• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.394-394
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• 2012

We fabricated organic-inorganic superlattice films using molecular layer deposition (MLD) and atomic layer deposition (ALD). The MLD is a gas phase process in the vacuum like to atomic layer deposition (ALD) and also relies on a self-terminating surface reaction of organic precursor which results in the formation of a monolayer in each sequence. In the MLD process, 'Alucone' is very famous organic thin film fabricated using MLD. Alucone layers were grown by repeated sequential surface reactions of trimethylaluminum and ethylene glycol at substrate temperature of $80^{\circ}C$. In addition, we developed UV-assisted $Al_2O_3$ with gas diffusion barrier property better than typical $Al_2O_3$. The UV light was very effective to obtain defect-free, high quality $Al_2O_3$ thin film which is determined by water vapor transmission rate (WVTR). Ellipsometry analysis showed a self-limiting surface reaction process and linear growth of each organic, inorganic film. Composition of the organic films was confirmed by infrared (IR) spectroscopy. Ultra-violet (UV) spectroscopy was employed to measure transparency of the organic-inorganic superlattice films. WVTR is calculated by Ca test. Organic-inorganic superlattice films using UV-assisted $Al_2O_3$ and alucone have possible use in gas diffusion barrier for OLED.

• Transactions of the Korean hydrogen and new energy society
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• v.18 no.4
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• pp.422-431
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• 2007

Polymer electrolyte membrane fuel cell(PEMFC) is very interesting power source due to high power density, simple construction and operation at low temperature. But it has problems such as high cost, improvement of performance and effect of temperature. These problems can be approached to be solved by using mathematical models which are useful tools for analysis and optimization of fuel cell performance and for heat and water management. In this paper, the present work is to develop an electrochemical model to examine the electrochemical process inside PEM fuel cell. A complete set of considerations of mass, momentum, species and charge is developed and solved numerically with proper account of electrochemical kinetics. When depth of gas channel becomes thinner, diffusion of reactant makes well into gas diffusion layer(GDL) and the performance increases. Although at low current region there is little voltage difference between experimental data of PEM fuel cell and numerical data. When the porosity size of gas diffusion layer for PEM fuel cell is bigger, oxygen diffusion occurs well and oxygen mass fraction appears high in catalyst layer.

• Journal of the Korean institute of surface engineering
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• v.32 no.1
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• pp.67-77
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• 1999

The Ni base superalloy Mar-M247 substrate was aluminized or aluminized after boronizing by the pack cementation under Ar atmosphere. The hot corrosion resistance and after-heat-treatment effect of aluminized specimens were studied by the cyclic hot corrosion test in $Na_2SO_4$-NaCl molten salt. XRD analysis showed that the $Ni_2Al_3$ phase was formed between the coated layer and substrate below 1273K but the NiAl phase above 1273K. The peak of the NiAl phase was developed after heat treatment. Corrosion test showed that corrosion resistance of the specimen with the NiAl phase was better than that with the $Ni_2Al_3$ phase. Corrosion resistance could be improved by heat treatment to form ductile NiAl phase, where cracks were not formed by thermal shock on coating layer. Moreover, it appeared that heat treatment played a role to improve corrosion resistance of Al diffusion coating above 1273K. The existence of boron in the Al diffusion coating layer obstructed outwared diffusion of Cr from the substrate, and it influenced on corrosion resistance of the coating layer by weakening adherence of the oxide scale.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.5
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• pp.795-801
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• 1994

The BiPbSrCaCuO superconductor was fabricated by diffusion of The dual layer composed of SrS12TCaS11TCuS12TOS1xT in upper layer and BiS12TPbSI0.3TCuS12TOS1yT in lower layer, and varified growh-mechanism of BiPbSrCaCuO superconducting phase. And, we produced optimum conditions of spread volume and each stage of sintering time were upper layer:Lower layer=1:0.2, 1:0.4, 1:0.6 and 24hr., 120hr., 210hr. From the result, the optimum conditions are spread volume(Upper layer:Lower layer=1:0.6), sintering time(210hrs.) at 820$^{\circ}C$.The BiPbSrCaCuO superconductor, fabricated optimum condition, showed zero resistance at critical temperature of 70k.

• Korean Journal of Materials Research
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• v.31 no.2
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• pp.97-100
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• 2021

We report the effect of Standard Clean-1 (SC-1) cleaning to remove residual Ti layers after silicidation to prevent Al diffusion into Si wafer for Ti Schottky barrier diodes (Ti-SBD). Regardless of SC-1 cleaning, the presence of oxygen atoms is confirmed by Auger electron spectroscopy (AES) depth profile analysis between Al and Ti-silicide layers. Al atoms at the interface of Ti-silicide and Si wafer are detected, when the SC-1 cleaning is not conducted after rapid thermal annealing. On the other hand, Al atoms are not found at the interface of Ti-SBD after executing SC-1 cleaning. Al diffusion into the interface between Ti-silicide and Si wafer may be caused by thermal stress at the Ti-silicide layer. The difference of the thermal expansion coefficients of Ti and Ti-silicide gives rise to thermal stress at the interface during the Al layer deposition and sintering processes. Although a longer sintering time is conducted for Ti-SBD, the Al atoms do not diffuse into the surface of the Si wafer. Therefore, the removal of the Ti layer by the SC-1 cleaning can prevent Al diffusion for Ti-SBD.

• Current Photovoltaic Research
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• v.5 no.3
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• pp.83-88
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• 2017

The growth of intermetallic compounds is an important factor in the reliability of solar cells. Especially, the temperature change in the soldering process greatly affects the thickness of the intermetallic compound layer. In this study, we investigated the intermetallic compound growth by Sn-diffusion in solder joints of solar cells. The thickness of the intermetallic compound layer was analyzed by IR lamp power and hot plate temperature control, and the correlation between the intermetallic compound layer and the adhesive strength was confirmed by a $90^{\circ}$ peel test. In order to investigate the growth of the intermetallic compound layer during isothermal aging, the growth of the intermetallic compound layer was analyzed at $85^{\circ}C$ and 85% for 500 h. In addition, the activation energy of Sn was calculated. The diffusion coefficient of the intermetallic compound layer was simulated and compared with experimental results to predict the long-term reliability.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.2
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• pp.65-73
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• 2012

The Gas Diffusion Layer (GDL) of fuel cell, are required to provide both delivery of reactant gases to the catalyst layer and removal of water in either vapor or liquid form in typical PEMFCs. In this study, the fabrication of GDL containing Micro Porous Layer (MPL) made of the slurry of PVDF mixed with carbon black is investigated in detail. Physical properties of GDL containing MPL, such as electrical resistance, gas permeability and microstructure were examined, and the performance of the cell using developed GDL with MPL was evaluated. The results show that MPL with PVDF binder demonstrated uniformly distributed microstructure without large cracks and pores, which resulted in better electrical conductivity. The fuel cell performance test demonstrates that the developed GDL with MPL has a great potential due to enhanced mass transport property due to its porous structure and small pore size.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.2
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• pp.55-58
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• 2003

This paper examines the electrical characteristic of single oxide layer due to various diffusion conditions, substrate orientations, substrate resistivity and gas atmosphere in a diffusion furnace. The oxide quality was examined through the capacitance-voltage characteristic due to the annealing time after oxidation process, and the capacitance-voltage characteristics of the single oxide layer by will be described via semiconductor device simulation.

• Atmosphere
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• v.14 no.3
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• pp.29-40
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• 2004

It is well known that convections and fronts are the most effective weather systems for the vertical transport of pollutants. I used a two dimensional front model in order to investigate the mechanism of the vertical transport of atmospheric pollutants between planetary boundary layer(PBL) and free atmosphere by fronts. The main dynamic processes which contribute the vertical transport of pollutants are advection and diffusion. The transported amount of pollutant from the boundary layer to the free atmosphere increases dramatically during the developing stage of the front. 46% of pollutants are transported vertically within 12 hour and 54% are transported within 24 hour. In the meantime, compared to the total amount of pollutants transported by both advection and diffusion, about 25% (30%) less pollutants are transported when only advection (diffusion) process in included in the model. The most important mechanism for the vertical transport is vertical advection, while the vertical diffusion process plays an important role in the redistribution of pollutants in the PBL.

• Journal of Welding and Joining
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• v.32 no.4
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• pp.46-54
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• 2014

In this study, the effect of bonding temperature and bonding pressure on deformation and tensile properties of diffusion bonded joint of STS304 compact heat exchanger was investigated. The diffusion bonds were prepared at 700, 800 and $900^{\circ}C$ for 30, 60 and 90 min in pressure of 3, 5, and 7 MPa under high vacuum condition. The height deformation of joint decreased and the width deformation of joint increased with increasing bonding pressure at $900^{\circ}C$. The ratio of non-bonded layer and void observed in the joint decreased with increasing bonding temperature and bonding pressure. Three types of the fracture surface were observed after tensile test. The non-bonded layer was observed in diffusion bonded joint preformed at $700^{\circ}C$, the non-bonded layer and void were observed at $800^{\circ}C$. On the other hand, the ductile fracture occurred in diffusion bonded joint preformed at $900^{\circ}C$. Tensile load of joint bonded at $800^{\circ}C$ was proportional to length of bonded layer and tensile load of joint bonded at $900^{\circ}C$ was proportional to minimum width of pattern. The tensile strength of joint was same as base metal.