The characterization of anisotropic Si wafer etching and fabrication of flip chip solder bump using transferred Si carrier

Si웨이퍼의 이방성 식각 특성 및 Si carrier를 이용한 플립칩 솔더 범프제작에 관한 연구

We researched by the characteristic of a anisotropic etching of Si wafer and the Si career concerning the flip chip solder bump. Connectors and Anisotropic Conductive Film (ACF) method was already applied to board-to-board interconnection. In place of them, we have focused on board to board interconnection with solder bump by Si carrier, which has been used as Flip chip bonding technology. A major advantage of this technology is that the Flexible Printed Circuit (FPC) is connected in the same solder reflow process with other surface mount devices. This technology can be applied to semiconductors and electronic devices for higher functionality, integration and reliability.