• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.30-37
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• 2005

We present an air bridge type electrode system with tunable electrode distance for detecting electroactive biomolecules. It is known that the narrower gap between electrode fingers, the higher sensitivity in IDA (interdigitated array) electrode. In previous researches on IDA electrode, narrower patterning required much precise and expensive equipment as the gap goes down to nanometer scale. In this paper, an improved method is suggested to replace nano gap pattering with downsizing electrode distance and showed that the patterning can be replaced by thickness control using metal deposition methods, such as electroplating or metal sputtering. The air bridge type electrode was completed by the following procedures: gold patterning for lower electrode, copper electroplating, gold deposition for upper electrode, photoresist patterning for gold film support, and copper etching for space formation. The thickness of copper electroplating is the distance between upper and lower electrodes. Because the growth rate of electroplating is $0.5{\mu}m\;min^{-1}$, the distance is tunable up to hundreds of nanometers. Completed electrodes on the same wafer had $5{\mu}m$ electrode distance. The gaps between fingers are 10, 20, 30, and $40{\mu}m$ and the widths of fingers are 10, 20, 30, 40, and $50{\mu}m$. The air bridge type electrode system showed better sensitivity than planar electrode.

• Nuclear Engineering and Technology
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• v.38 no.3
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• pp.251-258
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• 2006

This study presents an idea of using analogy concept to the heat transfer studies regarding the HTGR development. Theoretical backgrounds regarding the idea were reviewed. In order to investigate the predictability of a mass transfer system for heat transfer system phenomenology, an electroplating system coupled with a limiting current technique was adopted. Test facilities for laminar forced convection and natural convections under laminar and turbulent conditions were constructed, for which heat transfer correlations are known. The test results showed a close agreement between mass transfer and heat transfer systems, which is an encouraging indication of the validity of the analogy theory and the experimental methodology adopted. This paper shows the potential of the experimental method that validates the little-understood heat transfer phenomena, even in complex geometries such as HTGR.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.04a
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• pp.294-298
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• 2008

The ionic polymer-metal composite actuators with selectively grown multiple electrodes were developed to mimic the swimming locomotion of a fish. The developed method is based on combining electroplating with the electroless chemical reduction using the patterned mask. The advantages of this fabrication method are that the initial compositing between the polymer and platinum particles can be assured by the chemical reduction method, and the thickness of each electrode can be controlled easily and rapidly by electroplating. By using the fabricated actuator with a multiple degree of freedom, the oscillatory wave of the flexible membrane actuator was generated and a twisting motion was also realized to verify the possibility of mimicking the fish-like locomotion. The frequency response function was analyzed to investigate the natural frequency and the damping factor by a mechanical shaker and direct electrical excitation through the swept-sine method. Present results show that this novel method can be a promising technique to easily pattern each of multiple electrodes and to implement the biomimetic motion of the polymer actuators with good mechanical bending performance.

• Journal of Electrochemical Science and Technology
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• v.14 no.4
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• pp.377-387
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• 2023

Ni-W/Al₂O₃ nano-composites were electrodeposited on mild steel substrate for mechanical and corrosion resistance applications. This study focused on the preparation of Ni-W/Al₂O₃ nano-composite coating with various quantity of Al₂O₃ incorporations. The addition of Al₂O₃ in the electrolytes were varied from 1-10 g/L in electrolytes and the Al₂O₃ incorporation in Ni-W/Al₂O₃ nano-composite coatings were obtained from 1.82 to 13.86 wt.%. The incorporation of Al₂O₃ in Ni-W alloy matrix influenced the grain size, surface morphology and structural properties were observed. The distributions of Al₂O₃ particle in alloy matrix were confirmed using electron microscopy (FESEM and TEM) and EDAX mapping analysis. The crystal structure informations were studied using X-ray diffraction method and it confirms that the deposits having cubic crystal structure. The better corrosion rate (0.87 mpy) and microhardness (965 HV) properties were obtained for the Ni-W/Al₂O₃ nano-composite coating with 13.86 wt.% of Al₂O₃ incorporations.

• Korean Journal of Materials Research
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• v.29 no.4
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• pp.228-232
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• 2019

Copper electroplating and electrode patterning using a screen printer are applied instead of lithography for heterostructure with intrinsic thin layer(HIT) silicon solar cells. Samples are patterned on an indium tin oxide(ITO) layer using polymer resist printing. After polymer resist patterning, a Ni seed layer is deposited by sputtering. A Cu electrode is electroplated in a Cu bath consisting of $Cu_2SO_4$ and $H_2SO_4$ at a current density of $10mA/cm^2$. Copper electroplating electrodes using a screen printer are successfully implemented to a line width of about $80{\mu}m$. The contact resistance of the copper electrode is $0.89m{\Omega}{\cdot}cm^2$, measured using the transmission line method(TLM), and the sheet resistance of the copper electrode and ITO are $1{\Omega}/{\square}$ and $40{\Omega}/{\square}$, respectively. In this paper, a screen printer is used to form a solar cell electrode pattern, and a copper electrode is formed by electroplating instead of using a silver electrode to fabricate an efficient solar cell electrode at low cost.

• Journal of the Korean Society of Safety
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• v.12 no.4
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• pp.93-101
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• 1997

A modified procedure for electroplating wastewater treatment using formaldehyde and hydrogen peroxide can destroy free cyanide. The representative diagram which is quite sensitive on reaction temperature is showed for this kinds of treatment. Principally free cyanide and some kinds of cyanide complex should be treated first, and then toxic heavy metals can be removed because cyanide component will be inhibited to remove other pollutants, if it is not destroyed perfectly. Formaldehyde and hydrogen peroxide are added in controlled amounts to cyanide treatment tank. Reasonable amounts of these chemicals are (HCHO/CN)=0.9 and ($H_2O_2/CN$)=1.1 in molar ratios, it is also variable on reaction temperature. Of course, actual treatment processes depending on plating material and chemical are good applicable, also to systematize operation manual for treating electroplating wastewater process, further works are desirable.

• Journal of the Korean institute of surface engineering
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• v.34 no.1
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• pp.49-55
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• 2001

The addition of organic compound containing -COOH, X$800_2$, -CHO group such as formic acid, formamide, formaldehyde or diethyleneamine to a chromium electroplating bath results in a chromium deposit in which carbon is incorporated. Such deposits have fewer defects than chromium layers produced by a conventional method. It was found that the as-deposited layers were amorphous and auger electron spectroscopy (AES) showed that carbon is distributed uniformly in the deposit. During heat treatment, Cr-C deposits began to crystallize at $400^{\circ}C$, and at $800^{\circ}C$ they were crystallized into chromium carbides and oxides. The effects of current density, amount of additives, applied current waveform on Cr-C alloy electroplating were examined.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.51-54
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• 2019

The electrodeposition of rhodium (Rh) on silicon substrate at different current conditions were investigated. The cracks were found at high current density during the direct current (DC) plating. The pulse current (PC) plating were applied to avoid the formation of cracks on the deposits. Off time in the pulse plating relieved the residual stress of the Rh deposits and consequently the current conditions for the crack-free Rh deposits were obtained. Optimum pulse current (PC) condition is 5:5 (on:off) for the crack-free Rh electroplating.

• Journal of the Korean Professional Engineers Association
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• v.14 no.1
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• pp.22-29
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• 1981

This study concernes the decomposition of cyanide ion in electroplating plant wastewater and COD variation of photodeveloping wastewater under various conditions. Determinations of CN- concentration were carried out by AgNO$_3$ titration method. The sample solutions were pretreated by passing ozone and decompositions were checked as a function of time for ozone treatment. Analysis of film developing wastewater was carried out by KMnO$_4$ method. Electroplating plant wastewater was also examined at various pH; decomposition rate of cyanide ion was found to increase at higher pH. Time required for the decomposition could be shortened by removing the heavy metal ions under alkaline condition. The effect of temperature on decomposition was studied at 40$^{\circ}$ and 60$^{\circ}C$. The result was better at 40$^{\circ}C$ although time for decomposition was almost same at both temperatures. Analysis of film developing wastewater revealed that COD decrease was faster during the first 1 to 2 hours. However, further decrease could not be effected. The existence of unknown special organics resistant to the decomposition was believed to be the reason.