• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.513-516
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• 1987

Hydrogenated amorphous silicon (a-Si:H) films have been deposited, for thye first time, by a remote plasma chemical vapor deposition. The hydrogen radical play a important role to control the deposition rate, The bonded hydrogen content to silicon is independent of hydrogen partial pressure in the plasma. Optical gap of deposited a-Si:H lies between 1.7eV and 1.8eV and all samples have sharp absorption edge. B-doped a-Si:H films by a RPECVD has a high doping efficiency compared with plasma CVD. The Fermi level of 100ppm B-doped film lies at 0.5eV above valence band edge.

• The Korean Journal of Ceramics
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• v.3 no.4
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• pp.263-268
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• 1997

RuO$_3$ thin films were deposited on Si(100) substrate at low temperatures by hot-wall metalorganic chemical vapor deposition. Bis(cyclopentadienyl) ruthenium, Ru$(C_5H_5)_2$, was used as the precursor RuO$_2$single phase was obtained at a low deposition temperature of 25$0^{\circ}C$ and the crystallinity of RuO$_2$thin films improved with increasing deposition temperature. RuO$_2$thin films grow perpendicularly to the substrate and show the columnar structure. The grain size of RuO$_2$films drastically increases with increasing the deposition temperature. The resistivity of the 180 nm-thick RuO$_2$thin films deposited at 27$0^{\circ}C$ was 136 $\mu$$\Omega$-cm and increased with decreasing film thickness. SrBi$_2Ta_2O_4$ thin films deposited by rf magnetron sputtering on the RuO$_2$bottom electrodes showed a fatigue-free characteristics up to ~10$^10$ cycles under 5 V bipolar square pulses and the remanent polarization, 2 P$_r$ and the coercive field, 2 E, were 5.2$\mu$C/$\textrm{cm}^2$ and 76.0 kV/cm, respectively, for an applied voltage of 5 V The leakage current density was about 7.0$\times$10$^{-6}$ A/$\textrm{cm}^2$ at 150 kV/cm.

• Electrical & Electronic Materials
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• v.7 no.3
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• pp.206-212
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• 1994

In this paper, We discuss the $POCI_3$ doping process according to the variation of deposition temperature, gas flow rate and doping time. The factors acted with $POCI_3$ doping are gas flow rate deposition temperature and time etc. Among them the temperature is the most important factor. For the $POCI_3$ flow rate, it should not exceed the resistivity saturation point developed on poly surface by annealing treatment. Therefore, this study suggests the optimum conditions of Poly-silicon treatments with the $POCI_3$ flow rate.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.863-866
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• 2003

Multi-walled carbon nanotubes (CNTs) were synthesized on glass substrates in the different ramp-up heating ambient of vacuum, He, Ar, and $N_{2}$ by thermal chemical vapor deposition. CNTs with higher crystallinity were developed in the buffer gases with faster growth rates than in vacuum. Field emission characteristics were strongly related to the relative position of CNT emitters to the cathode electrodes. The areal-spread emission and instability were overcome by locating the emitters far away from the edges of cathode electrodes. The electrical conditioning of emitters improved their emission uniformity over a large area although it decreased the emission current. This study also discussed the long-term stability of CNT emitters.

• Carbon letters
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• v.14 no.4
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• pp.210-217
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• 2013

The synthesis of carbon nanomaterials (CNMs) by a chemical vapor deposition method using three different plant oils as precursors is presented. Because there are four parameters involved in the synthesis of CNM (i.e., the precursor, reaction temperature of the furnace, catalysts, and the carrier gas), each having three variables, it was decided to use the Taguchi optimization method with the 'the larger the better' concept. The best parameter regarding the yield of carbon varied for each type of precursor oil. It was a temperature of $900^{\circ}C$ + Ni as a catalyst for neem oil; $700^{\circ}C$ + Co for karanja oil and $500^{\circ}C$ + Zn as a catalyst for castor oil. The morphology of the nanocarbon produced was also impacted by different parameters. Neem oil and castor oil produced carbon nanotube (CNT) at $900^{\circ}C$; at lower temperatures, sphere-like structures developed. In contrast, karanja oil produced CNTs at all the assessed temperatures. X-ray diffraction and Raman diffraction analyses confirmed that the nanocarbon (both carbon nano beads and CNTs) produced were graphitic in nature.

• Transactions on Electrical and Electronic Materials
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• v.9 no.1
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• pp.28-32
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• 2008

Hydrogenated microcrystalline silicon(${\mu}c$-Si:H) films were prepared using inductively coupled plasma chemical vapor deposition(ICP-CVD) method, electrical and optical properties of these films were studied as a function of silane concentration. And then, effect of $PH_3\;and\;B_2H_6$ addition on their electrical properties was also investigated for solar cell application. Characterization of these films from X-ray diffraction revealed that the conductive film exists in microcrystalline phase embedded in an amorphous network. At $PH_3/SiH_4$ gas ratio of $0.9{\times}10^{-3}$, dark conductivity has a maximum value of ${\sim}18.5S/cm$ and optical bandgap also a maximum value of ${\sim}2.39eV$. Boron-doped ${\mu}c$-Si:H films, satisfied with p-layer of solar cell, could be obtained at ${\sim}10^{-2}\;of\;B_2H_6/SiH_4$.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.370-370
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• 2012

Feature size of Cu interconnects keep shrinking into several tens of nanometer level. For this reason, the Cu interconnects face challenging issues such as increase of electro-migration, line-width dependent electrical resistivity increase, and gap-filling difficulty in high aspect ratio structures. As the thickness of the Cu film decreases below 30 nm, the electrical resistivity is not any more constant, but rather exponential. Research on alloying with other elements have been started to inhibit such escalation in the electrical resistivity. A faint trace of Al added in Cu film by sputtering was reported to contribute to suppression of the increase of the electrical resistivity. From an industrial point of view, we introduced cyclic metal organic chemical vapor deposition (MOCVD) in order to control Al concentration in the Cu film more easily by controlling the delivery time ratio of Cu and Al precursors. The amount of alloying element could be lowered at level of below 1 at%. Process of the alloy formation was applied into gap-filling to evaluate the performance of the gap-filling. Voidless gap-filling even into high aspect ratio trenches was achieved. In-depth analysis will be discussed in detail.

• Journal of the Korean Ceramic Society
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• v.36 no.5
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• pp.504-512
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• 1999

The high-quality carbon nanofibers were prepared by chemical vapor deposition of gas mixtures of CO-H2 and C3H8-H2 over Fe-Cu and Ni-Cu bimetallic catalysts. The yield and structure of carbon nanofiber produced were altered by the change of catalyst composition and reaction temperature. The high yields were obtained around 500$^{\circ}C$ with e-Cu catalyst and around 700-750$^{\circ}C$ with Ni-Cu catalyst and the relatively higher yields were obtained with the bimetallic catalyst containing 50-90% of Ni and Fe respectively in comparison with the pure metals. The carbon nanofibers produced over the Fe-Cu catalyst at around 500$^{\circ}C$ with the maximum yields had the highest surface ares of 160-200 m2/g around 650$^{\circ}C$ which was slightly lower than the temperature for maximum yields. In order to examine the characteristics of carbon nanofibers as catalyst support Ni and Co metals were supporte on the carbon nanofibers and CO hydrogenation reaction was performed with the catalysts. The particle size distribution of Ni and Co supported over the carbon nanofibers were 6-15 nm and the CO hydrogenation reaction rate with the carbon-nanofiber supported catalysts was much higher than that over the other supports.

• Transactions on Electrical and Electronic Materials
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• v.7 no.6
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• pp.293-296
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• 2006

We studied homeotropic alignment effect for a nematic liquid crystal (NLC) on the $SiO_{x}$ thin film irradiated by the new ion beam method. $SiO_{x}$ thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) and were treated by the DuoPIGatron ion source. A uniform liquid crystal alignment effect was achieved over 2100 eV ion beam energy. Tilt angle were about $90^{\circ}$ and were not affected by various ion beam energy.

• Journal of Korean Vacuum Science & Technology
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• v.5 no.1
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• pp.11-18
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• 2001

Dielectric passivation effects on the EM(electromigration) have been a great interest with recent ULSI and multilevel structure tends in thin film interconnections of a microelectronic device. SiO$_2$, PSG(phosphosilicate glass), and Si$_3$N$_4$ passivation materials effects on the EM resistance were investigated by utilizing widely used Al-1%Si thin film interconnections. A standard photolithography process was applied for the fabrication of 0.7㎛ thick 3㎛ wide, and 200㎛ ~1600㎛ long Al-1%Si EM test patterns. SiO$_2$, PSG, and Si$_3$N$_4$ dielectric passivation with the thickness of 300 nm were singly deposited onto the Al-1%Si thin film interconnections by using an APCVD(atmospheric pressure chemical vapor deposition) and a PECVD(plasma enhanced chemical vapor deposition) in order to investigate the passivation materials effects on the EM characteristics. EM tests were performed at the direct current densities of 3.2 $\times$ 10$\^$6/∼4.5 $\times$ 10$\^$6/ A/cm$^2$ and at the temperatures of 180 $\^{C}$, 210$\^{C}$, 240$\^{C}$, and 270$\^{C}$ for measuring the activation energies(Q) and for accelerated test conditions. Activation energies were calculated from the measured MTF(mean-time-to-failure) values. The calculated activation energies for the electromigration were 0.44 eV, 0.45 eV, and 0.50 eV, and 0.66 eV for the case of nonpassivated-, Si$_3$N$_4$passivated-, PSG passivated-, and SiO$_2$ passivated Al-1%Si thin film interconnections, respectively. Thus SiO$_2$ passivation showed the best characteristics on the EM resistance followed by the order of PSG, Si$_3$N$_4$ and nonpassivation. It is believed that the passivation sequences as well as the passivation materials also influence on the EM characteristics in multilevel passivation structures.