1 |
J.Kim, and M.Swaminathan, 'Modeling of irregular shaped power distribution planes using transmission matrix method,' IEEE Transactions on Advanced Packaging, Vol.24, no.3, pp.334-346, Aug, 2001
DOI
ScienceOn
|
2 |
Yong-Ju Kim, et al, 'A New Circuit Model for Power Plane Considering Decoupling Capacitance in Multi-Layer Digital Applications', IEEE proceeding on Electrical Performance of Electronic Packaging,(Monterey, CA), pp.187-190, Oct. 2002
DOI
|
3 |
D.Herrel and B.Becker, 'Modeling of power distribution system for high performance microprocessors,' IEEE Transactions on Advanced Packaging, vol.22, no.3, pp.240-248, Aug. 1999
DOI
|