• Title/Summary/Keyword: Drain current

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High-Voltage AlGaN/GaN High-Electron-Mobility Transistors Using Thermal Oxidation for NiOx Passivation

  • Kim, Minki;Seok, Ogyun;Han, Min-Koo;Ha, Min-Woo
    • Journal of Electrical Engineering and Technology
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    • v.8 no.5
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    • pp.1157-1162
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    • 2013
  • We proposed AlGaN/GaN high-electron-mobility transistors (HEMTs) using thermal oxidation for NiOx passivation. Auger electron spectroscopy, secondary ion mass spectroscopy, and pulsed I-V were used to study oxidation features. The oxidation process diffused Ni and O into the AlGaN barrier and formed NiOx on the surface. The breakdown voltage of the proposed device was 1520 V while that of the conventional device was 300 V. The gate leakage current of the proposed device was 3.5 ${\mu}A/mm$ and that of the conventional device was 1116.7 ${\mu}A/mm$. The conventional device exhibited similar current in the gate-and-drain-pulsed I-V and its drain-pulsed counterpart. The gate-and-drain-pulsed current of the proposed device was about 56 % of the drain-pulsed current. This indicated that the oxidation process may form deep states having a low emission current, which then suppresses the leakage current. Our results suggest that the proposed process is suitable for achieving high breakdown voltages in the GaN-based devices.

Analysis and Degradation of leakage Current in submicron Device (미세소자에서 누설전류의 분석과 열화)

  • 배지철;이용재
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.11a
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    • pp.113-116
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    • 1996
  • The drain current of the MOSFET in the off state(i.e., Id when Vgs=0V) is undesired but nevertheless important leakage current device parameter in many digital CMOS IC applications (including DRAMs, SRAMs, dynamic logic circuits, and portable systems). The standby power consumed by devices in the off state have added to the total power consumed by the IC, increasing heat dissipation problems in the chip. In this paper, hot-carrier-induced degra- dation and gate-induced-drain-leakage curr- ent under worse case in P-MOSFET\`s have been studied. First of all, the degradation of gate-induced- drain-leakage current due to electron/hole trapping and surface electric field in off state MOSFET\`s which has appeared as an additional constraint in scaling down p-MOSFET\`s. The GIDL current in p-MOSFET\`s was decreased by hot-electron stressing, because the trapped charge were decreased surface-electric-field. But the GIDL current in n-MOS77T\`s under worse case was increased.

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Analytical Model of TFT Drain Current based on Effective Area and Average Velocity (유효면적과 평균속도를 고려한 TFT의 해석적 Drain 전류 모델)

  • Jung, Tae-Hee;Won, Chang-Sub;Ryu, Se-Hwan;Han, Deuk-Young;Ahn, Hyung-Keun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.3
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    • pp.197-202
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    • 2008
  • In this paper, we proposed an analytical model for TFT which has series of the polycrystalline structures. An average speed is defined as carrier speed by the electric field. The effective square is suggested as the area of grain without depletion for the changed grain size. First, physical parameters such as grain size, channel lenght and trap density, have been changed to prove the validity of the average speed model and the value of the effective square has been estimated through drain-source current.

Novel properties of erbium-silicided n-type Schottky barrier metal-oxide-semiconductor field-effect-transistors

  • Jang, Moon-Gyu;Kim, Yark-Yeon;Shin, Jae-Heon;Lee, Seong-Jae;Park, Kyoung-Wan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.2
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    • pp.94-99
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    • 2004
  • silicided 50-nm-gate-length n-type Schottky barrier metal-oxide-semiconductor field-effect-transistors (SB-MOSFETs) with 5 nm gate oxide thickness are manufactured. The saturation current is $120{\mu}A/{\mu}m$ and on/off-current ratio is higher than $10^5$ with low leakage current less than $10{\mu}A/{\mu}m$. Novel phenomena of this device are discussed. The increase of tunneling current with the increase of drain voltage is explained using drain induced Schottky barrier thickness thinning effect. The abnormal increase of drain current with the decrease of gate voltage is explained by hole carrier injection from drain into channel. The mechanism of threshold voltage increase in SB-MOSFETs is discussed. Based on the extracted model parameters, the performance of 10-nm-gate-length SB-MOSFETs is predicted. The results show that the subthreshold swing value can be lower than 60 mV/decade.

Drain-current Modeling of Sub-70-nm PMOSFETs Dependent on Hot-carrier Stress Bias Conditions

  • Lim, In Eui;Jhon, Heesauk;Yoon, Gyuhan;Choi, Woo Young
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.17 no.1
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    • pp.94-100
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    • 2017
  • Stress drain bias dependent current model is proposed for sub-70-nm p-channel metal-oxide semiconductor field-effect transistors (pMOSFETs) under drain-avalanche-hot-carrier (DAHC-) mechanism. The proposed model describes the both on-current and off-current degradation by using two device parameters: channel length variation (${\Delta}L_{ch}$) and threshold voltage shift (${\Delta}V_{th}$). Also, it is a simple and effective model of predicting reliable circuit operation and standby power consumption.

Design and Implementation of Fluid Flow Generation System by using Water Captures (물받이를 이용한 유수발전장치의 설계 및 구현)

  • Son, Young-Dae;Jung, Hyun-Seok
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.61 no.3
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    • pp.413-421
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    • 2012
  • This paper proposes the design and implementation of fluid flow generation system by using polypropylene(PP) water capture, which harvests electric energy from the kinetic energy of tidal current or water flow and drives the desired load, and applies it to the discharge drain of Hadong thermal power plant. This experimental system is composed of water captures, driving wheel, gear trains, 10[kW] synchronous generator, and three phase rectifying circuit which drives lamp load for test. The proposed water capturing system which is composed of water captures, rope and driving wheel, rotates as caterpillar according to water flow. This system is very easy to manufacture and more economical than another type of tidal current turbines such as conventional propeller and helical type. Also, we estimated the available fluid flow energy that can be extracted from the cooling water in discharge drain based on drain's cross-sectional area. Therefore, this paper confirms the validity of proposed fluid flow generation system with water captures and the possibility of its application for renewable energy generation in discharge drain of thermal power plant, from the obtained performance characteristic of this energy conversion system.

Current-Voltage Characteristics of Schottky Barrier SOI nMOS and pMOS at Elevated Temperature (고온에서 Schottky Barier SOI nMOS 및 pMOS의 전류-전압 특성)

  • Ka, Dae-Hyun;Cho, Won-Ju;Yu, Chong-Gun;Park, Jong-Tae
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.4
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    • pp.21-27
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    • 2009
  • In this work, Er-silicided SB-SOI nMOSFET and Pt-silicided SB-SOI pMOSFET have been fabricated to investigate the current-voltage characteristics of Schottky barrier SOI nMOS and pMOS at elevated temperature. The dominant current transport mechanism of SB nMOS and pMOS is discussed using the measurement results of the temperature dependence of drain current with gate voltages. It is observed that the drain current increases with the increase of operating temperature at low gate voltage due to the increase of thermal emission and tunneling current. But the drain current is decreased at high gate voltage due to the decrease of the drift current. It is observed that the ON/Off current ratio is decreased due to the increased tunneling current from the drain to channel region although the ON current is increased at elevated temperature. The threshold voltage variation with temperature is smaller and the subthreshold swing is larger in SB-SOI nMOS and pMOS than in SOI devices or in bulk MOSFETs.

A Dual Gate AlGaN/GaN High Electron Mobility Transistor with High Breakdown Voltages (높은 항복 전압 특성을 가지는 이중 게이트 AlGaN/GaN 고 전자 이동도 트랜지스터)

  • Ha Min-Woo;Lee Seung-Chul;Her Jin-Cherl;Seo Kwang-Seok;Han Min-Koo
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.54 no.1
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    • pp.18-22
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    • 2005
  • We have proposed and fabricated a dual gate AlGaN/GaN high electron mobility transistor (HEMT), which exhibits the low leakage current and the high breakdown voltage for the high voltage switching applications. The additional gate between the main gate and the drain is specially designed in order to decrease the electric field concentration at the drain-side of the main gate. The leakage current of the proposed HEMT is decreased considerably and the breakdown voltage increases without sacrificing any other electric characteristics such as the transconductance and the drain current. The experimental results show that the breakdown voltage and the leakage current of proposed HEMT are 362 V and 75 nA while those of the conventional HEMT are 196 V and 428 nA, respectively.

A Novel Body-tied Silicon-On-Insulator(SOI) n-channel Metal-Oxide-Semiconductor Field-Effect Transistor with Grounded Body Electrode

  • Kang, Won-Gu;Lyu, Jong-Son;Yoo, Hyung-Joun
    • ETRI Journal
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    • v.17 no.4
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    • pp.1-12
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    • 1996
  • A novel body-tied silicon-on-insulator(SOI) n-channel metal-oxide-semiconductor field-effect transistor with grounded body electrode named GBSOI nMOSFET has been developed by wafer bonding and etch-back technology. It has no floating body effect such as kink phenomena on the drain current curves, single-transistor latch and drain current overshoot inherent in a normal SOI device with floating body. We have characterized the interface trap density, kink phenomena on the drain current ($I_{DS}-V_{DS}$) curves, substrate resistance effect on the $I_{DS}-V_{DS}$ curves, subthreshold current characteristics and single transistor latch of these transistors. We have confirmed that the GBSOI structure is suitable for high-speed and low-voltage VLSI circuits.

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Electron transport properties of Y-type zigzag branched carbon nanotubes

  • MaoSheng Ye;HangKong, OuYang;YiNi Lin;Quan Ynag;QingYang Xu;Tao Chen;LiNing Sun;Li Ma
    • Advances in nano research
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    • v.15 no.3
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    • pp.263-275
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    • 2023
  • The electron transport properties of Y-type zigzag branched carbon nanotubes (CNTs) are of great significance for micro and nano carbon-based electronic devices and their interconnection. Based on the semi-empirical method combining tight-binding density functional theory and non-equilibrium Green's function, the electron transport properties between the branches of Y-type zigzag branched CNT are studied. The results show that the drain-source current of semiconducting Y-type zigzag branched CNT (8, 0)-(4, 0)-(4, 0) is cut-off and not affected by the gate voltage in a bias voltage range [-0.5 V, 0.5 V]. The current presents a nonlinear change in a bias voltage range [-1.5 V, -0.5 V] and [0.5 V, 1.5 V]. The tangent slope of the current-voltage curve can be changed by the gate voltage to realize the regulation of the current. The regulation effect under negative bias voltage is more significant. For the larger diameter semiconducting Y-type zigzag branched CNT (10, 0)-(5, 0)-(5, 0), only the value of drain-source current increases due to the larger diameter. For metallic Y-type zigzag branched CNT (12, 0)-(6, 0)-(6, 0), the drain-source current presents a linear change in a bias voltage range [-1.5 V, 1.5 V] and is symmetrical about (0, 0). The slope of current-voltage line can be changed by the gate voltage to realize the regulation of the current. For three kinds of Y-type zigzag branched CNT with different diameters and different conductivity, the current-voltage curve trend changes from decline to rise when the branch of drain-source is exchanged. The current regulation effect of semiconducting Y-type zigzag branched CNT under negative bias voltage is also more significant.