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A Study on the Control of Hygroscopicity and Hardness in Polymer Surfaces

고분자 표면의 흡습성 및 경도 제어 연구

  • Jinil Kim (Department of Cogno-Mechatronics Engineering, Pusan National University) ;
  • Young Nam Jung (Department of Opto-Mechatronics Engineering, Pusan National University) ;
  • Doa Kim (Materials and Components Research Division, Electronics and Telecommunications Research Institute (ETRI)) ;
  • Myung Yung Jeong (Department of Cogno-Mechatronics Engineering, Pusan National University)
  • 김진일 (부산대학교 인지메카트로닉스공학과) ;
  • 정영남 (부산대학교 광메카트로닉스공학과) ;
  • 김도아 (한국전자통신연구원(ETRI) 스마트소재연구실) ;
  • 정명영 (부산대학교 인지메카트로닉스공학과)
  • Received : 2023.12.20
  • Accepted : 2023.12.30
  • Published : 2023.12.30

Abstract

The packaging of electronic devices performs a protective function to ensure that their durability and reliability are not affected by changes in the operating environment caused by external factors. Recent advances in materials have led to ongoing research into bonded packaging of heterogeneous materials such as polymers and inorganic materials in electronic devices. In this packaging process, it is important to have a binding that joins the materials and ensures the operating environment, which includes adhesion to the substrate, corrosion and oxidation resistance through moisture removal, and durability. In this study, the hygroscopicity of the coating layer by modifying the polymer surface based on PVA was evaluated by controlling and measuring the contact angle, and the adhesion was confirmed by applying water-based ink and testing according to ASTM_D3363. For the durability of the polymer surface, the IPL post-treatment process was used to improve the hardness and toughness against applied voltage, and the pencil hardness test and nanoindentation test were conducted. Through this, we analyzed and proposed solutions to ensure the reliability and durability of polymer devices in polymer microfabrication against environmental factors such as moisture, temperature fluctuations and adhesion, and surface abrasion.

본 연구에서는 패키지에 활용될 수 있는 PVA 고분자 표면의 표면 특성을 흡습성과 경도를 중심으로 향상을 위한 연구를 수행하였다. 접촉각 측정을 통해 표면의 흡습성 특성을 평가하였으며, ASTM_D3363 규격에 준하여 부착력을 평가하였다. 또한, 고분자 표면의 내구성 향상을 위하여, IPL 공정의 파라미터에 따른 경도 및 인성을 연필경도 및 나노인덴테이션 시험으로 특성을 평가하였다. 이와 같은 방법을 통해 0.06N/m의 높은 표면 에너지와 6H의 연필경도, 0.52GPa을 경도를 달성하였다. 이를 통해 고분자 마이크로 패키징에 있어 고분자와 무기물간 이종 소재의 접합 패키징에도 소재들을 견고히 결합하고 악조건 속에서도 작동 환경을 유지하는 접합을 구현하여 습기, 온도 변동 및 부착력, 표면 마모 같은 환경 요인에 대한 고분자 소자의 신뢰성 및 내구성 향상 방법을 제시하였다.

Keywords

Acknowledgement

본 논문은 부산대학교 기본연구지원사업(2년)에 의하여 연구되었음.

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