• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1627-1628
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• 2006

In this paper, mesoporous only platinum electrode and micro pore platinum electrode with mesoporous Pt are fabricated and characterized on a silicon substrate to check their usability as enzymeless sensing electrodes for developing non-disposable glucose sensors integrated with silicon CMOS read out circuitry. Since most of electrochemical glucose sensors are disposable due to the use of the enzymes that are living creatures, these are limited to use in the in-vivo and continuous monitoring system applications. The proposed mesoporous Pt electrode with approximately 2.5nm in pore diameter and 150nm in height was fabricated by using a nonionic surfactant $C_{16}EO_8$ and an electroplating technique. The micro pore Pt electrode with mesoporous Pt means the mesoporous Pt electrode fabricated on top of micro pore arrayed Pt electrode with approximately $10{\mu}m$ in pore diameter and $80{\mu}m$ in height. The measured current responses at 10mM glucose solution of plane Pt, micro pore Pt, micro pore with mesoporus Pt, and mesoporous Pt electrodes are approximately $9.9nA/mm^2$, $92.4nA/mm^2$, $3320nA/mm^2$ and $44620nA/mm^2$, respectively. These data indicate that the mesoporous Pt electrode is much more sensitive than the other Pt electrodes. Thus, it is promising for non-disposable glucose sensor and electrochemical sensor applications.

• Journal of Sensor Science and Technology
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• v.17 no.5
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• pp.369-374
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• 2008

A novel fiber optic surface plasmon resonance (SPR) sensor using cyclic olefin copolymer (COC) prism with the spectral modulation is presented. The SPR sensor chip is fabricated using the SU-8 photolithography, Ni-electroplating and COC injection molding process. The sidewall of the COC prism is partially deposited with Au/Cr (45/2.nm thickness) by e-beam evaporator, and the thermal bonding process is conducted for micro fluidic channels and optical fibers alignment. The SPR spectrum for a phosphate buffered saline (0.1.M PBS, pH.7.2) solution shows a distinctive dip at 1300.nm wavelength, which shifts toward longer wavelength with respect to the bovine serum albumin (BSA)concentrations. The sensitivity of the wavelength shift is $1.16\;nm{\cdot}{\mu}g^{-1}{\cdot}{\mu}l^{-1}$. From the wavelength of SPR dips, the refractive indices (RI) of the BSA solutions can be theoretically calculated using Kretchmann configuration, and the change rate of the RI was found to be $2.3{\times}10^{-5}RI{\cdot}{\mu}g^{-1}{\cdot}l^{-1}$. The realized fiber optic SPR sensor with a COC prism has clearly shown the feasibility of a new disposable, low cost and miniaturized SPR biosensor for biochemical molecular analyses.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.19-23
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• 2015

In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.1
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• pp.33-42
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• 2011

In this study, we investigated the natural convection on the outer surface of a vertical pipe by performing mass transfer experiments using fluids with high Pr number using the concept of analogy between heat and mass transfer. A cupric acid-copper sulfate electroplating system was adopted as the mass transfer system. Tests were performed for $Ra_H$ numbers from $1.4{\times}10^9$ to $4{\times}10^{13}$, Pr numbers from 2,094 to 4,173, and diameters from 0.005 m to 0.035 m. The test results for laminar flow conditions were in good agreement with the correlations reported by King, Jakob and Linke, McAdam, and Bottemanne, and those for turbulent conditions with the correlations presented by Fouad for a vertical plate and also proved the dependence on Pr numbers. The obtained correlations were $Nu_H=0.55Ra^{0.25}_H$ for laminar and $Nu_H=0.12Ra^{0.28}_HPr^{0.1}$ for turbulent. The transition between laminar and turbulent occurs at $Ra_H$ of about $10^{12}$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.7
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• pp.17-25
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• 2017

To resolve the problem of the temperature rise in LED or OLED lighting, until now a thick metal film has been used as a heat-sink. Conventionally, this thick metal film is made by the electroplating method and used as the heat-dissipating plate of the electronic devices. However, nowadays there is increasing need for a Cu metal film with a thickness of several hundred micrometers that can be formed by the dry deposition method. In this work, we designed and fabricated a Cu film deposition system where the heating element is separated from the ceramic crucible, which makes ultra-rapid deposition possible by preventing heat loss. In addition, the resulting induction heating also contributes to the high deposition rate. By tuning the various parameters, we obtained a $100-{\mu}m$ thick Cu film whose heat conductivity is high and whose thickness uniformity is better than 2%, while the deposition rate is as high as $1000{\AA}/s$.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.9-12
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• 2006

We have designed and fabricated micro power generators by electroplating which is important in MEMS(micro electro mechanical system) technique. We have electroplated MEMS coils on the glass substrates and have chosen one of these coils for experiments. The thickness, width, and length of the coil are $7{\mu}m,\;20{\mu}m$, and 1.6 m, respectively. We have analyzed the structure of MEMS coil by SEM. We have made a vibrating system for reproducible results in measurement. With reciprocating a magnet on the surface of a fabricated winding coil, the micro power generator produce an alternating voltage. We have changed the vibrational frequency from 0.5 Hz to 8 Hz. The generated voltage was 106 mV at 3 Hz and 198 mV at 6 Hz. We aim at the micro power generator which can change vibration energy to useful electric energy.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.288-294
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• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.3
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• pp.259-268
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• 2012

This study measured the natural-convection heat transfer of two vertically staggered cylinders with varying vertical pitch-to-diameter ($P_v$/D) and horizontal pitch-to-diameter ($P_h$/D) ratios. The measured heat-transfer rates for the lower cylinder agreed well with the existing heat-transfer correlations for a single cylinder. At the smallest $P_v$/D, the rising plume from the lower cylinder provides the upper cylinder with a preheated flow, and the heat-transfer rates of the upper cylinder decrease, but increase very sensitively with $P_h$/D. However, at the largest $P_v$/D, the velocity effect dominates, and the heat-transfer rates of the upper cylinder are larger than that of a single cylinder, and decrease less sensitively with $P_h$/D. Even if $P_h$/D is increased, the heat-transfer rate of the upper cylinder is higher than that of the lower cylinder because of the chimney and side flow effects. This work expanded the flow ranges to turbulent flows. The cupric acid-copper sulfate ($H_2SO_4-CuSO_4$) electroplating system was adopted for the measurements of the mass-transfer rates instead of the heat-transfer experiments based on the analogy concept. The measurements were made by varying $P_v$/D (1.02-5) and $P_h$/D (0-2) in both laminar and turbulent flows. The Rayleigh number ranged from $1.5{\times}10^8$ to $2.5{\times}10^{10}$, and the Prandtl number was 2,014.

• Journal of Energy Engineering
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• v.21 no.1
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• pp.18-25
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• 2012

This work investigated the influence of the chimney dimensions(exit and entrance length, and diameter) on the heat transfer of a vertical cylinder in a duct. The measured mass transfer rates for the natural convection of vertical cylinder in a duct were presented for Prandlt number 2,094, Rayleigh number in the range of $4.55{\times}10^9$, $5.79{\times}10^{10}$, and $1.69{\times}10^{11}$. Experiments were performed using a copper sulfate electroplating system to simulate heat transfer based upon the analogy concept. The diameter of the duct was varied from 0.06 m to 0.14 m, and the heights from 0.30 m to 1.10 m. Nusselt numbers measured at open channel condition agreed well with the existing laminar heat transfer correlations for vertical plate developed by Le Fevre. The increase of the exit length enhanced the heat transfer up to a certain duct height but further increase does not affects the heat transfer. The heat transfer decreased with increasing the entrance length up to a certain duct height and was constant at further increase. The Nusselt number decreased with increasing the diameter of duct, until Nusselt number becomes similar to that at open channel beyond a certain diameter.

• Applied Chemistry for Engineering
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• v.23 no.3
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• pp.313-319
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• 2012

In this work, the electroplating of copper was introduced on PAN-based carbon fibers for the enhancement of mechanical interfacial strength of carbon fibers-reinforced composites. The surface properties of carbon fibers were determined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and contact angle measurements. Its mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). From the results, it was found that the mechanical interfacial properties of Cu-plated carbon fibers-reinforced composites (Cu-CFRPs) enhanced with increasing the Cu plating time, Cu content and COOH group up to Cu-CFRP-30. However, the mechanical interfacial properties of the Cu-CFRPs decreased dramatically in the excessively Cu-plated CFRPs sample. In conclusion, the presence of Cu particles on carbon fiber surfaces can be a key factor to determine the mechanical interfacial properties of the Cu-CFRPs, but the excessive Cu content can lead the failure due to the interfacial separation between fibers and matrices in this system.