Acknowledgement
이 성과는 정부 (과학기술정보통신부)의 재원으로 한국연구재단의 지원 (No. RS-2023-00239657), (No. 2022R1F1A1069114), (No. RS-2024-00423772) 및 SEMES의 재원으로 SEMES-성균관대 전략산학 과제의 지원을 받아 수행된 연구임 (S-2023-2065-000, 차세대 반도체 공정 장비 기술개발)
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