• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.206-207
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• 2006

This paper describes the dielectric analysis of several insulators for home appliances. The dielectric characteristics of ABS(acrylonitrile butadiene styrene) were tested in relative permittivity, dielectric loss($tan{\delta}$) and specific resistance and compared with those of the other 4 insulators of PE(polyethylene) series. As a result, the relative permittivity of only the ABS slightly decreased with temperature. In the case of the tan6, the ABS showed higher dielectric loss than the other insulators but more excellent thermal performance. In addition, its changing pattern in specific resistance was very similar to that in $tan{\delta}$.

• Journal of the Korean Wood Science and Technology
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• v.47 no.1
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• pp.40-50
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• 2019

The aim of this study was to investigate the effects of density, temperature, size, and grain direction on measurement of moisture contents (MC) of wood materials non-destructively. The MC of different sizes of solid wood, glulam, and CLT from larch (larix kaempferi, $560kg/m^3$) and pine (pinus koraiensis, $430kg/m^3$) were measured using the dielectric type and resistance type meters. The specimens were conditioned in the environmental chamber to be equilibrium moisture content (EMC) of 12 % and 19 %. When density setting in dielectric type meter was increased from $400kg/m^3$ to $600kg/m^3$, the MCs of specimen (S-L-100-E) were decreased from 13.4 % to 11.3 %. However, when wood group (WG) setting in resistance type meter was changed from WG1 to WG4, the measured MCs were increased from 9.2 % to 12.3 %. When temperature setting in resistance type meters was changed from 0 to $35^{\circ}C$, the MC was decreased from 17.0 % to 13.0 %. The MCs measured by dielectric type meter for larger specimens (S-L-100-E_11.3 %, G-L-240-E_11.7 % and C-L-120-E_12.8 %) were higher than those of small size specimens (S-L-30-E_8.7 %, G-L-150-E_10.3 %, and C-L-90-E_9.7 %). The MCs measured by resistance type meter for larger specimens (G-L-240-E_11.6 % and C-L-120-E_13.3 %) were also higher than those of small size specimens (G-L-150-E_10.4 %, and C-L-90-E_11.8 %). The resistance type meter was not affected by the grain direction but the dielectric type meter were affected by the grain direction. The MC measured by resistance type meter for G-L-120-E perpendicular to grain direction was 11.5 % and the measured MC parallel to grain direction was 11.3 %. The MC measured by dielectric type meter parallel to grain direction (12.1 %) was higher than that measured perpendicular to grain direction (10.7 %).

• 전기의세계
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• v.30 no.10
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• pp.639-644
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• 1981

PVC is a kind of electric insulation polymer. But we get some deteriorations in electrical characteristics of the PVC, when it is used on the radioactive field. In order to find out the cause of the deterioration, we investigate the surface-resistance, volume-resistance, dielectric constant and dielectric loss angle of the soft and hard PVC which is irradiated by the Co$^{60}$ .gamma. radioactivity. From the experiment, we can conclude the followings 1. Radio-activity proof characteristic in the soft PVC is stronger than in the hard PVC. 2. The resistance of PVC which is irradiated by the radio-activity decrease exponentially. 3. The dielectric constant and the dielectric loss angle of PVC irradiated by Co$^{60}$ .gamma.ray reach maximum value in first few time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.451-454
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• 2002

A silicone rubber has been used so many dielectric materials for extremely high voltage(EBW) electric appliances. The reason why it is very stable in the thermal, mechanical and electrical environment. In this paper, we have studied the dependence of dielectric characteristics of silicone rubber on frequency-dependent variation. The dielectric characteristics were measured in the temperature range of 25[$^{\circ}C$] and 150[$^{\circ}C$]. Also we measured in the voltage range of 1[V] and 20[V]. The energy of activation on the dielectric loss obtained 2.44[kcal/mol], 2.1[kcal/mol], 1.63[kcal/mol] and 1.57[kcal/mol] by appling respectively.

• Transactions on Electrical and Electronic Materials
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• v.14 no.1
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• pp.43-46
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• 2013

In order to develop electrical insulation material, organically modified layered silicate was incorporated into an epoxy matrix to prepare nanocomposite. Transmission electron microscopy (TEM) observation showed that organophillic clay was in an exfoliated state, while hydrophilic clay was not dispersed into nanolayers within the epoxy matrix. Epoxy/organophilic clay (2.8 wt%) nanocomposite was mixed and cured at $150^{\circ}C$ for 4.5 hr. I-V characteristics, volume resistance and dielectric properties for the cured nanocomposite were estimated. Current density increased with increasing temperature, and volume resistance decreased with increasing temperature, in neat epoxy and epoxy/organophilic clay (2.8 wt%) nanocomposite. As frequency increased, the dielectric loss value decreased in the two systems.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.57-67
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• 2002

Increased signal speed can be obtained in three ways: changing the layout and/or the ratio of the width to thickness of the metal lines, decreasing the specific resistance of the interconnect metal, and decreasing the dielectric constant of the insulating material (intermetal dielectric). Further advancement cannot be expected from changing layout or decreasing specific resistance. The only alternative is to use an insulating material with a lower dielectric constant than other ones used presently. A large variety of polymers has been proposed for use as materials with low dielectric constants for applications in microelectronics. In this review, the properties of selected polymers as well as various fabrication methods for polymer thin films are discussed. Based on the properties described so far, and the requirements for applications as intermetal dielectric material, the possibilities for further developments also are discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.6
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• pp.495-500
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• 2009

The ceramic($BaTiO_3$)-polymer(epoxy) composites have been widely investigated as dielectric materials for embedded capacitors in printed circuit boards (PCBs). The dielectric properties of $BaTiO_3$/epoxy composites prepared using the agglomerated $BaTiO_3$ particles were investigated in the present study. The dielectric constants of the composites prepared using the agglomerated $BaTiO_3$ particles were about 2 times higher than those of the composites with the dispersed $BaTiO_3$ particles. The insulation resistance of the composites prepared using the agglomerated $BaTiO_3$ particles were lower than those of the composites with dispersed $BaTiO_3$ particles. As a result, there is tradeoff between high dielectric constant and insulation resistance in the $BaTiO_3$/epoxy composites. So it is important to select proper agglomerated or dispersed $BaTiO_3$ particles in accordance with needs.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1432-1435
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• 1998

Influences of carbon black contents on the tracking resistance, tan $\delta$ and dielectric constant volume resistivity and dielectric strength of EPDM compounds before and after a exposure to UV radiation were investigated. Carbon black content up to 1.5 phr have a positive effect to improve the resistance to tracking and erosion, since carbon black diminish the leakage current. Results from the study reveal that both tan $\delta$ and dielectric constant volume resistivity and dielectric strength are unaffected by adding of carbon black up to 2.0 phr and carbon black have a significant effect to suppress the photo-degradation of EPDM compounds.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.2
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• pp.118-123
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• 2007

The purpose of this work was to investigate the design and fabrication process effects on electrical properties in high capacitance multilayer ceramic capacitor (MLCC) with nickel electrode. Dielectric breakdown voltage and insulation resistance value were decreased with increasing stack layer number, but dielectric constant and capacitance were increased. With increasing green sheet thickness, dielectric breakdown voltage, C-V and I-V properties were also increased. The major reasons of the effects were thought to be the defects generated extrinsically during fabrication process and interfacial reactions formed between nickel electrode and dielectric layer. These investigations clearly showed the influence of both green sheet thick ness and stack layer number on the electrical properties in fabricating the MLCC.

• Journal of the Korean Ceramic Society
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• v.49 no.2
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• pp.179-184
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• 2012

The size of various alumina ceramics used in semiconductor and display industry is required to increase with increase in wafer and panel size. In this research, large alumina ceramics were fabricated by uniaxial pressing, cold isostatic pressing and filter pressing with commercial powder and thereafter sintering at $1600^{\circ}C$ in gas furnace. The large alumina ceramics exhibited dense microstructure corresponding to 98.5% of theoretical density and 99.8% of high purity. The impurities and microstructural defects of the alumina were found to influence the resistance and dielectric properties. The volume resistances in these four aluminas were almost the same while the pure alumina was higher value. The dielectric constant, dielectric loss and dielectric strength of aluminas were placed within the range of 10.3~11.5, 0.018~0.036, and 10.1~12.4 kV/mm, respectively.