• Applied Chemistry for Engineering
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• v.32 no.6
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• pp.700-705
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• 2021

A portable and disposable pH sensor based on Ti wire was successfully developed for monitoring hydronium ion concentrations. A sensing electrode was prepared by electrochemically depositing iridium oxide onto a Ti wire, while a reference electrode was fabricated by coating Ag/AgCl ink on a Ti wire. Combining the two electrodes in the pH sensor enabled the collection of open circuit potential signals when the sensor was immersed in solutions of various pH values. The pH sensor exhibited excellent electrochemical sensing performance in terms of sensitivity, response time, repeatability, selectivity, and stability. To demonstrate point-of-measurement applications, the pH sensor was integrated with a wireless electronic module that could communicate with a mobile application. The portable pH sensor accurately measured pH changes in real samples. The results obtained were consistent with those of using a commercial pH meter.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.86-90
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• 2023

The packaging of electronic devices performs a protective function to ensure that their durability and reliability are not affected by changes in the operating environment caused by external factors. Recent advances in materials have led to ongoing research into bonded packaging of heterogeneous materials such as polymers and inorganic materials in electronic devices. In this packaging process, it is important to have a binding that joins the materials and ensures the operating environment, which includes adhesion to the substrate, corrosion and oxidation resistance through moisture removal, and durability. In this study, the hygroscopicity of the coating layer by modifying the polymer surface based on PVA was evaluated by controlling and measuring the contact angle, and the adhesion was confirmed by applying water-based ink and testing according to ASTM_D3363. For the durability of the polymer surface, the IPL post-treatment process was used to improve the hardness and toughness against applied voltage, and the pencil hardness test and nanoindentation test were conducted. Through this, we analyzed and proposed solutions to ensure the reliability and durability of polymer devices in polymer microfabrication against environmental factors such as moisture, temperature fluctuations and adhesion, and surface abrasion.

• Journal of the Korean Vacuum Society
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• v.22 no.3
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• pp.156-161
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• 2013

We fabricated transparent conductive electrodes with silver (Ag) nanofibers by electrospinning process. Ag nanofibers have high aspect ratio and fused junctions which result in low sheet resistance. Electrospinning is a fast and efficient process to fabricate continuous one-dimensional (1D) nanofibers. Ag/polymer ink were prepared in polymer matrix solution by a sol-gel method. Then, Ag/polymer nanofibers precursors are heated at $200{\sim}500^{\circ}C$ in air for 2 h to eliminate partially the polymers. The topographical features of the Ag nanofibers were characterized by FE-SEM, and the electrical property was analyzed through I-V measurement system. Finally, optical property was measured using UV/VIS spectroscopy. The transparent conductive electrodes with Ag nanofibers exhibited a sheet resistance (Rs) of $250{\Omega}/sq$ at a transparency (T) of 83%. Transparent conductive films, contain the Ag nanofibers as conductive materials, have good electrical, optical, and mechanical properties. Therefore, it is expected to be useful for the application of flexible display in the future.

• Polymer(Korea)
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• v.33 no.4
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• pp.347-352
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• 2009

Charged organic-inorganic composite particles were prepared for the application to electrophoretic display technology such as electronic paper. $TiO_2$ and $Co_3O_4$ particles were used for core particles and were coated with poly(methyl methacrylate) by dispersion polymerization. Composite particles were endowed with charge moiety for electrophoresis; positive charge for $TiO_2$ and negative charge for $Co_3O_4$ composite particles. Scanning electron microscopic results revealed that the charged composite particles have spherical shape. Densities of the composite particles were controlled to be that of medium of electrophoresis. Density of $TiO_2$ particle changed from 4.02 to 1.44 g/$cm^3$ after the polymer coating, and that of $Co_3O_4$ particles changed from 6.11 to 1.49 g/$cm^3$. Urea, melamine, and formaldehyde were used as wall materials for capsule, and microcapsule containing black or white particles inside were prepared by in-situ polymerization. Microcapsule showed the inspection by a video microscope demonstrated the formation of uniform transparent capsules.

• Tribology and Lubricants
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• v.32 no.3
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• pp.75-81
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• 2016

Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm², the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm², however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.