• Journal of the Korea Institute of Military Science and Technology
• /
• v.15 no.3
• /
• pp.288-297
• /
• 2012

This paper describes the verification test on Electromagnetic Environmental Effects(E3), which conducted on ground as a final step to confirm the normal operation of ELINT pod and Safety-of-Flight of KF-16C/D mounted with ELINT pod prior to the initial flight. Based on MIL-STD-464A, indispensable 7 requirements among 14 detailed requirements total were carried out in the test. Considering the Safety-of-Flight(SOF), we invest a great deal of time and effort on Hazards of Electromagnetic Radiation to Ordnance(HERO) and Intra-system EMC test. E3 test and evaluation were performed on 62 equipments of KF-16C/D, respectively. As a result, we verify that KF-16C/D mounted with ELINT pod(hereafter "system") are electromagnetically compatible among all subsystems and equipment within the system and with environments caused by electromagnetic effects external to the system.

• Journal of Sensor Science and Technology
• /
• v.15 no.5
• /
• pp.371-377
• /
• 2006

Nano porous, transparent silica aerogels monoliths were prepared under ambient drying (1 atm, $270^{\circ}C$) condition by the combination of sol-gel process and surface modification with subsequent heat treatment. Three kinds of solvent, n-hexane, n-heptane and xylene, were selected in the point view of low surface tension and vapor pressure in order to restrain a formation of cracks during drying. Crack-free silica aerogels with over 93 % of porosity and below $0.14g/cm^3$ of density were obtained by solvent exchange and surface modification under atmosphere condition. Optimum solvent was confirmed n-heptane among these solvents through estimation of FT-IR, TGA, BET and SEM. Modified silica aerogel exhibited a higher porosity and pore size compare to unmodified aerogels. Hydrophobicity was also controled by C-H and H-OH bonding state in the gel structure and heat treatment over $400^{\circ}C$ effects to the hydrophobicity due to oxidation of C-H radicals.

• Journal of the Korean Applied Science and Technology
• /
• v.30 no.3
• /
• pp.461-471
• /
• 2013

Use of low bandgap polymers is the most suitable way to harvest a broader spectrum of solar radiations for solar cells. But, still there is lack of most efficient low bandgap polymer. In order to solve this problem, we have synthesised a new low bandgap polymer and investigated its interaction with the ILs to enhance its conductivity. ILs may undergo almost unlimited structural variations; these structural variations have attracted extensive attention in polymer studies. In addition to this, UV-Vis spectroscopy, confocal Raman spectroscopy and FT-IR spectroscopy results have revealed that all studied ILs (tributylmethylammonium methyl sulfate [$N_{1444}$][$MeSO_4$] from ammonium family) and 1-methylimidazolium chloride ([MIM]Cl, and 1-butyl-3-methylimidazolium chloride [Bmim]Cl from imidazolium family) has potential to interact with polymer. Further, protic ILs shows enhanced conductivity than aprotic ILs with low bandgap polymer. This study provides the combined effect of low bandgap polymer and ILs that may generate many theoretical and experimental opportunities.

• Journal of the Korean Mathematical Society
• /
• v.53 no.1
• /
• pp.161-185
• /
• 2016

We consider a mathematical model which describes the quasistatic frictional contact between a piezoelectric body and an electrically conductive obstacle, the so-called foundation. A nonlinear electro-viscoelastic constitutive law is used to model the piezoelectric material. Contact is described with Signorini's conditions and a version of Coulomb's law of dry friction in which the adhesion of contact surfaces is taken into account. The evolution of the bonding field is described by a first order differential equation. We derive a variational formulation for the model, in the form of a system for the displacements, the electric potential and the adhesion. Under a smallness assumption which involves only the electrical data of the problem, we prove the existence of a unique weak solution of the model. The proof is based on arguments of time-dependent quasi-variational inequalities, differential equations and Banach's fixed point theorem.

• ETRI Journal
• /
• v.35 no.6
• /
• pp.1152-1155
• /
• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• Journal of Magnetics
• /
• v.17 no.2
• /
• pp.78-82
• /
• 2012

CoNiFe(CNF)/$BaTiO_3(BTO)$/CoNiFe(CNF) multilayered thin films were deposited on Pt/Ti/$SiO_2$/Si substrates by using pulsed laser deposition (PLD) system. We fabricated three different thin films of BTO, BTO/CNF and CNF/BTO/CNF for magneto-capacitor and studied their crystalline structure, surface and interface morphology, and magnetic and electrical properties. When three different structures of multilayered thin film were compared, magnetization of CNF/BTO/CNF thin films was decreased by magnetic and dielectric interaction. Also we confirmed that capacitance of CNF/BTO/CNF multilayered thin film was enhanced as being near tetragonal structure with increasing of c/a ratio because of atomic bonding at interface between BTO dielectric and CNF magnetic materials. Finally, we studied the change of the capacitance of CNF/BTO/CNF multilayered thin film with magnetic field for emergence of magnetocapacitance and suggested a possibility of enhanced capacitance.

• Proceedings of the Korea Association of Crystal Growth Conference
• /
• 1999.06a
• /
• pp.285-303
• /
• 1999

Thin films of hydrogenated amorphous silicon carbide compounds (a-SixC1x:H) of different compositions were deposited on Si substrate by RF plasma-enhanced chemical vapor deposition (PECVD). Experiments were carried out using silane(SiH4) and methane(CH4) as the gas precursors at 1 Torr and at low substrate temperature (25$0^{\circ}C$). The gas flow rate was changed with every other parameters (pressure, temperature, RF power) fixed. The substrate was Si(100) wafer and all of the films obtained were amorphous. The bonding structure of a-SixC1x:H films deposited was investigated by X-ray photoelectron spectroscopy (XPS) for the film compositions. In addition, the surface morphology of films was investigated by atomic force microscopy (AFM).

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.1
• /
• pp.29-36
• /
• 2004

A flexible packaging scheme, which includes chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending tests and finite element analysis. Thinned silicon chips (t<30 $\mu\textrm{m}$) are fabricated by chemical etching process to avoid possible surface damages on them. And the chips are stacked directly on $Kapton^{Kapton}$film by thermal compressive bonding. The low height difference between the thinned silicon chip and $Kapton^{Kapton}$film allows electroplating for electrical interconnection method. Because the 'Chip' is embedded in the flexible substrate, higher packaging density and wearability can be achieved by maximized usable packaging area.

• Journal of Magnetics
• /
• v.20 no.4
• /
• pp.444-449
• /
• 2015

Soft magnetic composites (SMCs) are especially suitable for the construction of low-cost, high-performance motors with 3-D magnetic fields. The main advantages of SMCs is that the iron particles are insulated by the surface coating and adhesive used for composite bonding, the eddy-current loss is much lower than that in laminated steels, especially at higher frequencies, and the hysteresis loss becomes the dominant component of core losses. These properties enable machines to operate at higher frequencies, resulting in reduced machine size and weight. In this paper, 3-D topologies are proposed that enable the application of SMCs to effectively reduce losses in high-speed permanent magnet (PM) motors. In addition, the electromagnetic field characteristics of the motor topologies are evaluated and compared using a non-linear finite element method (FEM) based on 3-D numerical analysis, and the feasibility of the motor designs is validated.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.1
• /
• pp.41-47
• /
• 2011

Currently, there is widespread adoption of silicon-based technologies for the implementation of radio frequency (RF) integrated passive devices (IPDs) because of their low-cost, small footprint and high performance. Also, the need for high speed data transmission and reception coupled with the ever increasing demand for mobility in consumer devices has generated a great interest in low cost devices with smaller form-factors. The UWB BPF makes use of lumped IPD technology on a silicon substrate CSMP (Chip Scale Module Package). In this paper, this filter shows 2.0 dB insertion loss and 15 dB return loss from 7.0 GHz to 9.0 GHz. To the best of our knowledge, the UWB band-pass-filter developed in this paper has the smallest size ($1.4\;mm{\times}1.2\;mm{\times}0.40\;mm$) while achieving equivalent electrical performance.