• Polymer(Korea)
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• v.31 no.5
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• pp.410-416
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• 2007

Monodisperse polymer particles were prepared via one- step seeded polymerization using PMMA as seed particles, and HDDA, triEGDMA or EGDMA as crosslinking monomer. For the study, the effects of 1) the ratio of the absorbed monomer to the seed polymer particles (swelling ratio), 2) the characteristics of crosslinking monomer, 3) electroless Ni plating, and 4) electroless Au Plating on the variation of mechanical properties of polymer particles, such as recovery rate, K-values, breaking strength and breaking displacement were investigated by using MCT (micro compression test). It was observed that swelling ratio of polymer particles influenced only on breaking strength of polymer Particles, while electroless plating did on recovery rate, K-values ($K_{10}\;and\;K_{20}$) and breaking strength of electroless plated polymer particles. However, breaking displacement and K-values ($K_{30}{\sim}K_{50}$) were more or less insensitive to electroless plating.

• Journal of Surface Science and Engineering
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• v.48 no.4
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• pp.149-157
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• 2015

We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.

• Proceedings of the Materials Research Society of Korea Conference
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• 1995.11a
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• pp.82-82
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• 1995

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.80-80
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• 1998

• Corrosion Science and Technology
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• v.21 no.2
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• pp.89-99
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• 2022

A versatile method for performing non-cyanide electroless gold plating using thiomalic acid (TMA) as a complexing agent and 2-aminoethanethiol (AET) as a reducing agent was investigated. It was found that TMA was an excellent complexing agent for gold. It can be used in electroless gold plating baths at a neutral pH with a high solution stability, makes it a potential candidate to replace conventional toxic cyanide complex. It was found that one gold atomic ion could bind to two TMA molecules to form the [2TMA-Au⁺] complex in a solution. AET can be used as a reducing agent in electroless gold plating solutions. The highest current density was obtained at electrode rotation rate of 250 to 500 rpm based on anodic and cathodic polarization curves with the mixed potential theory. Increasing AET concentration, pH, and temperature significantly increased the anodic polarization current density and shifted the plating potential toward a more negative value. The optimal gold ion concentration to obtain the highest current density was 0.01 M. The cathodic current was higher at a lower pH and a higher temperature. The current density was inversely proportional to TMA concentration.

• Bulletin of the Korean Chemical Society
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• v.28 no.8
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• pp.1285-1288
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• 2007

Au was electrolessly deposited on polycarbonate (PC) membranes (0.1 μm pores) at the air/water interface. It was found that the Au nanotube dimension can be controlled by adjusting the plating temperature and the solution composition. Interfacial deposition of Au at relatively low temperatures (4℃) produced long nanotubes, which run through the whole membrane thickness with small openings. Increase of plating temperatures resulted in the decrease of nanotube lengths and Au film thicknesses. It was also disclosed that the inside-diameter of Au nanotubes can be controlled with negligible variations in length by changing the composition of a plating solution.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.11-16
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• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.

• Current Photovoltaic Research
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• v.4 no.4
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• pp.140-144
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• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.49-54
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• 2023

Recently, System in Packaging(SIP) technology needs to meet high frequency (5G and more) communication technology and fine pitch surface treatment. The conventional Electroless Ni/Immersion Au plating(ENIG) is not suitable for high frequency range because of magnetic properties are increasing the transmission loss. Without nickel plating layer, the pattern and pad reliability level must be meet the condition. In this review paper, we investigated research trends on Ni-less surface treatment technology for high-frequency communication and frequency characteristics according to materials.

• Progress in Superconductivity
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• v.6 no.2
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• pp.133-137
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• 2005

We fabricated the Au/Ni template for YBCO coated conductors and evaluated texture formation and the microstructural evolution. The cube textured Ni substrate was fabricated by rolling and recrystallization annealing, and subsequently Au layer formed on the substrate by electroless-plating method. The texture was evaluated by pole-figure with x-ray goniometer with orientation distribution function (ODF) analysis. The surface roughness and grain boundary morphology of template were characterized by atomic force microscopy (AFM) We observed that Au layer deposited epitaxially on Ni substrate and formed a strong cube texture when plating time was optimized. The full-width at half-maximum (FWHM) was $8.4^{\circ}$ for out-of-plane and $9.98^{\circ}$ for in-plane texture for plating time of 30 min. Microstructural observation showed that the Au layer was homogeneous and dense without formation of crack/microcrack. In addition, we observed that root-mean-square (RMS) and depth of grain boundary were 14.6 nm and 160 $\AA$ for the Au layer, respectively, while those were 27.0 nm and 800 $\AA$ for the Ni substrate, indicating that the electoless-plated Au layer had relatively smooth surface and effectively mollified grain groove.