• Journal of electromagnetic engineering and science
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• v.13 no.4
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• pp.233-239
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• 2013

This paper proposes an accurate approach for predicting transferred power from a noise source to integrated circuits based on the characteristics of the power transfer network. A power delivery trace on a package and a printed circuit board are designed to transmit power from an external source to integrated circuits. The power is demonstrated between an injection terminal on the edge of the printed circuit board and integrated circuits, and the power transfer function of the power distribution network is derived. A two-tier calibration is applied to the test, and scattering parameters of the network are measured for the calculation of the power transfer function. After testing to obtain the indispensable parameters, the real received and tolerable power of the integrated circuits can be easily achieved. Our proposed estimation method is an enhancement of the existing the International Electrotechnical Commission standard for precise prediction of the electromagnetic immunity of integrated circuits.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.16-17
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• 2006

We researched by the characteristic of a anisotropic etching of Si wafer and the Si career concerning the flip chip solder bump. Connectors and Anisotropic Conductive Film (ACF) method was already applied to board-to-board interconnection. In place of them, we have focused on board to board interconnection with solder bump by Si carrier, which has been used as Flip chip bonding technology. A major advantage of this technology is that the Flexible Printed Circuit (FPC) is connected in the same solder reflow process with other surface mount devices. This technology can be applied to semiconductors and electronic devices for higher functionality, integration and reliability.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Electrical & Electronic Materials
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• v.10 no.9
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• pp.952-959
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• 1997

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.10
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• pp.135-141
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• 2013

In this paper, we installed three high brightness red, green, and blue LED in one socket and made one pixel unit. And we also developed the full-color display board module and control unit which can express various images such as text, graphics, video image with the combination of pixel units and a number of modules. LED display driver module have a driver circuit within the combination of the RGB pixel dot on unit area. These modules of the existing form can be high priced because of implementation a fixed resolution in specific space and installation space. To overcome these shortcomings, we developed a LED driver and LED pixel modules free in array at random pitch intervals. Display board module of this paper enabled to display smoothly video image which have many data processing quantity through dragging data speed up 36 frames per second. Also there are an effect which is provided more clear image because of improving the flickering of the existing display board.

• Resources Recycling
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• v.19 no.1
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• pp.57-65
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• 2010

Recently, we have investigated the recovery of resources from the waste material of manufacturing printed circuit board. As printed circuit board or chip has become light, small, high reliability, it is necessary to reuse and recover resources from them. Especially, the printed circuit board that has been used for important mobile electronic pans are plated with min.0.03 ${\mu}m$ to max.50 ${\mu}m$. As increasing the cost of gold, raw material, chemicals, payments and waste material, it has been accelerated the competition for reuse and recovery. But, it is insufficiency of technician and equipments for the recovery of effective resource. In this paper, as analyzing the technical trend of gold recovery and waste back board from the manufacturing process of printed circuit board, it may be effective of recycling, further more it may be contributed to develop the valuable resources.

• Journal of The Korean Association of Information Education
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• v.10 no.1
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• pp.119-127
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• 2006

This paper is designed to search the new alternatives to supplement the inconvenience of the traditional written ballot method which is executed every early semester to select the class board at the school. It is prepared on the based the results of the design and implement of the wired/wireless inter-working mobile electronic voting system where the students can participate in the real-time class board selection and the decision-making utilizing the mobile phones, PDA and PC they commonly have. It is time when we should consider introducing the electronic voting system, to minimize the students' inconvenience and the subsequent missing class, having to wait in the long line in the designated place to select the class board at every election season. This system enables the students to participate wherever they are other than the common place as well. Further, this research will provide the opportunity to think over the new school election culture in line with the age of Ubiquitous, as well as the useful means in the field to promote the active participation of the parents and students in the students' self-administration, decision-making necessary at the schools.

• Journal of Aerospace System Engineering
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• v.11 no.1
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• pp.1-7
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• 2017

While a satellite is carried into orbit by a launch vehicle, it is exposed to the severe launch environment with random vibrations and shock. Accordingly, these vibration sources affect electronic equipment, particularly the printed circuit board (PCB) in the satellite. When the launch load impacts the PCB, it causes negative behavior. This causes perpendicular bending around the boundary of fixation points that finally leads to the failure of solder joints, lead wires, and PCB cracks. To overcome these issues, the electronic equipment design must meet reliability requirements. In this paper, Steinberg's method is used to derive allowable and maximum deflection to verify design from a life perspective concerning the control board of the Antenna Pointing Driver (APD) mounted on KOMPSAT-3.

• The Journal of the Korea institute of electronic communication sciences
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• v.11 no.4
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• pp.433-440
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• 2016

In order to construct a system for big data processing, one needs to configure the node by using network equipments to connect multiple computers or establish cloud environments through virtual hosts on a single computer. However, there are many restrictions on constructing the big data analysis system including complex system configuration and cost. These constraints are becoming a major obstacle to professional manpower training for big data areas which is emerging as one of the most important national competitiveness. As a result, for professional manpower training of big data areas, this paper proposes a Raspberry Pi Board based educational big data processing system which is capable of practical training at an affordable price.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.8
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• pp.1219-1226
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• 2013

This study is the analysis and verification process of the L-band satellite communications repeater thought PCB & circuit EM analysis. System performance can be vulnerable to various spurious inside the L-band satellite transponder, power conversion board, digital signal board, TM/TC board, such as control panels and blocks that are linked signal components when the winch is increased due to the noise component. So the whole system can cause performance degradation. PCB resonance analysis and EM simulation can be easily analyzed for a variety of optimal. Also, by setting the ports on the PCB, H/W designer wants to can easily analyze system.