• 제목/요약/키워드: Ferroelectric film

검색결과 513건 처리시간 0.033초

고유전율막의 CMP 특성 (Chemical Mechanical Polishing Characteristics of High-k Thin Film)

  • 박성우;서용진;이우선
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
    • /
    • pp.55-56
    • /
    • 2006
  • In this paper, we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. BST ($Ba_{0.6}Sr_{0.4}TiO_3$), PZT ($Pb_{1.1}(Zr_{0.52}TiO_{0.48})O_3$) and BTO ($BaTiO_3$) ferroelectric film are fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of BST, PZT, BTO films. Their dependence on slurry composition was also investigated. We expect that our results will be useful promise of global planarization for ferroelectric random access memories (FRAM) application in the near future.

  • PDF

Recent Development in Polymer Ferroelectric Field Effect Transistor Memory

  • Park, Youn-Jung;Jeong, Hee-June;Chang, Ji-Youn;Kang, Seok-Ju;Park, Cheol-Min
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • 제8권1호
    • /
    • pp.51-65
    • /
    • 2008
  • The article presents the recent research development in polymer ferroelectric non-volatile memory. A brief overview is given of the history of ferroelectric memory and device architectures based on inorganic ferroelectric materials. Particular emphasis is made on device elements such as metal/ferroelectric/metal type capacitor, metal-ferroelectric-insulator-semiconductor (MFIS) and ferroelectric field effect transistor (FeFET) with ferroelectric poly(vinylidene fluoride) (PVDF) and its copolymers with trifluoroethylene (TrFE). In addition, various material and process issues for realization of polymer ferroelectric non-volatile memory are discussed, including the control of crystal polymorphs, film thickness, crystallization and crystal orientation and the unconventional patterning techniques.

강유전성 박막의 형성 및 수소화 된 비정질실리콘과의 접합 특성 (The Contact Characteristics of Ferroelectrics Thin Film and a-Si:H Thin Film)

  • 허창우
    • 한국정보통신학회논문지
    • /
    • 제7권3호
    • /
    • pp.468-473
    • /
    • 2003
  • 본 연구에서는 박막트랜지스터의 특성 향상을 위하여 강유전성 박막을 게이트 절연층으로 사용하기 위하여 강유전성 박막과 a-Si:H의 계면특성을 조사하였다. 먼저 강유전성 박막 중에 대표적인 SrTiO$_3$를 I-BEAM 증착기로 박막을 형성시켰다. 형성된 박막은 N2 분위기에서 $150^{\circ}C∼600^{\circ}C$로 1시간 ANNEALING하여 전자현미경으로 표면을 측정하였다. SrTiO$_3$의 유전상수는 50∼100 정도였으며 항복전계는 1∼l.5 MV/cm로 매우 우수한 유전특성을 갖고 있었다. 강유전체 박막 위에 a-SiN:H,a-Si:H(n-type a-Si:H) 등을 PECVD로 증착하여 MFNS구조를 형성하였다. 계면특성을 C-V PLOTTER로 측정한 결과 SrTiO$_3$ 박막은 SiN과의 접합이 매우 안정되어 있었고 C-V특성은 SiN/a-Si:H과 유사하였다. 그러나 FERROELECTRIC/a-S:H의 경우가 훨씬 CAPACITANCE 값이 컸으며, 이는 강유전체 박막의 높은 유전상수에 기인 된 것이라 생각된다.

Device characterization and Fabrication Issues for Ferroelectric Gate Field Effect Transistor Device

  • Yu, Byoung-Gon;You, In-Kyu;Lee, Won-Jae;Ryu, Sang-Ouk;Kim, Kwi-Dong;Yoon, Sung-Min;Cho, Seong-Mok;Lee, Nam-Yeal;Shin, Woong-Chul
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • 제2권3호
    • /
    • pp.213-225
    • /
    • 2002
  • Metal-Ferroelectric- Insulator- Silicon (MFIS) structured field effect transistor (FET) device was fabricated and characterized. Important issues to realize ferroelectric gate field effect transistor device were summarized in three sections. The choice of interlayer dielectric was made in the consideration of device functionality and chemical reaction between ferroelectric materials and silicon surface during fabrication process. Also, various ferroelectric thin film materials were taken into account to meet desired memory window and process compatibility. Finally, MFIS structured FET device was fabricated and important characteristics were discussed. For feasible integration of current device as random access memory array cell address schemes were also suggested.

1,4-Diketo-3,6-Diphenyl-Pyrrolo-[3,4c]-Pyrrole(DPP)계 유기안료의 합성 및 흡수스펙트라 (Synthesis and Absorption Spectra of 1,4-Diketo-3,6-Diphenyl-Pyrrolo-[3,4c]-Pyrrole)

  • 김성훈
    • 한국인쇄학회지
    • /
    • 제14권1호
    • /
    • pp.1-15
    • /
    • 1996
  • In this paper, the preparation of lead zirconium titanate(PZT) thin film by sol-gel processing was descried. Thin film coated with thickness of 4${\mu}{\textrm}{m}$ on the stainless steel substrates using the multiple spin-coating process. The crystalline phases of PZT powder and film were investigated by X-ray diffraction pattern and PZT thin film has perovskite structure over 600 C annealing temperature. Corona charging characteristics of the ferroelectric PZT thin film at 600 C were investigated by electrophotographic measurement. A difference in the charging characteristics between positive and negative corona charging was found. The charge acceptance depended in the polarity of corona and the poling of film. According to the D-E hysteresis measurment, PZT thin film can be poled by corona charging without use of top electrode. The remnant polarization in the PZT thin film is generally in the order of 48$\mu$C/$\textrm{cm}^2$. From this results, the ferroelectric PZT thin film will be possible to apply for the add-on type imaging formation.

  • PDF

Effects of Asymmetric Distribution of Charged Defects on the Hysteresis Curves of Ferroelectric Capacitors

  • Lee Kang-Woon;Kim Yong-Il;Lee Won-Jong
    • 마이크로전자및패키징학회지
    • /
    • 제12권3호
    • /
    • pp.219-226
    • /
    • 2005
  • When a ferroelectric film has an inhomogeneous distribution of charged defects, a voltage shift in the polarization curve is induced by the internal field generated in the film. The direction and the magnitude of voltage shift in the P-V hysteresis curves obtained by the Sawyer-Tower method are different from those obtained by the virtual ground method. In this study, the asymmetric behavior in the P-V hysteresis curves of inhomogeneous ferroelectric films was investigated with a physical model and the polarization curves obtained by the Sawyer-Tower and the virtual ground methods are compared.

  • PDF

강유전체막의 CMP 특성 (Chemical Mechanical Polishing (CMP) Characteristics of Ferroelectric BST Thin Film)

  • 박성우;김남훈;이우선;서용진
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
    • /
    • pp.719-722
    • /
    • 2004
  • In this work, we applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film. We compared the structural characteristics of BST $(Ba_{0.6}Sr_{0.4}TiO_3)$ films before and after the CMP process. Their dependence on slurry composition was also investigated. Finally, we suggest the self-developed titania $(TiO_2)$ mixed abrasive slurry (MAS) for FRAM applications. Our experimental results on the ferroelectric film are encouraging for the next generation of FRAM applications.

  • PDF

PZT 박막 캐패시터의 2차 고조파 전류특성 (The Second Harmonic Current Characteristic of PZT Thin Film Capacitor)

  • 김동철;박봉태;고중혁;문병무
    • 한국전기전자재료학회논문지
    • /
    • 제11권8호
    • /
    • pp.596-600
    • /
    • 1998
  • A method for the nondestructive read-out of the memory in ferroelectric thin films is demonstrated using the detection second harmonic currents introduced in the ferrolelectric capacitor as a response to an ac signal. The sign and phase of the second harmonic current depends on the polarized state +$P_r or -P_r$, The studied ferroelectric PZT thin film is found to have desirable features for the use as a memory element. This method and material seems as a promising approach for the nonvolatile memory storage.

  • PDF

BLT박막의 화학적기계적연마 공정시 패턴 크기에 따른 공정 특성 (Process Characteristics by Pattern Size in CMP Process of BLT Films)

  • 신상헌;이우선
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
    • /
    • pp.107-108
    • /
    • 2006
  • In this work, we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. $Bi_{3.25}La_{0.75}Ti_{3}O_{12}$ (BLT) ferroelectric film was fabricated by the sol-gel method. However, there have been serious problems in CMP in terms of repeatability and defects in patterned wafer. Especially, dishing & erosion defects increase the resistance because they decrease the interconnect section area, and ultimately reduce the lifetime of the semiconductor. Cross-sections of the wafer before and after CMP were examined by Scanning electron microscope(SEM). Process characteristics of non-dishing and erosion were investigated.

  • PDF

PZT 박막의 화학.기계적 연마 특성 (Chemical Mechanical Polishing Characteristics of PZT Thin Films)

  • 서용진;이우선
    • 대한전기학회논문지:전기물성ㆍ응용부문C
    • /
    • 제55권12호
    • /
    • pp.549-554
    • /
    • 2006
  • In this paper we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity between electrode and ferroelectric film. $Pb_{1.1}(Zr_{0.52}Ti_{0.48})O_3$ (shortly PZT) ferroelectric film was fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of PZT films. Removal rate, WIWNU% and surface roughness have been found to depend on slurry abrasive types and their hardness, especially, surface roughness and planarity were strongly depends on its pH value. A maximum in the removal rate is observed in the silica slurry, in contrast with the minimum removal rate occurs at ceria slurry. We found that the surface roughness of PZT films can be significantly reduced using the CMP technique.