1 |
F. Wang, R. Cheong, and X. Li, "MEMS Vertical Probe Cards with Ultra Densely Arrayed Metal Probes for Wafer-Level IC Testing", J. Microelectromech. Sys., 18(4), 933 (2009).
DOI
|
2 |
B. H. Kim, H. C. Kim, S. D. Choi, K. Chun, J. B. Kim, and J. H. Kim, "A Robust MEMS Probe Card with Vertical Guide for a Fine Pitch Test", J. Micromech. Microeng., 17(7), 1350 (2007).
DOI
|
3 |
T. Itoh, K. Kataoka, and T. Suga, "Characteristics of Low Force Contact Process for MEMS Probe Cards", Sensors and Actuators A: Physical, 97, 462 (2002).
DOI
|
4 |
Y. Cho, T. Kuki, Y. Fukuta, H. Fujita, and B. Kim, "Fabrication of Sharp Knife-Edged Micro Probe Card Combined with Shadow Mask Deposition", Sensors and Actuators A: Physical, 114(2-3), 327 (2004).
DOI
|
5 |
B. H. Kim, and J. B. Kim, "Design and Fabrication of a Highly Manufacturable MEMS Probe Card for High Speed Testing", J. Micromech. Microeng., 18(7), 075031 (2008).
DOI
|
6 |
H. C. Huang, S. T. Chung, S. J. Pan, W. T. Tsai, and C. S. Lin, "Microstructure Evolution and Hardening Mechanisms of Ni-P Electrodeposits", Surf. Coat. Tech., 205(7), 2097 (2007).
DOI
|
7 |
T. Itoh, S. Kawamura, K. Kataoka, and T. Suga, "Electroplated Ni Microcantilever Probe with Electrostatic Actuation", Sensors and Actuators A: Physical, 123, 490 (2005).
DOI
|
8 |
N. G. Kim, and Y. B. Sun, "Effect of Electroplating Parameters on Conductivity and Hardness of Ni-P Alloy", J. Microelectron. Packag. Soc., 24(3), 77 (2017).
DOI
|
9 |
B. P. Daly, and F. J. Barry, "Electrochemical Nickel-Phosphorus Alloy Formation", Inter. Mater. Rev., 48(5), 326 (2013).
DOI
|
10 |
A. M. Pillai, A. Rajendra, and A. K. Shirma, "Electroplated Nickel-Phosphorous Alloy Coating: an in-depth Study of Its Preparation, Properties, and Structural Transitions", J. Coat. Tech. Resear., 9(6), 785 (2012).
DOI
|
11 |
K. Y. Lee, H. J. Won, S. W. Jun, T. S. Oh, J. Y. Byun, and T. S. Oh, "Electrical Resistivity and Solder Reaction Characteristics of Ni Films Fabricated by Electroplating", J. Microelectron. Packag. Soc., 12(3), 253 (2005).
|
12 |
Y. Li, H. Jiang, D. Wang, and H. Ge, "Effects of Saccharin and Cobalt Concentration in Electrolytic Solution on Micro Hardness of Nanocrystalline Ni-Co Alloys", Surf. Coat. Tech., 202(20), 4952 (2008).
DOI
|
13 |
L. Wang, Y. Gao, Q. Xue, H. Liy, and T. Xu, "Microstructure and Tribological Properties of Electrodeposited Ni-Co Alloy Deposits", Appl. Surf. Sci., 242(3-4), 326 (2005).
DOI
|
14 |
Y. Li, H. Jiang, W. Haung, and H. Tian, "Effects of Peak Current Density on the Mechanical Properties of Nanocrystalline Ni-Co Alloys Produced by Pulse Electrodeposition", Appl. Surf. Sci., 254(21), 6865 (2008)
DOI
|
15 |
M. Zamani, A. Amadeh, and S. M. Laribaghal, "Effect of Co Content on Electrodeposition Mechanism and Mechanical Properties of Electrodeposited Ni-Co Alloy", Transactions of Nonferrous Metals Society of China, 26(2), 484 (2016).
DOI
|
16 |
R. Orinakova, A. Turonova, D. Kladekova, M. Galova, and R. M. Smith, "Recent Developments in the Electrodeposition of Nickel and Some Nickel-Based Alloys", J. Appl. Electrochem., 36(9), 957 (2005).
DOI
|
17 |
S. H. Hassani, K. Raeissi, and M. A. Golozar, "Effects of Saccharin on the Electrodepostition of Ni-Co Nanocrystalline Coatings", J. Appl. Electrochem., 38(5), 689 (2008).
DOI
|
18 |
D. Pletcher, and R. Urbina, "Electrodeposition of Rodium Part 1. Chloride Solutions", J. Electroanal. Chem., 421(1-2), 137 (1997).
DOI
|
19 |
D. Pletcher, and R. Urbina, "Electrodeposition of Rhodium Part 2. Sulfate Solutions", J. Electroanal. Chem., 421(1-2), 145 (1997).
DOI
|
20 |
M. Arbib, B. Zhang, V. Lazarov, D. Stoychev, A. Milchev, and C. Buess-Herman, "Electrochemical Nucleation and Growth of Rhodium on Gold Substrates", J. Electroanal. Chem., 510 (1-2), 67 (2001).
DOI
|
21 |
R. T. S. Oliveira, M. C. Santos, L. O. S. Bulhoes, and E. C. Pereira, "Rh Electrodeposition on Pt in Acidic Medium: a Study Using Cyclic Voltammetry and an Electrochemcial Quartz Crystal Microbalance", J. Electroanal. Chem., 569(2), 233 (2004).
DOI
|
22 |
A. V. Belyaev, M. A. Fedotov, and S. N. Shagabutdinova, "State of Rhodium(III) in Sulfuric Acid Solutions", Russ. J. Corrod. Chem., 33(2), 136 (2007).
DOI
|
23 |
J. C. Puippe, and F. Leaman, "Theory and Practice of Pulse Plating", pp.1-11 AESFS, Orlando (1986).
|
24 |
S. Langerock, and L. Heerman, "Study of the Electrodeposition of Rhodium on Polycrystalline Gold Electrode by Quartz Microbalance and Voltammetric Techniques", J. Electrochem. Soc., 151(3), C155 (2004).
DOI
|