, Jaejun;Park, Sangmin;Kang, Sunil;Oh, Hwayoung;Jung, Eun Sang
    • Journal of the Korean Society of Propulsion Engineers
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    • v.20 no.4
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    • pp.50-58
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    • 2016
  • Korean Space Launch Vehicle (KSLV-II) Propellant Supply System charges liquid oxygen and kerosene to each propellant tank for the stages. To charge the launch vehicle propellant tank safety, the propellant charge flow rates and scenarios should be defined. First, the Propellant Supply System was modeled with 1D flow analysis program. The control valve capacity and orifice size were calculated by performing the 1D steady state simulation. Second, the 1D transient simulation was performed by using the steady state simulation results. As propellants were being charged at the each tank, the increased tank liquid level decreases the charge flow rate. Consequently, the proposed supply system satisfies the required design charging conditions.

The Effect of Black Stem on the Quality of Expended Stem and Cigarette (Black Stem이 팽화주맥 및 제품담배의 품질에 미치는 영향)

  • Yang, Jin-Chul;Kim, Dae-Young;No, Jae-Seong;Han, Jung-Ho;Chung, Han-Ju;Kim, Yong-Ha;Kim, Yong-Ok
    • Journal of the Korean Society of Tobacco Science
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    • v.32 no.1
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    • pp.1-11
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    • 2010
  • This study was carried out to investigate the influence of stem materials such as black stem on the quality of expended stem and cigarettes. Normal and black stem were separated by tobacco scan and then, those stems were expanded after treating with their respective stem casings. Total sugar, ether extract, ash contents and pH were slightly low in black stem compared with normal stem. However, the number of bacteria and fungi ratio were remarkably higher in black stem than that of normal stem. As compared with normal stems, ratio of rushed stem in rolled process was approximately 2 times higher in black stem with the consequency that the filling capacity of black stem was decreased. The ratio of large particles (> 3.35 mm) of expanded black stem showed decreasing tendency and small particles rate (1.40 mm <) was increased compared with normal stem. When expanded stems were prepared using stem containing 5 levels (0, 10, 20, 30 and 100 %) of black stem, the filling capacity was decreased and static burning rate was significantly decreased with increasing expanded black stem rate. However, the weight and hardness of cigarettes were slightly increased with increasing expanded black stem rate. The contents of phenol compounds, aromatic amines and carbonyl compounds in the cigarette mainstream smoke from the cigarette which was manufactured with various ratio of expended black stem, were gradually increased with increasing expanded black stem rates. Also, the cytotoxicity and the mutagenicity of the TPM were significantly increased with increasing expanded black stem rate. The sensory test result showed that cigarettes blended with 10 and 30 % level of black stem rate was exhibited significantly high sensory attributions such as off-taste, impact, hotness, bitterness and irritation as compared with cigarette blended with normal stem, while smoke fullness and cleanness were slightly decreased with increasing expanded black stem rates. The number of brown spots on cigarettes paper was 2 to 3 times high in cigarettes containing black stem than that of cigarette made from normal stem and were high with increasing black stem rate. The overall assessment in this study suggest, that black stem should not be used because of bad quality of expanded stem and high toxicological activity of cigarette mainstream smoke.

Influence of Seed-filling Temperature on the Seed Quality and Water Soaking Properties of Soybean (등숙온도가 콩의 품질 및 수분흡수 특성에 미치는 영향)

  • Jung, Gun-Ho;Kwon, Young-Up;Lee, Jae-Eun;Kim, Yul-Ho;Kim, Dae-Wook;Son, Beom-Young;Kim, Jung-Tae;Lee, Jin-Seok;Shin, Seong-Hyu;Baek, Seong-Bum;Lee, Byung-Moo;Chung, Ill-Min;Kim, Sun-Lim
    • KOREAN JOURNAL OF CROP SCIENCE
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    • v.58 no.3
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    • pp.308-318
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    • 2013
  • Korean soybean varieties, 'Seonyu' and 'Hwangkeum' were planted in 2012, and three temperature gradient, Tc($19.8^{\circ}C$, ambient temperatured), $Tc+1.7^{\circ}C$, and $Tc+2.5^{\circ}C$, were artificially created by controlling the green house system during seed filling period. Mature seeds that developed under these conditions were analyzed for variances in physicochemical properties. The 100-seed weight and seed-coat ratio of soybean were decreased, but small seed rate was increased by high temperature during seed filling period. Protein content was increased, but oil content was decreased significantly with increasing the seed filling temperature. The decrement of carbon to nitrogen ratio (C/N), and the increment of monosaccharide, fructose and sucrose, in seeds explained that carbohydrate assimilation during seed filling was restricted by high temperature. Rapid increments of seed volume and weight were observed in the seeds of high seed filling temperature, but as soaking time increased the highest values were observed in the seeds of ambient seed filling temperature. The 100-seed weight and seed-coat ratio of soybean were closely related not only to the increment of soaking volume and weight, but also the increments of total dissolved solids (TDS) and electro conductivity (EC). Whereas protein content and C/N ratio showed less relationship with the soaking properties, but they had a positive correlation with TDS and EC. From the results, it was considered that high values of TDS and EC in the seeds of high temperature were mainly due to the incomplete conversion of assimilates into storage compounds. However, sugar content showed less influence on the soaking properties and the values of TDS and EC.