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http://dx.doi.org/10.5207/JIEIE.2008.22.7.043

The Coupled Electro-Thermal Field Analysis for Predicting Over-Current Protector Behavior  

Bae, Jae-Nam (Department of Electrical Engineering, Hanyang University)
Lee, Sung-Gu (Department of Electrical Engineering, Hanyang University)
Han, Jung-Ho (Department of Physics Physical Science, Soonchunhyang University)
Chung, Hae-Yang (Department of Electrical Engineering, Soonchunhyang University)
Lee, Ju (Department of Electrical Engineering, Hanyang University)
Publication Information
Journal of the Korean Institute of Illuminating and Electrical Installation Engineers / v.22, no.7, 2008 , pp. 43-48 More about this Journal
Abstract
The characteristics of heat transfer of the bimetal disc for over-current protection device is specified. Bimetal consists of two metals which have a different thermal expansion coefficient. To analyze the thermal characteristics, temperature distribution when bimetal acts as a switch is calculated. As usual, heat source is applied to the bimetal and electric current is heat source in the over-current protection switch. In this paper, thermal distribution are obtained by solving a coupled electro-thermal field with 3D finite element method.
Keywords
Coupled field; Finite element method; Electric heating; Bimetal disc;
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