A Newly Developed Non-Cyanide Electroless Gold Plating Method Using Thiomalic Acid as a Complexing Agent and 2-Aminoethanethiol as a Reducing Agent |
Han, Jae-Ho
(ECtech Co.,Ltd)
Lee, Jae-Bong (School of Advanced Materials Engineering, Kookmin University) Van Phuong, Nguyen (MSC Co., Ltd.) Kim, Dong-Hyun (MSC Co., Ltd.) |
1 | R. J. Morrissey, A versatile non-cyanide gold plating system, Plating and Surface Finishing, 80, 75 (1993). https://www.nmfrc.org/pdf/10493075.pdf |
2 | Y. Okinaka and M. Hoshino, Some Recent Topics in Gold Plating for Electronics Applications, Gold Bulletin, 31, 3 (1998). Doi: http://dx.doi.org/10.1007/BF03215469 DOI |
3 | T. Osaka, Y.Okinaka, J. Sasano, and M. Kato, Development of new electrolytic and electroless gold plating processes for electronics applications, Science and Technology of Advanced Materials, 7, 425 (2006). Doi: https://doi.org/10.1016/j.stam.2006.05.003 DOI |
4 | H. O. Ali and I. R. Christie, A review of electroless gold deposition processes, Gold Bulletin, 17, 118 (1984). Doi: https://doi.org/10.1007/BF03214674 DOI |
5 | H. Honma, Plating technology for electronics packaging, Electrochimica Acta, 47, 75 (2001). Doi: https://doi.org/10.1016/S0013-4686(01)00591-6 DOI |
6 | F. H. Reid, W. Goldie and E. W. Brooman, Gold Plating Technology, Journal of The Electrochemical Society, 122, 188Ca (1975). Doi: https://doi.org/10.1149/1.2134304 DOI |
7 | P. Wilkinson, Understanding gold plating, Gold Bulletin, 19, 75 (1986). Doi: https://doi.org/10.1007/BF03214646 DOI |
8 | Y. Okinaka, Electroless Gold Plating, Journal of The Surface Finishing Society of Japan, 42, 1077 (1991). Doi: https://doi.org/10.4139/sfj.42.1077 DOI |
9 | K. Wang, R. Beica, and N. Brown, Proc. IEEE/CPMT/SEMI 29th International lectronics Manufacturing Technology Symposium (IEEE Cat. No. 04CH37585), pp. 242-246, IEEE (2004). |
10 | Y. Okinaka and M. Kato, Electroless deposition of gold, pp. 483 - 498, Wiley-VCH, Milan (2010). |
11 | T. Inoue, S. Ando, H. Okudaira, J. Ushio, A. Tomizawa, H. Takehara, T. Shimazaki, H. Yamamoto, and H.Yokono, Proc. 45th Electronic Components and Technology Conf., pp. 1059 - 1067, IEEE (1995). |
12 | M. Huang, X. Li, J. Xia, X. Li, W. Qiu, G. Zhang, R. Sun, and Y. Mu, Proc. 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Conf., pp. 1173 - 1178, IEEE (2017). |
13 | T. Vorobyova, S. Poznyak, A. Rimskaya, and O. Vrublevskaya, Electroless gold plating from a hypophosphite-dicyanoaurate bath, Surface and coatings technology, 176, 327 (2004). Doi: https://doi.org/10.1016/S0257-8972(03)00744-8 DOI |
14 | Y. Sato, T. Osawa, K. Kaieda, and K. Kobayakawa, Cyanide-free electroless gold plating from a bath containing disulfitoaurate and thiourea or its derivatives, Plating and surface finishing, 81, 74 (1994). |
15 | T. Takeuchi, Y. Kohashi, D-H Kim, H. Nawafune, M. Tanikubo, and S. Mizumoto, Electroless Gold Plating Using L-cysteine as Reducing Agent & its Deposition Mechanism, Plating and surface finishing, 90, 56 (2003). |
16 | T. Green, M.-J. Liew, and S. Roy, Electrodeposition of Gold from a Thiosulfate-Sulfite Bath for Microelectronic Applications, Journal of the electrochemical society, 150, C104 (2003). Doi: https://doi.org/10.1149/1.1541006 DOI |
17 | K. Vasilev, T. Zhu, G. Glasser, W. Knoll, and M. Kreiter, Preparation of Gold Nanoparticles in an Aqueous Medium Using 2-Mercaptosuccinic Acid as Both Reduction and Capping Agent, Journal of nanoscience and nanotechnology, 8, 2062 (2008). Doi: https://doi.org/10.1166/jnn.2008.057 DOI |
18 | A. M. Sullivan and P. A. Kohl, The autocatalytic deposition of gold in nonalkaline, gold thiosulfate electroless bath, Journal of the Electrochemical Society, 142, 2250 (1995). Doi: https://doi.org/10.1149/1.2044282 DOI |
19 | G. O. Mallory and J. B. Hajdu, Electroless plating: fundamentals and applications, p. 401, William Andrew, Florida (1990). |
20 | C. G. Anderson, Alkaline sulfide gold leaching kinetics, Minerals Engineering, 92, 248 (2016). Doi: https://doi.org/10.1016/j.mineng.2016.01.009 DOI |
21 | M. I. Jeffrey and A. Angstetra, The Effect of Additives on the Electroless Deposition of Gold from a Thiosulfate-Ascorbic Acid Bath, ECS Transactions, 2, 267 (2006). Doi: https://doi.org/10.1149/1.2196016 DOI |
22 | M. Kato, K. Niikura, S. Hoshino, and I. Ohno, Electrochemical Behavior of Electroless Gold Plating with Ascorbic Acid as a Reducing Agent, Journal of The Surface Finishing Society of Japan, 42, 729 (1991). Doi: https://doi.org/10.4139/sfj.42.729 DOI |
23 | H.K.Lee, D.H.Kim, D.K. Han, I.J.Son, Practical Surface Treatment Technology Series, Electroless Plating, 3, 44 (2014). |
24 | Y. Okinaka, An Electrochemical Study of Electroless Gold?Deposition Reaction, Journal of the Electrochemical Society, 120, 739 (1973). Doi: https://doi.org/10.1149/1.2403548 DOI |
25 | G. Corthey, L. J. Giovanetti, J. M. Ramallo-Lopez, E. Zelaya, A. A. Rubert, G. A. Benitez, F. G. Requejo, M. H. Fonticelli, and R. C. Salvarezza, Synthesis and Characterization of Gold@Gold(I)-Thiomalate Core@Shell Nanoparticles, ACS nano, 4, 3413 (2010). Doi: https://doi.org/10.1021/nn100272q DOI |
26 | A. Bard, Standard potentials in aqueous solution, p. 313, Routledge, New York (2017). Doi: https://doi.org/10.1201/9780203738764 DOI |
27 | A. J. Bard, G. Inzelt, and F. Scholz, Electrochemical Dictionary, p. 482, Springer Science & Business Media, Berlin (2008). Doi: https://doi.org/10.1007/978-3-540-74598-3 DOI |
28 | W. Riedel, Electroless nickel plating, ASM International (1991). |
29 | D. Baudrand and J. Bengston, Electroless plating processes, Metal finishing, 93, 55 (1995). Doi: https://doi.org/10.1016/0026-0576(95)99502-2 DOI |
30 | D. J. LeBlanc, R. W. Smith, Z. Wang, H. E. Howard-Lock, and C. J. Lock, Thiomalate complexes of gold(I) : preparation, characterization and crystal structures of 1:2 gold to thiomalate complexes, Journal of the Chemical Society, Dalton Transactions, 18, 3263 (1997). Doi: https://doi.org/10.1039/A700827I DOI |
31 | I. Ohno, Electrochemistry of electroless plating, Materials Science and Engineering : A, 146, 33 (1991). Doi: https://doi.org/10.1016/0921-5093(91)90266-P DOI |
32 | M. Kato and Y. Okinaka, Some recent developments in non-cyanide gold plating for electronics applications, Gold Bulletin, 37, 37 (2004). Doi: https://doi.org/10.1007/BF03215515 DOI |
33 | H. Nawafune, K. Shiroguchi, M. Tanikubo, S. Mizumoto, Y. Kohashi, and T. Takeuchi, Autocatalytic Electroless Silver Deposition Using 2-Aminoethanethiol as Reducing Agent, Journal of The Surface Finishing Society of Japan, 50, 928 (1999). Doi: https://doi.org/10.4139/sfj.50.928 DOI |
34 | M. L. Goldberger and K. M. Watson, Collision theory, p. 32, Courier Corporation, New York (2004). |
35 | J. Hu, W. Li, J. Chen, X. Zhang, and X. Zhao, Novel plating solution for electroless deposition of gold film onto glass surface, Surface and Coatings Technology, 202, 2922 (2008). Doi: https://doi.org/10.1016/j.surfcoat.2007.10.026 DOI |