• Title/Summary/Keyword: Electronic Packaging

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Research Trends of Carbon Composite Film with Electromagnetic Interference Shielding and High Heat Dissipation (탄소 복합재 기반 전자파 차폐 및 고방열 일체형 필름 연구동향)

  • Park, Seong-Hyun;Kim, Myounghun;Kim, Kwang-Seok
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.4
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    • pp.1-10
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    • 2021
  • Recently, electronic components are becoming smaller and highly integrated. As a result, electromagnetic interference (EMI) and heat generation problems must be solved simultaneously with a small area and thickness. Graphene composites and graphite composites are lightweight materials that can simultaneously solve EMI shielding and heat dissipation problems with excellent electrical and thermal conductivity. With the recent development of synthetic technology and composite manufacturing technology, the research to application of their composites is increasing. In this paper, we reviewed the latest researches on composite films of graphene and graphite for EMI shielding and heat dissipation.

Prediction of Maximum Bending Strain of a Metal Thin Film on a Flexible Substrate Using Finite Element Analysis (유한요소해석을 통한 유연기판 위의 금속 박막의 최대 굽힘 변형률 예측)

  • Jong Hyup Lee;Young-Cheon Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.1
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    • pp.23-28
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    • 2024
  • Electronic products utilizing flexible devices experience harsh mechanical deformations in real-use environments. As a result, researches on the mechanical reliability of these flexible devices have attracted considerable interest among researchers. This study employed previous bending strain models and finite element analysis to predict the maximum bending strain of metal films deposited on flexible substrates. Bending experiments were simulated using finite element analysis with variations in the material and thickness of the thin films, and the substrate thickness. The results were compared with the strains predicted by existing models. The distribution of strain on the surface of film was observed, and the error rate of the existing model was analyzed during bending. Additionally, a modified model was proposed, providing mathematical constants for each case.

Time Reduction for Package Warpage Optimization based on Deep Neural Network and Bayesian Optimization (심층신경망 및 베이지안 최적화 기반 패키지 휨 최적화 시간 단축)

  • Jungeon Lee;Daeil Kwon
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.3
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    • pp.50-57
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    • 2024
  • Recently, applying a machine learning to surrogate modeling for rapid optimization of complex designs have been widely researched. Once trained, the machine learning surrogate model can predict similar outputs to Finite Element Analysis (FEA) simulations but require significantly less computing resources. In addition, combined with optimization methodologies, it can identify optimal design variable with less time requirement compared to iterative simulation. This study proposes a Deep Neural Network (DNN) model with Bayesian Optimization (BO) approach for efficiently searching the optimal design variables to minimize the warpage of electronic package. The DNN model was trained by using design variable-warpage dataset from FEA simulation, and the Bayesian optimization was applied to find the optimal design variables which minimizing the warpage. The suggested DNN + BO model shows over 99% consistency compared to actual simulation results, while only require 15 second to identify optimal design variable, which reducing the optimization time by more than 57% compared to FEA simulation.

Effects of Surface Finishes on the Low Cycle Fatigue Characteristics of Sn-based Pb-free Solder Joints (금속패드가 Sn계 무연솔더의 저주기 피로저항성에 미치는 영향)

  • Lee, Kyu-O;Yoo, Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.3
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    • pp.19-27
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    • 2003
  • Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.

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The Film Property and Deposition Process of TSV Inside for 3D Interconnection (3D Interconnection을 위한 실리콘 관통 전극 내부의 절연막 증착 공정과 그 막의 특성에 관한 연구)

  • Seo, Sang-Woon;Kim, Gu-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.3
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    • pp.47-52
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    • 2008
  • This investigation was performed in order to study the properties of deposition and layers by Silicon Dioxide, SiO2, as dielectric onto Via and Trench which have high Aspect Ratio (AR). Thus, in order to confirm these properties, three types of CVD, which were PECVD, PETEOS, and ALD, were selected. On the experiment each of the property sections was estimated that step overage of PECVD: <30%, PETEOS: 45%, ALD: 75% and the RSM of PECVD: 27.8 nm, PETEOS: 2.1 nm, ALD: <2.0 nm. As a result of this experiment for the property of electric film, ALD was valuated to be the most favorable outcome. However, ALD was valuated to have the least quality for the deposition rate. ALD deposition rate, $10\;\AA/min$ by $1\;\AA$/1cycle, was prominently lower than PETEOS, which had the deposition rate of $5000\;\AA$/min. Since electric film requires at least $1000\;\AA$ thicknesses, ALD was not suitable for the deposition rate. which is the most important component in a practical use. Therefore, in this particular study, PETEOS was evaluated to be the most suitable recipe.

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A Study on the Electrical Resistivity of Graphene Added Carbon Black Composite Electrode with Tensile Strain (인장변형에 따른 그래핀복합 카본블랙전극의 저항변화연구)

  • Lee, T.W.;Lee, H.S.;Park, H.H.
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.1
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    • pp.55-61
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    • 2015
  • Stretchable electrode materials are focused to apply to flexible device such as e-skin and wearable computer. Used as a flexible electrode, increase in electrical resistance should be minimalized under physical strain as bend, stretch and twist. Carbon black is one of candidates, for it has many advantages of low cost, simple processing, and especially reduction in resistivity with stretching. However electrical conductivity of carbon black is relatively low to be used for electrodes. Instead graphene is one of the promising electronic materials which have great electrical conductivity and flexibility. So it is expected that graphene added carbon black may be proper to be used for stretchable electrode. In this study, under stretching electrical property of graphene added carbon black composite electrode was investigated. Mechanical stretching induced cracks in electrode which means breakage of conductive path. However stretching induced aligned graphene enhanced connectivity of carbon fillers and maintained conductive network. Above all, electronic structure of carbon electrode was changed to conduct electrons effectively under stretching by adding graphene. In conclusion, an addition of graphene gives potential of carbon black composite as a stretchable electrode.

Effect of Temperature and Compressive Stress on the Dielectric and Piezoelectric Properties of PIN-PMN-PT Single Crystal (온도 및 압축응력 변화에 따른 PIN-PMN-PT 단결정의 유전 및 압전 특성)

  • Lim, Jae Gwang;Park, Jae Hwan;Lee, Jeongho;Lee, Sang Goo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.63-68
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    • 2019
  • Dielectric and piezoelectric properties of PIN-PMN-PT piezoelectric single crystals with variation of temperature and compressive stress were investigated. The crystal phase of the single crystal was changed from the ferroelectric rhombohedral structure to tetragonal structure in the 110℃ region and from the tetragonal structure to the paraelectric cubic structure in the 190℃ region. The piezoelectric constant and relative dielectric constant were calculated from the rate of change of polarization and displacement with the application of electric field, which was similar to the value measured from the instrument. As the compressive stress applied to the sample increased, the piezoelectric constant d33 and relative dielectric constant values tended to increase. When the compressive stress applied to the sample at 5℃ was 60 MPa, the d33 was calculated as 4,500 pC/N. At 60℃, the relative dielectric constant of 62000 was calculated when the compressive stress applied to the sample was 40 MPa. The increase in piezoelectric constant and relative dielectric constant when the compressive stress increased could be attributed to the phase transition from the rhombohedral structure to orthorhombic.

Effect of Sn Decorated MWCNT Particle on Microstructures and Bonding Strengths of the OSP Surface Finished FR-4 Components Assembled with Sn58%Bi Composite Solder Joints (OSP 표면처리된 FR-4 PCB기판과 Sn58%Bi 복합솔더 접합부의 미세조직 및 접합강도에 미치는 Sn-MWCNT의 영향)

  • Park, Hyun-Joon;Lee, Choong-Jae;Min, Kyung Deuk;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.163-169
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    • 2019
  • Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

The 33-mode Dielectric and Piezoelectric Properties of PIN-PMN-PT Single Crystal under Stress and Electric Field (압축하중 및 전계 인가에 따른 PIN-PMN-PT 단결정의 33-모드 유전 및 압전특성)

  • Lim, Jae Gwang;Park, Jae Hwan;Lee, Jeongho;Lee, Sang Goo
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.4
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    • pp.91-96
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    • 2020
  • The 33-mode dielectric and piezoelectric properties of Pb(In1/2Nb1/2)O3-Pb(Mg1/3Nb2/3)O3-PbTiO3 piezoelectric single crystals were measured under large electric field and compressive stress. The phase transition from the low temperature rhombohedral to the high temperature tetragonal structure was observed in the range of 110~140℃, and the Curie temperature changing to the cubic structure was about 165℃. The polarization change according to the compressive stress and electric field was measured. Relative dielectric constant was calculated from the slope of the polarization curve applied to the electric field, and the calculated relative dielectric constant increased as the applied stress increased, and the relative dielectric constant decreased as the applied electric field increased. The strain according to the compressive stress and electric field change was measured, the piezoelectric constant was calculated from the slope of the curve, and the phase transition according to the application of pressure was confirmed. In the case of practical application as an underwater or medical ultrasonic actuator, it is necessary to properly design the magnitude of the compressive stress applied to the device and the DC bias in order to maintain linear driving.

Recent Progress of Ti3Ci2Tix MXene Electrode Based Self-Healing Application (Ti3Ci2Tix MXene 기반 전극 소재의 자가 치유 적용 기술 개발 동향)

  • Jun Sang Choi;Seung-Boo Jung;Jong-Woong Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.3
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    • pp.20-34
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    • 2023
  • Single or multi-layered two-dimensional (2D) materials, with thicknesses in the order of a few nanometers, have garnered substantial attention across diverse research domains owing to their distinct properties, including electrical conductivity, flexibility, and optical transparency. These materials are frequently subjected to repetitive mechanical actions in applications like electronic skin (E-Skin) and smart textiles. Moreover, they are often exposed to external factors like temperature, humidity, and pressure, which can lead to a deterioration in component durability and lifespan. Consequently, significant research efforts are directed towards developing self-healing properties in these components. Notably, recent investigations have revealed promising outcomes in the field of self-healing composite materials, with Ti3Ci2Tix MXene being a prominent component among the myriad of available 2D materials. In this paper, we aim to introduce various synthesis methods and characteristics of Ti3Ci2Tix MXene, followed by an exploration of self-healing application technologies based on Ti3Ci2Tix MXene.