• Title/Summary/Keyword: Electro-thermal Analysis

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Thermal Design of IGBT Module with Respect to Stability (IGBT소자의 열적 안정성을 고려한 방열설계)

  • Lee Joon-Yeob;Song Seok-Hyun
    • Proceedings of the KIPE Conference
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    • 2002.11a
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    • pp.205-208
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    • 2002
  • Thermal design is required with considering thermal stability to verify the reliability of electric power device with using IGBT. Numerical analysis is performed to analyzed the change in thermal resistance with respect to the various thermal density of heating element. Correlations between thermal resistance and heat generation density are established. With using these correlations, performance curve is composed with respect to the change in thermal resistance of cooling conditions for natural convection and forced convection. Thermal fatigue is occurred at the Inside and outside of IGBT by repeated heat load. The crack is occurred between base plate and ceramic substrate for the inside. When the crack length is 4mm, the failure is occurred. Therefore, Thermal design method considering thermal density, thermal fatigue resistance is presented on this study and it is expected to thermal design with considering life prediction.

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Design and Development of Thermal Control Subsystem for an Electro-Optical Camera System (전자광학카메라 시스템의 열제어계 설계 및 개발)

  • Chang, Jin-Soo;Yang, Seung-Uk;Jeong, Yun-Hwang;Kim, Ee-Eul
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.37 no.8
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    • pp.798-804
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    • 2009
  • A high-resolution electro-optical camera system, EOS-C, is under development in Satrec Initiative. This system is the mission payload of a 400-kg Earth observation satellite. We designed this system to give improved opto-mechanical and thermal performance compared with a similar camera system to be flown on the DubaiSat-1 system. The thermal control subsystem (TCS) of the EOS-C system uses heaters to meet the opto-mechanical requirements during in-orbit operation and it uses different thermal coating materials and multi-layer insulation (MLI) blankets to minimize the heater power consumption. We performed its thermal analysis for the mission orbit using a thermal analysis model and the result shows that its TCS satisfies the design requirements.

Bending analysis of magneto-electro piezoelectric nanobeams system under hygro-thermal loading

  • Ebrahimi, Farzad;Karimiasl, Mahsa;Selvamani, Rajendran
    • Advances in nano research
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    • v.8 no.3
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    • pp.203-214
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    • 2020
  • This paper investigated bending of magneto-electro-elastic (MEE) nanobeams under hygro-thermal loading embedded in Winkler-Pasternak foundation based on nonlocal elasticity theory. The governing equations of nonlocal nanobeams in the framework parabolic third order beam theory are obtained using Hamilton's principle and solved implementing an analytical solution. A parametric study is presented to examine the effect of the nonlocal parameter, hygro-thermal-loadings, magneto-electro-mechanical loadings and aspect ratio on the deflection characteristics of nanobeams. It is found that boundary conditions, nonlocal parameter and beam geometrical parameters have significant effects on dimensionless deflection of nanoscale beams.

Heater Design of a Cooling Unit for a Satellite Electro-Optical Payload using a Thermal Analysis (열해석을 이용한 위성 광학탑재체 냉각 장치의 히터설계)

  • Kim, Hui-Kyung;Chang, Su-Young;Choi, Seok-Weon
    • Aerospace Engineering and Technology
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    • v.10 no.2
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    • pp.20-28
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    • 2011
  • The electro-optical payload of a low-earth orbit satellite is thermally decoupled with the bus, which supports a payload for a mission operation. The payload has a cooling unit of FPA(Focal Plane Assembly) which has a thermal behavior increasing its temperature instantly during an operation in order to dissipate a waste heat into the space. The FPA cooling unit should include a radiator and heatpipes with a sufficient performance in worst hot condition, and a heater design to maintain its temperature above a minimum allowable temperature in the worst cold condition. In this paper, we analyzed the thermal requirements and the heater design constraints from the thermal analysis results for the current thermal design of the FPA cooling unit and the design elements of the better heater design were found.

Static behavior of thermally loaded multilayered Magneto-Electro-Elastic beam

  • Vinyas, M.;Kattimani, S.C.
    • Structural Engineering and Mechanics
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    • v.63 no.4
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    • pp.481-495
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    • 2017
  • The present article examines the static response of multilayered magneto-electro-elastic (MEE) beam in thermal environment through finite element (FE) methods. On the basis of the minimum total potential energy principle and the coupled constitutive equations of MEE material, the FE equilibrium equations of cantilever MEE beam is derived. Maxwell's equations are considered to establish the relation between electric field and electric potential; magnetic field and magnetic potential. A simple condensation approach is employed to solve the global FE equilibrium equations. Further, numerical evaluations are made to examine the influence of different in-plane and through-thickness temperature distributions on the multiphysics response of MEE beam. A parametric study is performed to evaluate the effect of stacking sequence and different temperature profiles on the direct and derived quantities of MEE beam. It is believed that the results presented in this article serve as a benchmark for accurate design and analysis of the MEE smart structures in thermal applications.

Toughnening of Dielectric Material by Thermoplastic Polymer

  • Lee, Jung-Woo;Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.207-208
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    • 2007
  • Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

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Thermal response analysis of multi-layered magneto-electro-thermo-elastic plates using higher order shear deformation theory

  • Vinyas, M.;Harursampath, D.;Kattimani, S.C.
    • Structural Engineering and Mechanics
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    • v.73 no.6
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    • pp.667-684
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    • 2020
  • In this article, the static responses of layered magneto-electro-thermo-elastic (METE) plates in thermal environment have been investigated through FE methods. By using Reddy's third order shear deformation theory (TSDT) in association with the Hamilton's principle, the direct and derived quantities of the coupled system have been obtained. The coupled governing equations of METE plates have been derived through condensation technique. Three layered METE plates composed of piezoelectric and piezomagnetic phases are considered for evaluation. For investigating the correctness and accuracy, the results in this article are validated with previous researches. In addition, a special attention has been paid to evaluate the influence of different electro-magnetic boundary conditions and pyrocoupling on the coupled response of METE plates. Finally, the influence of stacking sequences, magnitude of temperature load and aspect ratio on the coupled static response of METE plates are investigated in detail.

The Coupled Electro-Thermal Field Analysis for Predicting Over-Current Protector Behavior

  • Bae, Jae-Nam;Lee, Sung-Gu;Han, Jung-Ho;Chung, Hae-Yang;Lee, Ju
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.22 no.7
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    • pp.43-48
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    • 2008
  • The characteristics of heat transfer of the bimetal disc for over-current protection device is specified. Bimetal consists of two metals which have a different thermal expansion coefficient. To analyze the thermal characteristics, temperature distribution when bimetal acts as a switch is calculated. As usual, heat source is applied to the bimetal and electric current is heat source in the over-current protection switch. In this paper, thermal distribution are obtained by solving a coupled electro-thermal field with 3D finite element method.

Thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography (임프린트 공법적용을 위한 절연재료의 열적, 기계적 성질)

  • Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.220-221
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    • 2007
  • Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

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Electro-Thermal Characteristics of Hole-type Phase Change Memory (Hole 구조 상변화 메모리의 전기 및 열 특성)

  • Choi, Hong-Kyw;Jang, Nak-Won;Kim, Hong-Seung;Lee, Seong-Hwan;Yi, Dong-Young
    • Journal of Advanced Marine Engineering and Technology
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    • v.33 no.1
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    • pp.131-137
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    • 2009
  • In this paper, we have manufactured hole type PRAM unit cell using phase change material $Ge_2Sb_2Te_5$. The phase change material $Ge_2Sb_2Te_5$ was deposited on hole of 500 nm size using sputtering method. Reset current of PRAM unit cell was confirmed by measuring R-V characteristic curve. Reset current of manufactured hole type PRAM unit cell is 15 mA, 100 ns. And electro and thermal characteristics of hole type PRAM unit cell were analyzed by 3-D finite element analysis. From simulation temperature of PRAM unit cell was $705^{\circ}C$.