• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.4
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• pp.15-22
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• 2004

This paper presents the channel analysis considering power distribution network(PDN) system of PCB. For achieve the target PDN system we proposed the useful design approach for acquiring the characteristic target of power distribution network in overall frequency ranges. The proposed method is based on the hierarchical approach related to frequency ranges and the path-based equivalent circuit model to consider the interference of the current paths between the decoupling capacitors and the board through it is a lumped model for fast and easy calculation, experimental results show that the proposed model is almost as precise as the numerical analysis. The analysis of PDN system shows that although the effective inductance of package dominatly affects the power noise and the signal transfer through data channel, the board PDNs also can not be neglected for achieving the accurate channel signaling. Therefore, we must design concurrently the chip, package, and board from the initial spec design of high speed digital system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.1
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• pp.33-40
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• 2023

With the development of supercomputing technology and hardware technology, numerical computation methods are also being advanced. Accordingly, improved weather prediction becomes possible. In this paper, we propose to apply the LAPACK(Linear Algebra PACKage) BLAS(Basic Linear Algebra Subprograms) library to the linear algebraic numerical computation part within the source code to improve the performance of the cumulative parametric code, Unicon(A Unified Convection Scheme), which is included in SCAM(Single-Columns Atmospheric Model, simplified version of CESM(Community Earth System Model)) and performs standby operations. In order to analyze this, an overall execution structure diagram of SCAM was presented and a test was conducted in the relevant execution environment. Compared to the existing source code, the SCOPY function achieved 0.4053% performance improvement, the DSCAL function 0.7812%, and the DDOT function 0.0469%, and all of them showed a 0.8537% performance improvement. This means that the LAPACK BLAS application method, a library for high-density linear algebra operations proposed in this paper, can improve performance without additional hardware intervention in the same CPU environment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.99-99
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• 2009

Two different micro-flows during the evaporation of ink droplets were achieved by engineering both surface tension gradient and compositional gradient across the ink droplet: (1) Coffee-ring generating flow resulting from the outward flow inside the ink droplet & (2) Marangoni flow leading to the circulation flow inside the ink droplet. The surface tension gradient and the compositional gradient in the ink droplets were tailored by mixing two different solvents with difference surface tension and boiling point. In order to create the coffee-ring generating flow (outward flow), a single-solvent system using N,N-dimethylformamide with nano-sized spherical alumina particles was formulated, Marangoni flow (circulation flow) was created in the ink droplets by combining N,N-dimethylformamide and fotmamide with the spherical alumina powders as a co-solvent ink system. We have investigated the effect of these two different flows on the formation of ceramic films by inkjet printing method, The packing density of the ceramic films printed with two different ink systems (single- and co-solvent systems) and their surface roughness were characterized. The dielectric properties of these inkjet-printed ceramic films such as dielectric constant and dissipation factor were also studied in order to evaluate the feasibility of their application to the electronic ceramic package substrate.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.12
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• pp.1075-1083
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• 2016

Nowadays, the use of wireless input devices has been increasing on the basis of high convenience and portability. In particular the most widely used wireless keyboard and the mouse to use the 2.4 GHz frequency band, but due to the third party receives the electromagnetic wave from leaking when the radio equipment it is easy to obtain the personal information and the vulnerability is also being reported consistently. In this paper, implement a system to analyze and manipulate the packets of 2.4 GHz wireless keyboard and mouse using USRP device and GNU Radio package for verify the vulnerability of 2.4 GHz wireless keyboard and mouse. Using the construction system has attained a equipment specific address and key information by analyzing the communication protocol and the packet structure of the device was proved that a user can operate the PC to send the random key from long distance.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• The Journal of Fisheries Business Administration
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• v.35 no.1
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• pp.57-85
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• 2004

To develop an blue tourism website(BTW) for electronic commerce(EC), information requirements of BTW are defined firstly. We defined information requirements of BTW from two aspects, i.e., front office and back office. Information requirements for front office were derived by consumer purchasing decision process. And information requirements for back office were derived by tourism value chain. Total 29 functions are identified as critical EC related functions of BTW. Among them, 25 functions were investigated into BTW. BTWs were searched by search engines - Yahoo and Empas - to Korean websites. There are 12 specialized BTWs, except one cyber museum website. For 12 websites, 25 functions were probed. By the results, in need recognition stage of blue tourism, only weather information was provided in most websites. In information search stage of blue tourism, package recommendation and various contents were provided in most websites. In consumption stage of blue tourism, traffic information were provided in most websites. And in after - sales service stage of blue tourism, bulletin board function was implemented in most websites. The rest of the functions were scarcely implemented. On the whole, it was concluded that most EC related functions of BTW in Korea were not implemented properly. To improve the status quo, it is expected in the dimension of individual website, that marketing planning, customized service, intelligent service, reinforcing purchasing assistance functions, customer relationship management, and escrow service etc. need to be implemented. And it is expected in the dimension of blue tourism industry, that standardizing product catalog, security assistance policy, information sharing by industrial database, finding referral model of BTW, elevating information mind, revising related laws etc. are needed.

• Journal of the Society of Disaster Information
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• v.15 no.1
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• pp.28-38
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• 2019

Purpose: The purpose of this study is to contribute to improvement of measurement management level of construction structure and technology development of monitoring sensor by presenting the detailed causes and improvement plans of construction monitoring sensor's decline in durability. Method: The causes and improvement plans of the durability degradation of the construction monitoring sensor were divided into the construction field and the electric, electronic field. The detailed status was reviewed. Results: In the field of construction, approval and inspection, inspection and testing, verification and calibration, and minimization of loss and damage ratio were reviewed. In the field of electric and electronics, sensor package and sealing, disconnection of stress concentration area, damage caused by lightning and corrosion were reviewed. Conclusion: It is expected that the durability of monitoring sensors applied to the construction site will become longer than the present status based on the study that analyzed causes and improvement plans of construction monitoring sensor's decline in durability in the field of construction and electric, electronic devices.

• The Journal of the Korea institute of electronic communication sciences
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• v.16 no.1
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• pp.125-134
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• 2021

With the rapid development of the film industry, the number of films is significantly increasing and movie recommendation system can help user to predict the preferences of users based on their past behavior or feedback. This paper proposes a movie recommendation system based on the latent factor model with the adjustment of mean and bias in rating. Singular value decomposition is used to decompose the rating matrix and stochastic gradient descent is used to optimize the parameters for least-square loss function. And root mean square error is used to evaluate the performance of the proposed system. We implement the proposed system with Surprise package. The simulation results shows that root mean square error is 0.671 and the proposed system has good performance compared to other papers.