• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• 마이크로전자및패키징학회지
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• 제25권1호
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• pp.41-45
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• 2018

기술의 발전과 전자기기의 소형화와 함께 반도체의 크기는 점점 작아지고 있다. 이와 동시에 반도체 성능의 고도화가 진행되면서 입출력 단자의 밀도는 높아져 패키징의 어려움이 발생하였다. 이러한 문제를 해결하기 위한 방법으로 산업계에서는 팬아웃 웨이퍼 레벨 패키지(FO-WLP)에 주목하고 있다. 또한 FO-WLP는 다른 패키지 방식과 비교해 얇은 두께, 강한 열 저항 등의 장점을 가지고 있다. 하지만 현재 FO-WLP는 생산하는데 몇 가지 어려움이 있는데, 그 중 한가지가 웨이퍼의 휨(Warpage) 현상의 제어이다. 이러한 휨 변형은 서로 다른 재료의 열팽창계수, 탄성계수 등에 의해 발생하고, 이는 칩과 인터커넥트 간의 정렬 불량 등을 야기해 대량생산에 있어 제품의 신뢰성 문제를 발생시킨다. 이러한 휨 현상을 방지하기 위해서는 패키지 재료의 물성과 칩 사이즈 등의 설계 변수의 영향에 대해 이해하는 것이 매우 중요하다. 이번 논문에서는 패키지의 PMC 과정에서 칩의 두께와 EMC의 두께가 휨 현상에 미치는 영향을 유한요소해석을 통해 알아보았다. 그 결과 특정 칩과 EMC가 특정 비율로 구성되어 있을 때 가장 큰 휨 현상이 발생하는 것을 확인하였다.

• 분석과학
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• 제18권5호
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• pp.410-418
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• 2005

PCBs는 뛰어난 물리 화학적, 열적 안전성과 전기 절연성으로 인해 윤활유, 열교환유체, 복사지 등 많은 용도로 사용되어 왔으며, 1930년대에서 1970년대까지 Aroclors, Kaneclors, Clophens, Phenaclors 등과 같은 상업적 PCBs 생산품들이 절연유로 사용되었다. 본 연구에서는 PCBs의 주된 배출원인 변압기 절연유를 채취하여 Aroclor 1242, 1248, 1254, 1260의 표준물질을 사용하여 정성분석을 하였다. 제작년도 및 제작사별로 채취 분석한 결과 절연유는 Aroclor 1242, Aroclor 1254, Aroclor 1260의 단일 제품을 함유하거나 이들이 혼합되어 함유되어 있는 것으로 조사되었다. 또한, 시판되는 스크리닝 키트(20 ppm, 50 ppm)를 이용한 절연유 시료 분석방법의 적용성을 검토하였다.

• 한국세라믹학회지
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• 제47권6호
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• pp.498-502
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• 2010

Aluminium titanate($Al_2TiO_5$) has extremely anisotropic thermal expansion properties in single crystals, and polycrystalline material spontaneously microcracks in the cooling step after sintering process. These fine intergranular cracks limit the strength of the material, but provide an effective mechanism for absorbing strain energy during thermal shock and preventing catastrophic crack propagation. Furthermore, since machinable BN-ceramics used as an insulating substrate in current micro-electronic industry are very expensive, the development of new low-cost machinable substrate ceramics are consistently required. Therefore, cheap $Al_2TiO_5$-machinable ceramics was studied for the replacement of BN ceramics. $Al_2O_3-Al_2TiO_5$ ceramic composite was fabricated via in-situ reaction sintering. $Al_2O_3$ and $TiO_2$ powders were mixed with various mol-ratio and sintered at 1400 to $1600^{\circ}C$ for 1 h. Density, hardness and strength of sintered ceramics were systematically measured. Phase analysis and microstructures were observed by XRD and SEM, respectively. Machinability of each specimens was tested by micro-hole machining. The results of research showed that the $Al_2TiO_5$-composites could be used for low-cost machinable ceramics.

• Advances in materials Research
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• 제13권3호
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• pp.221-232
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• 2024

Waste tire management and recycling have grown to be significant issues because they bring up a global environmental concern. Thus, turning recycled waste tires into useful products may help tackle the environmental issue. This research aims to study and compare the effect of recycled carbon black (rCB) and commercial carbon black (CB) at certain 15 vol. % of filler loading on the mechanical, thermal, morphology and electrical properties of epoxy/CB composites. For this project, epoxy resin, diethyltoluenediamine (DETDA), recovered carbon black (rCB) and commercial carbon black (CB) graded N330, N550, N660 and N774 were mixed and compared accordingly to the formulation determined. The CB content was dispersed in the epoxy matrix using the mechanical mixing technique. The distribution and dispersion of CB in the epoxy matrix affect the characteristics of the conductive composites. rCB content at 15 vol% was selected at fixed content for comparison purposes due to the optimum value in electrical conductivity results. The flexural strength results followed the sequence of rCB>N774>N660>N550>N330. As for electrical conductivity results, epoxy/N330 exhibited the highest conductivity value, while the others achieved a magnitude of X10^-3 due to the highest external surface area of N330. In terms of thermal stability, epoxy/N330 and epoxy/N774 were slightly more stable than epoxy/rCB.

• 한국재료학회지
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• 제21권8호
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• pp.468-475
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• 2011

[ $LaMeO_3$ ](Me = Cr, Co) powders were prepared using the polymeric precursor method. The effects of the chelating agent and the polymeric additive on the synthesis of the $LaMeO_3$ perovskite were studied. The samples were synthesized using ethylene glycol (EG) as the solvent, acetyl acetone (AcAc) as the chelating agent, and polyvinylpyrrolidone (PVP) as the polymer additive. The thermal decomposition behavior of the precursor powder was characterized using a thermal analysis (TG-DTA). The crystallization and particle sizes of the $LaMeO_3$ powders were investigated via powder X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM), and particle size analyzer, respectively. The as-prepared precursor primarily has $LaMeO_3$ at the optimum condition, i.e. for a molar ratio of both metal-source (a : a) : EG (80a : 80a) : AcAc (8a) inclusive of 1 wt% PVP. When the as-prepared precursor was calcined at $700^{\circ}C$, only a single phase was observed to correspond with the orthorhombic structure of $LaCrO_3$ and the rhombohedral structure of $LaCoO_3$. A solid-electrolyte impedance-metric sensor device composed of $Li_{1.5}Al_{0.5}Ti_{1.5}(PO_4)_3$ as a transducer and $LaMeO_3$ as a receptor has been systematically investigated for the detection of NOx in the range of 20 to 250 ppm at $400^{\circ}C$. The sensor responses were able to divide the component between resistance and capacitance. The impedance-metric sensor for the NO showed higher sensitivity compared with $NO_2$. The responses of the impedance-metric sensor device showed dependence on each value of the NOx concentration.

• 한국재료학회지
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• 제5권7호
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• pp.775-780
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• 1995

MOCVD(Metal-Organic Chemical Vapor Dposition) TiN 박막을 다양한 온도와 압력에서 tetrakis-dimethyl-amino-titanium(TDMAT (Ti[N($CH_3$)$_2$]$_4$))의 자체 열분해와 NH$_3$와의 반응을 사용하여 형성하였다. 비저항은 박막내의 불순물 함량에 의존하였는데 특히 XPS curve fitting 결과 주요 불순물인 탄소와 산소 같은 불순물들이 박막내에서 다양한 침입형화합물을 만들어 박막의 물리적, 전기적 특성에 영향을 준다는 것을 알았다. Metal-organic source만을 사용하여 TiN을 형성할 경우 지름이 0.5$\mu\textrm{m}$이고 aspect ratio가 3:1인 구멍에서 step coverage가 매우 우수하였으나 NH$_3$를 흘림에 따라 step coverage가 감소하는 것이 SEM으로 확인되었는데 이는 각각의 활성화에너지와 관련된 것으로 보인다.

• 한국초전도ㆍ저온공학회논문지
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• 제23권4호
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• pp.19-24
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• 2021

The low normal zone propagation velocity (NZPV) of high-temperature superconducting (HTS) tape leads to a quench protection problem in HTS magnet applications. To overcome this limitation, various studies were conducted on HTS coils without turn-to-turn insulation (NI coils) that can achieve self-protection. On the other hand, NI coils have some disadvantages such as slow charging and discharging time. Previously, the HTS coils with turn-to-turn insulation (INS coils) were operated in power supply (PS) driven mode, which requires physical contact with the external PS at room-temperature, not in persistent current mode. When a quench occurs in INS coils, the low NZPV delays quench detection and protection, thereby damaging the coils. However, the rotary HTS flux pump supplies the DC voltage to the superconducting circuit with INS coils in a non-contact manner, which causes the INS coils to operate in a persistent current mode, while enabling quench protection. In this paper, a new protection characteristic of HTS coils is investigated with INS coils charging through the rotary HTS flux pump. To experimentally verify the quench protection characteristic of the INS coil, we investigated the current magnitude of the superconducting circuit through a quench, which was intentionally generated by thermal disturbances in the INS coil under charging or steady state. Our results confirmed the protection characteristic of INS coils using a rotary HTS flux pump.

• 한국산학기술학회논문지
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• 제20권3호
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• pp.29-34
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• 2019

SiC는 큰 에너지 밴드 갭을 갖고, 불순물 도핑에 의해 p형 및 n형 전도의 제어가 용이해서 고온용 전자부품 소재로 활용이 가능한 재료이다. 특히 $N_2$ 분위기, $2000^{\circ}C$에서 ${\beta}-SiC$ 분말로부터 제조한 다공질 n형 SiC 반도체의 경우, $800{\sim}1000^{\circ}C$에서의 도전율 값이 단결정 SiC와 비교해서 비슷하거나 오히려 높은 값을 나타내었으며, 반면에 열전도율은 치밀한 SiC 세라믹스와 비교시 1/10~1/30 정도로 낮은 값을 나타내었다. 본 연구에서는 소결온도를 낮추기 위해 n형 ${\beta}-SiC$에 함침 시킨 polycarbosilane (PCS)의 열분해에 의한 반응소결 공정 ($1400{\sim}1600^{\circ}C$)으로 다공질 소결체를 제작하였다. 함침 및 소결공정($N_2$ 분위기, $1600^{\circ}C$, 3시간)을 반복함에 따라 상대밀도는 크게 증가하지 않았지만 Seebeck 계수 및 도전율은 크게 증가하였다. 본 연구에서의 열전변환 효율을 반영하는 power factor는 고온에서 상압소결 공정으로 제작한 다공질 SiC 반도체에 비해 1/100~1/10 정도 작게 나타났지만, 미세구조 및 캐리어 밀도를 정밀하게 제어하면, 본 연구에서의 반응소결 공정으로 제작한 SiC 반도체의 열전물성은 크게 향상될 것으로 판단된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.412-412
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• 2009

Carbon-based nano materials have a significant effect on various fields such as physics, chemistry and material science. Therefore carbon nano materials have been investigated by many scientists and engineers. Especially, since graphene, 2-dimemsonal carbon nanostructure, was experimentally discovered graphene has been tremendously attracted by both theoretical and experimental groups due to their extraordinary electrical, chemical and mechanical properties. Electrical conductivity of graphene is about ten times to that of silicon-based material and independent of temperature. At the same time silicon-based semiconductors encountered to limitation in size reduction, graphene is a strong candidate substituting for silicon-based semiconductor. But there are many limitations on fabricating large-scale graphene sheets (GS) without any defect and controlling chirality of edges. Many scientists applied micromechanical cleavage method from graphite and a SiC decomposition method to the fabrication of GS. However these methods are on the basic stage and have many drawbacks. Thereupon, our group fabricated GS through Thermo-electrical Pulse Induced Evaporation (TPIE) motivated by arc-discharge and field ion microscopy. This method is based on interaction of electrical pulse evaporation and thermal evaporation and is useful to produce not only graphene but also various carbon-based nanostructures with feeble pulse and at low temperature. On fabricating GS procedure, we could recognize distinguishable conditions (electrical pulse, temperature, etc.) to form a variety of carbon nanostructures. In this presentation, we will show the structural properties of OS by synthesized TPIE. Transmission Electron Microscopy (TEM) and Optical Microscopy (OM) observations were performed to view structural characteristics such as crystallinity. Moreover, we confirmed number of layers of GS by Atomic Force Microscopy (AFM) and Raman spectroscopy. Also, we used a probe station, in order to measure the electrical properties such as sheet resistance, resistivity, mobility of OS. We believe our method (TPIE) is a powerful bottom-up approach to synthesize and modify carbon-based nanostructures.