• Title/Summary/Keyword: Electrical bonding

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Fabrication of Thick Periodically-poled Lithium Niobate Crystals by Standard Electric Field Poling and Direct Bonding

  • Kim, Byoung-Joo;Kim, Chung-Sik;Kim, Dong-Jin;Lim, Hwan-Hong;Park, Sung-Kyun;Cha, Myoung-Sik;Kim, Kyung-Jo
    • Journal of the Optical Society of Korea
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    • v.14 no.4
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    • pp.420-423
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    • 2010
  • We fabricated 1 mm-thick periodically-poled lithium niobate (PPLN) crystals by using a high-voltage amplifier for standard electric field poling combined with a voltage multiplier. Furthermore, two 1 mm-thick PPLNs were directly bonded to make a 2 mm-thick PPLN. The large aperture allowed broad angular tuning, and a broad spectral range of quasi-phase matched second-harmonic generation can be achieved in a single channel. High-power applications are also expected.

Optical PCB and Packaging Technology (광 PCB 및 패키징 기술)

  • Ryu, Jin-Hwa;Kim, Dong-Min;Kim, Eung-Soo;Jeong, Myung-Yung
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.1
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    • pp.7-13
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    • 2011
  • According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

Characteristic study of hermetic package for RF MEMS switch (RF MEMS 스위치 적용을 위한 밀봉성 패키지의 특성 연구)

  • Bang, Yong-Seung;Kim, Jong-Man;Kim, Yong-Sung;Kim, Jung-Mu;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 2008.07a
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    • pp.1464-1465
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    • 2008
  • In this paper, we compared the mechanical characteristics between LTCC-based RF MEMS packaging structures fabricated using two different types of bonding materials; BCB and gold-tin. The BCB-based packages showed an average shear strength of 32.1 MPa and helium leak rate of $1.76{\times}10^{-8}atm{\cdot}cc/sec$ for a cavity volume of $0.45\times10^{-3}cc$, while the packages bonded by gold-tin layer (80 wt.% gold, 20 wt.% tin) showed an average shear strength of 42.70 MPa and helium leak rate $1.38{\times}10^{-8}atm{\cdot}cc/sec$ for a cavity volume of $1.21{\times}10^{-3}cc$.

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Fabrication and Test of a Micro Passive Liquid Pressure Regulator (초소형 수동형 유체 압력 조정기 제작 및 실험)

  • Lee, Ki-Jung;Lim, In-Ho;Sim, Woo-Young;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2008.07a
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    • pp.1482-1483
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    • 2008
  • This report describes the design, fabrication and experimental results of an implantable micro pressure regulator. It consists of three silicon substrates, a glass substrate, and a PDMS layer. Silicon and glass substrates are fabricated by using bulk micro machining and sandblasting. The PDMS layer is used as a intermediate layer for Si-Si and Si-glass bonding processes. This micro regulator is a key component of the portable drug delivery systems for low power consumption. The device has some advantages, such as a passive type device, no power consumption, and simple structure.

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Bio-functionalization of the Single Layer Graphene for Detecting the Cancer Cell

  • Oh, Hyung Sik;Park, Wanjun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.429.1-429.1
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    • 2014
  • We present a method of surface functionalization of a single layer graphene for linking and detecting MDA-MB-231 human breast cancer cell. The methodology is done by utilizing 1-pyrenebutanoic acid and succinimidyl ester for immobiling CD44 antibodies. This work shows that the single layer graphene is an efficient fixing substance to capture the MDA-MB-231 human breast cancer cell, selectively. The immobilization method of the cancer cell on the graphene layer will be an effective cell counting system. Moreover usage of the linking with non-covalent bonding is expected to develope a sensor scheme of electrical cell-detecting diagnosis system.

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The Use of Graphene for Regenerative Medicine (그래핀의 재생의학적 이용)

  • Yoon, Jeong-Kee;Kim, Byung-Soo
    • KSBB Journal
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    • v.27 no.5
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    • pp.273-280
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    • 2012
  • Graphene is a one-atom-thick sheet composed of carbon atoms only. It has a two-dimensional honeycomb structure with $sp^2$ orbital bonding, which presents some unique properties. Due to large Young's modulus, good electrical conductivity, ability to immobilize several kinds of small molecules and proteins, and biocompatibility of graphene, it has attracted interests inits ability to enhance cell growth and differentiation, followed by recent several studies. We reviewed about the osteogenic differentiation of mesenchymal stem cells, and neurogenic differentiation of neuron stem cells, and the ectodermal and mesodermal differentiation of induced pluripotent stem cells using graphene. Graphene has not only enhanced the adhesion and proliferation of mesenchymal stem cells, but also led to the faster differentiation even without any other exogenous signals. Nonetheless, graphene has some cytotoxicities in its amount-response manner, which is critical to regenerative medicine. The cytotoxicities of graphene were compared with those of grapheneoxide and carbon nanotubes.

The Vertical Trench Hall-Effect Device Using SOI Wafer (SOI Wafer를 사용한 트렌치 구조의 수직 Hall 소자의 제작)

  • Park, Byung-Hwee;Jung, Woo-Chul;Nam, Tae-Chul
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.2023-2025
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    • 2002
  • We have fabricated a novel vertical trench-Hall device sensitive to the magnetic field parallel to the sensor chip surface. The vertical trench-Hall device is built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 350 V/AT is measured.

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Fabrication of Test Socket from BeCu Metal Sheet (BeCu 금속박판을 이용한 테스트 소켓 제작)

  • Kim, Bong-Hwan
    • Journal of Sensor Science and Technology
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    • v.21 no.1
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    • pp.34-38
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    • 2012
  • We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

A Study on the Modeling and Control of High-Speed/High-Accuracy Position Control System (고속/정밀 위치제어시스템의 모델링 및 제어에 관한 연구)

  • 신호준;박민규;윤석찬;한창수
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.10a
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    • pp.83-89
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    • 2000
  • This paper presents a dynamic modeling and a sliding mode controller for the high-speed / high-accuracy position control system. Selected target system is the wire bonder head assembly which is used in semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as a actuator and transducer horn as a bonding tool. For the modeling elements, the system is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled by using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.

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Fabrication of 6, 13-bis(triisopropylsilylethynyl) (TIPS) pentacene -Nanowire Arrays Using Nano Transfer Molding

  • Oh, Hyun-S.;Sung, Myung-M.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.284-284
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    • 2010
  • We report a fabrication of 6, 13-bis(triisopropylsilylethynyl) (TIPS) pentacene nanowires that made on Si substrates by liquid bridge-nanotransfer molding (LB-nTM) with polyurethane acrylate (PUA) mold. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid bridge between them. In liquid bridge-transfer process, the liquid layer serves as an adhesion layer to provide good conformal contact and form covalent bonding between the TIPS-pentacene nanowire and the Si substrate. The patterned TIPS-Pentacene nanowires have been investigated by Atomic force microscopy (AFM), Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM) and electrical properties.

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